KR900013101A - 저압 증기상 성장장치 - Google Patents
저압 증기상 성장장치 Download PDFInfo
- Publication number
- KR900013101A KR900013101A KR1019900001259A KR900001259A KR900013101A KR 900013101 A KR900013101 A KR 900013101A KR 1019900001259 A KR1019900001259 A KR 1019900001259A KR 900001259 A KR900001259 A KR 900001259A KR 900013101 A KR900013101 A KR 900013101A
- Authority
- KR
- South Korea
- Prior art keywords
- gas
- substrate
- light
- low pressure
- vapor phase
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/46—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/48—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating by irradiation, e.g. photolysis, radiolysis, particle radiation
- C23C16/481—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating by irradiation, e.g. photolysis, radiolysis, particle radiation by radiant heating of the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 저압증기상 성장장치의 실시예의 개략단면도. 제2도는 종래의 저압증기상 성장장치의 개략단면도.
Claims (2)
- 투광성물질로 만들어진 창, 반응성 기체를 공급하기 위한 기체공급기, 화학반응후 기체를 뿜어내기 위한 배출기, 복사선을 방출하여 상기 투광성창을 통해 투과되도록 하는 기판의 복사가열을 실행하기 위한 램프 및 상기 투광성 창을 강제 냉각시키기 위한 냉각 메카니즘으로 이루어지는 저압증기상 성장장치에 있어서, 상기 기판과 상기 투광성창은 그들간의 틈이 기껏해야 이틈에 존재하는 기체의 평규자유행로의 폭을 가지면서 상호 접촉없이 유지되며, 상기 기체공급기를 통해 공급된 상기 반응성 기체가 상기 기판의 겉 표면에서 상기 화학반응을 당하여 거기에 박막을 형성하는 것을 특징으로 하는 장치.
- 제1항에 있어서, 상기 틈에 존재하는 상기 기체로서 비활성 기체가 사용되는 것을 특징으로 하는 장치.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1-34826 | 1989-02-14 | ||
JP1034826A JP2731855B2 (ja) | 1989-02-14 | 1989-02-14 | 減圧気相成長装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR900013101A true KR900013101A (ko) | 1990-09-03 |
KR920007848B1 KR920007848B1 (ko) | 1992-09-18 |
Family
ID=12425006
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019900001259A KR920007848B1 (ko) | 1989-02-14 | 1990-02-02 | 저압증기상 성장장치 |
Country Status (4)
Country | Link |
---|---|
US (1) | US5033407A (ko) |
EP (1) | EP0383491A3 (ko) |
JP (1) | JP2731855B2 (ko) |
KR (1) | KR920007848B1 (ko) |
Families Citing this family (55)
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US5308594A (en) * | 1985-12-04 | 1994-05-03 | Massachusetts Institute Of Technology | Edge-heat-sink technique for zone melting recrystallization of semiconductor-on-insulator films |
US5296089A (en) * | 1985-12-04 | 1994-03-22 | Massachusetts Institute Of Technology | Enhanced radiative zone-melting recrystallization method and apparatus |
US5094885A (en) * | 1990-10-12 | 1992-03-10 | Genus, Inc. | Differential pressure cvd chuck |
US5447570A (en) * | 1990-04-23 | 1995-09-05 | Genus, Inc. | Purge gas in wafer coating area selection |
US5620525A (en) * | 1990-07-16 | 1997-04-15 | Novellus Systems, Inc. | Apparatus for supporting a substrate and introducing gas flow doximate to an edge of the substrate |
US5578532A (en) * | 1990-07-16 | 1996-11-26 | Novellus Systems, Inc. | Wafer surface protection in a gas deposition process |
US5843233A (en) * | 1990-07-16 | 1998-12-01 | Novellus Systems, Inc. | Exclusion guard and gas-based substrate protection for chemical vapor deposition apparatus |
US5230741A (en) * | 1990-07-16 | 1993-07-27 | Novellus Systems, Inc. | Gas-based backside protection during substrate processing |
US5133284A (en) * | 1990-07-16 | 1992-07-28 | National Semiconductor Corp. | Gas-based backside protection during substrate processing |
US5252132A (en) * | 1990-11-22 | 1993-10-12 | Mitsubishi Denki Kabushiki Kaisha | Apparatus for producing semiconductor film |
US5855687A (en) * | 1990-12-05 | 1999-01-05 | Applied Materials, Inc. | Substrate support shield in wafer processing reactors |
US5304248A (en) * | 1990-12-05 | 1994-04-19 | Applied Materials, Inc. | Passive shield for CVD wafer processing which provides frontside edge exclusion and prevents backside depositions |
US5101764A (en) * | 1991-02-20 | 1992-04-07 | Texas Instruments Incorporated | Method and apparatus for integrating optical sensor into processor |
JPH069297A (ja) * | 1991-12-09 | 1994-01-18 | Sumitomo Electric Ind Ltd | 成膜装置 |
FR2686967B1 (fr) * | 1992-02-04 | 1999-04-09 | France Telecom | Dispositif de refroidissement d'un four de traitement d'un element et four equipe d'un tel dispositif. |
JPH0811718B2 (ja) * | 1992-02-27 | 1996-02-07 | 大同ほくさん株式会社 | ガスソース分子線エピタキシー装置 |
US5534072A (en) * | 1992-06-24 | 1996-07-09 | Anelva Corporation | Integrated module multi-chamber CVD processing system and its method for processing subtrates |
US5534069A (en) * | 1992-07-23 | 1996-07-09 | Canon Kabushiki Kaisha | Method of treating active material |
