KR900013101A - 저압 증기상 성장장치 - Google Patents

저압 증기상 성장장치 Download PDF

Info

Publication number
KR900013101A
KR900013101A KR1019900001259A KR900001259A KR900013101A KR 900013101 A KR900013101 A KR 900013101A KR 1019900001259 A KR1019900001259 A KR 1019900001259A KR 900001259 A KR900001259 A KR 900001259A KR 900013101 A KR900013101 A KR 900013101A
Authority
KR
South Korea
Prior art keywords
gas
substrate
light
low pressure
vapor phase
Prior art date
Application number
KR1019900001259A
Other languages
English (en)
Other versions
KR920007848B1 (ko
Inventor
시게루 미즈노
이사무 모리사꼬
Original Assignee
야스다 스스무
니찌덴 아넬바 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 야스다 스스무, 니찌덴 아넬바 가부시끼가이샤 filed Critical 야스다 스스무
Publication of KR900013101A publication Critical patent/KR900013101A/ko
Application granted granted Critical
Publication of KR920007848B1 publication Critical patent/KR920007848B1/ko

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/46Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/48Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating by irradiation, e.g. photolysis, radiolysis, particle radiation
    • C23C16/481Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating by irradiation, e.g. photolysis, radiolysis, particle radiation by radiant heating of the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Chemical Vapour Deposition (AREA)

Abstract

내용 없음

Description

저압 증기상 성장장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 저압증기상 성장장치의 실시예의 개략단면도. 제2도는 종래의 저압증기상 성장장치의 개략단면도.

Claims (2)

  1. 투광성물질로 만들어진 창, 반응성 기체를 공급하기 위한 기체공급기, 화학반응후 기체를 뿜어내기 위한 배출기, 복사선을 방출하여 상기 투광성창을 통해 투과되도록 하는 기판의 복사가열을 실행하기 위한 램프 및 상기 투광성 창을 강제 냉각시키기 위한 냉각 메카니즘으로 이루어지는 저압증기상 성장장치에 있어서, 상기 기판과 상기 투광성창은 그들간의 틈이 기껏해야 이틈에 존재하는 기체의 평규자유행로의 폭을 가지면서 상호 접촉없이 유지되며, 상기 기체공급기를 통해 공급된 상기 반응성 기체가 상기 기판의 겉 표면에서 상기 화학반응을 당하여 거기에 박막을 형성하는 것을 특징으로 하는 장치.
  2. 제1항에 있어서, 상기 틈에 존재하는 상기 기체로서 비활성 기체가 사용되는 것을 특징으로 하는 장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019900001259A 1989-02-14 1990-02-02 저압증기상 성장장치 KR920007848B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1-34826 1989-02-14
JP1034826A JP2731855B2 (ja) 1989-02-14 1989-02-14 減圧気相成長装置

Publications (2)

Publication Number Publication Date
KR900013101A true KR900013101A (ko) 1990-09-03
KR920007848B1 KR920007848B1 (ko) 1992-09-18

Family

ID=12425006

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019900001259A KR920007848B1 (ko) 1989-02-14 1990-02-02 저압증기상 성장장치

Country Status (4)

Country Link
US (1) US5033407A (ko)
EP (1) EP0383491A3 (ko)
JP (1) JP2731855B2 (ko)
KR (1) KR920007848B1 (ko)