JP3604706B2 (ja) * | 1992-07-23 | 2004-12-22 | キヤノン株式会社 | 成膜方法 |
US5318801A (en) * | 1993-05-18 | 1994-06-07 | United States Of America As Represented By The Secretary Of The Navy | Substrate temperature control apparatus and technique for CVD reactors |
FR2734284B1 (fr) * | 1995-05-19 | 1997-06-13 | Commissariat Energie Atomique | Dispositif de traitement chimique superficiel d'un echantillon plat au moyen d'un gaz actif |
US6086680A (en) * | 1995-08-22 | 2000-07-11 | Asm America, Inc. | Low-mass susceptor |
US6113702A (en) | 1995-09-01 | 2000-09-05 | Asm America, Inc. | Wafer support system |
AU6962196A (en) | 1995-09-01 | 1997-03-27 | Advanced Semiconductor Materials America, Inc. | Wafer support system |
US5894887A (en) * | 1995-11-30 | 1999-04-20 | Applied Materials, Inc. | Ceramic dome temperature control using heat pipe structure and method |
US6090211A (en) * | 1996-03-27 | 2000-07-18 | Matsushita Electric Industrial Co., Ltd. | Apparatus and method for forming semiconductor thin layer |
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US5960158A (en) | 1997-07-11 | 1999-09-28 | Ag Associates | Apparatus and method for filtering light in a thermal processing chamber |
US6073366A (en) * | 1997-07-11 | 2000-06-13 | Asm America, Inc. | Substrate cooling system and method |
KR100660416B1 (ko) * | 1997-11-03 | 2006-12-22 | 에이에스엠 아메리카, 인코포레이티드 | 개량된 저질량 웨이퍼 지지 시스템 |
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US20030168174A1 (en) * | 2002-03-08 | 2003-09-11 | Foree Michael Todd | Gas cushion susceptor system |
US6776849B2 (en) * | 2002-03-15 | 2004-08-17 | Asm America, Inc. | Wafer holder with peripheral lift ring |
US6861321B2 (en) | 2002-04-05 | 2005-03-01 | Asm America, Inc. | Method of loading a wafer onto a wafer holder to reduce thermal shock |
CN100437894C (zh) | 2002-09-10 | 2008-11-26 | 亚舍立技术有限公司 | 利用固定温度的卡盘以可变温度的工艺加热衬底的方法 |
US20050170314A1 (en) * | 2002-11-27 | 2005-08-04 | Richard Golden | Dental pliers design with offsetting jaw and pad elements for assisting in removing upper and lower teeth and method for removing teeth utilizing the dental plier design |
US20050037521A1 (en) * | 2003-08-15 | 2005-02-17 | Uwe Wellhausen | Methods and apparatus for processing semiconductor devices by gas annealing |
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EP2495212A3 (en) * | 2005-07-22 | 2012-10-31 | QUALCOMM MEMS Technologies, Inc. | Mems devices having support structures and methods of fabricating the same |
US7763869B2 (en) * | 2007-03-23 | 2010-07-27 | Asm Japan K.K. | UV light irradiating apparatus with liquid filter |
US8092606B2 (en) | 2007-12-18 | 2012-01-10 | Asm Genitech Korea Ltd. | Deposition apparatus |
US8801857B2 (en) * | 2008-10-31 | 2014-08-12 | Asm America, Inc. | Self-centering susceptor ring assembly |
USD914620S1 (en) | 2019-01-17 | 2021-03-30 | Asm Ip Holding B.V. | Vented susceptor |
US11961756B2 (en) | 2019-01-17 | 2024-04-16 | Asm Ip Holding B.V. | Vented susceptor |
USD920936S1 (en) | 2019-01-17 | 2021-06-01 | Asm Ip Holding B.V. | Higher temperature vented susceptor |
TW202110587A (zh) | 2019-05-22 | 2021-03-16 | 荷蘭商Asm Ip 控股公司 | 工件基座主體及用於沖洗工件基座的方法 |
US11764101B2 (en) | 2019-10-24 | 2023-09-19 | ASM IP Holding, B.V. | Susceptor for semiconductor substrate processing |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4913929A (en) * | 1987-04-21 | 1990-04-03 | The Board Of Trustees Of The Leland Stanford Junior University | Thermal/microwave remote plasma multiprocessing reactor and method of use |
DE3883878T2 (de) * | 1987-07-16 | 1994-01-05 | Texas Instruments Inc | Behandlungsapparat und Verfahren. |
-
1989
- 1989-02-14 JP JP1034826A patent/JP2731855B2/ja not_active Expired - Fee Related
-
1990
- 1990-02-02 KR KR1019900001259A patent/KR920007848B1/ko not_active IP Right Cessation
- 1990-02-07 US US07/477,255 patent/US5033407A/en not_active Expired - Lifetime
- 1990-02-08 EP EP19900301366 patent/EP0383491A3/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
JPH02213477A (ja) | 1990-08-24 |
EP0383491A2 (en) | 1990-08-22 |
JP2731855B2 (ja) | 1998-03-25 |
US5033407A (en) | 1991-07-23 |
KR920007848B1 (ko) | 1992-09-18 |
EP0383491A3 (en) | 1990-11-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
G160 | Decision to publish patent application | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20090910 Year of fee payment: 18 |
|
EXPY | Expiration of term |