Families Citing this family (55)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5308594A (en) * 1985-12-04 1994-05-03 Massachusetts Institute Of Technology Edge-heat-sink technique for zone melting recrystallization of semiconductor-on-insulator films
US5296089A (en) * 1985-12-04 1994-03-22 Massachusetts Institute Of Technology Enhanced radiative zone-melting recrystallization method and apparatus
US5094885A (en) * 1990-10-12 1992-03-10 Genus, Inc. Differential pressure cvd chuck
US5447570A (en) * 1990-04-23 1995-09-05 Genus, Inc. Purge gas in wafer coating area selection
US5620525A (en) * 1990-07-16 1997-04-15 Novellus Systems, Inc. Apparatus for supporting a substrate and introducing gas flow doximate to an edge of the substrate
US5578532A (en) * 1990-07-16 1996-11-26 Novellus Systems, Inc. Wafer surface protection in a gas deposition process
US5843233A (en) * 1990-07-16 1998-12-01 Novellus Systems, Inc. Exclusion guard and gas-based substrate protection for chemical vapor deposition apparatus
US5230741A (en) * 1990-07-16 1993-07-27 Novellus Systems, Inc. Gas-based backside protection during substrate processing
US5133284A (en) * 1990-07-16 1992-07-28 National Semiconductor Corp. Gas-based backside protection during substrate processing
US5252132A (en) * 1990-11-22 1993-10-12 Mitsubishi Denki Kabushiki Kaisha Apparatus for producing semiconductor film
US5855687A (en) * 1990-12-05 1999-01-05 Applied Materials, Inc. Substrate support shield in wafer processing reactors
US5304248A (en) * 1990-12-05 1994-04-19 Applied Materials, Inc. Passive shield for CVD wafer processing which provides frontside edge exclusion and prevents backside depositions
US5101764A (en) * 1991-02-20 1992-04-07 Texas Instruments Incorporated Method and apparatus for integrating optical sensor into processor
JPH069297A (ja) * 1991-12-09 1994-01-18 Sumitomo Electric Ind Ltd 成膜装置
FR2686967B1 (fr) * 1992-02-04 1999-04-09 France Telecom Dispositif de refroidissement d'un four de traitement d'un element et four equipe d'un tel dispositif.
JPH0811718B2 (ja) * 1992-02-27 1996-02-07 大同ほくさん株式会社 ガスソース分子線エピタキシー装置
US5534072A (en) * 1992-06-24 1996-07-09 Anelva Corporation Integrated module multi-chamber CVD processing system and its method for processing subtrates
US5534069A (en) * 1992-07-23 1996-07-09 Canon Kabushiki Kaisha Method of treating active material
JP3604706B2 (ja) * 1992-07-23 2004-12-22 キヤノン株式会社 成膜方法
US5318801A (en) * 1993-05-18 1994-06-07 United States Of America As Represented By The Secretary Of The Navy Substrate temperature control apparatus and technique for CVD reactors
FR2734284B1 (fr) * 1995-05-19 1997-06-13 Commissariat Energie Atomique Dispositif de traitement chimique superficiel d'un echantillon plat au moyen d'un gaz actif
US6086680A (en) * 1995-08-22 2000-07-11 Asm America, Inc. Low-mass susceptor
US6113702A (en) 1995-09-01 2000-09-05 Asm America, Inc. Wafer support system
AU6962196A (en) 1995-09-01 1997-03-27 Advanced Semiconductor Materials America, Inc. Wafer support system
US5894887A (en) * 1995-11-30 1999-04-20 Applied Materials, Inc. Ceramic dome temperature control using heat pipe structure and method
US6090211A (en) * 1996-03-27 2000-07-18 Matsushita Electric Industrial Co., Ltd. Apparatus and method for forming semiconductor thin layer
US5837058A (en) * 1996-07-12 1998-11-17 Applied Materials, Inc. High temperature susceptor
US5960158A (en) 1997-07-11 1999-09-28 Ag Associates Apparatus and method for filtering light in a thermal processing chamber
US6073366A (en) * 1997-07-11 2000-06-13 Asm America, Inc. Substrate cooling system and method
KR100660416B1 (ko) * 1997-11-03 2006-12-22 에이에스엠 아메리카, 인코포레이티드 개량된 저질량 웨이퍼 지지 시스템
US5930456A (en) 1998-05-14 1999-07-27 Ag Associates Heating device for semiconductor wafers
US5970214A (en) 1998-05-14 1999-10-19 Ag Associates Heating device for semiconductor wafers
US6210484B1 (en) 1998-09-09 2001-04-03 Steag Rtp Systems, Inc. Heating device containing a multi-lamp cone for heating semiconductor wafers
US6108937A (en) * 1998-09-10 2000-08-29 Asm America, Inc. Method of cooling wafers
US6957690B1 (en) 1998-09-10 2005-10-25 Asm America, Inc. Apparatus for thermal treatment of substrates
US6143079A (en) * 1998-11-19 2000-11-07 Asm America, Inc. Compact process chamber for improved process uniformity
JP4625183B2 (ja) * 1998-11-20 2011-02-02 ステアーグ アール ティ ピー システムズ インコーポレイテッド 半導体ウェハのための急速加熱及び冷却装置
AU5448200A (en) 1999-05-27 2000-12-18 Matrix Integrated Systems, Inc. Rapid heating and cooling of workpiece chucks
US6259062B1 (en) 1999-12-03 2001-07-10 Asm America, Inc. Process chamber cooling
US20030168174A1 (en) * 2002-03-08 2003-09-11 Foree Michael Todd Gas cushion susceptor system
US6776849B2 (en) * 2002-03-15 2004-08-17 Asm America, Inc. Wafer holder with peripheral lift ring
US6861321B2 (en) 2002-04-05 2005-03-01 Asm America, Inc. Method of loading a wafer onto a wafer holder to reduce thermal shock
CN100437894C (zh) 2002-09-10 2008-11-26 亚舍立技术有限公司 利用固定温度的卡盘以可变温度的工艺加热衬底的方法
US20050170314A1 (en) * 2002-11-27 2005-08-04 Richard Golden Dental pliers design with offsetting jaw and pad elements for assisting in removing upper and lower teeth and method for removing teeth utilizing the dental plier design
US20050037521A1 (en) * 2003-08-15 2005-02-17 Uwe Wellhausen Methods and apparatus for processing semiconductor devices by gas annealing
US20060240680A1 (en) * 2005-04-25 2006-10-26 Applied Materials, Inc. Substrate processing platform allowing processing in different ambients
EP2495212A3 (en) * 2005-07-22 2012-10-31 QUALCOMM MEMS Technologies, Inc. Mems devices having support structures and methods of fabricating the same
US7763869B2 (en) * 2007-03-23 2010-07-27 Asm Japan K.K. UV light irradiating apparatus with liquid filter
US8092606B2 (en) 2007-12-18 2012-01-10 Asm Genitech Korea Ltd. Deposition apparatus
US8801857B2 (en) * 2008-10-31 2014-08-12 Asm America, Inc. Self-centering susceptor ring assembly
USD914620S1 (en) 2019-01-17 2021-03-30 Asm Ip Holding B.V. Vented susceptor
US11961756B2 (en) 2019-01-17 2024-04-16 Asm Ip Holding B.V. Vented susceptor
USD920936S1 (en) 2019-01-17 2021-06-01 Asm Ip Holding B.V. Higher temperature vented susceptor
TW202110587A (zh) 2019-05-22 2021-03-16 荷蘭商Asm Ip 控股公司 工件基座主體及用於沖洗工件基座的方法
US11764101B2 (en) 2019-10-24 2023-09-19 ASM IP Holding, B.V. Susceptor for semiconductor substrate processing

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4913929A (en) * 1987-04-21 1990-04-03 The Board Of Trustees Of The Leland Stanford Junior University Thermal/microwave remote plasma multiprocessing reactor and method of use
DE3883878T2 (de) * 1987-07-16 1994-01-05 Texas Instruments Inc Behandlungsapparat und Verfahren.

Also Published As

Publication number Publication date
JPH02213477A (ja) 1990-08-24
EP0383491A2 (en) 1990-08-22
JP2731855B2 (ja) 1998-03-25
US5033407A (en) 1991-07-23
KR920007848B1 (ko) 1992-09-18
EP0383491A3 (en) 1990-11-28

Similar Documents

Publication Publication Date Title
KR900013101A (ko) 저압 증기상 성장장치
EP0255454A3 (en) Apparatus for chemical vapor deposition
AR010997A1 (es) Un proceso para la produccion selectiva de para-xileno y un metodo para producir un catalizador para ser usado en dicho proceso.
SE7702999L (sv) Sett att festa bilder
AR015749A1 (es) Proceso para producir olefinas livianas
DK139485D0 (da) Flydende overtraekspraeparat som er haerdeligt ved omgivelsernes temperatur
JPS5749579A (en) Thermal printer head
DE68920323D1 (de) Projektionstransparent aus wärmeschmelzbaren tinten.
SE8302514L (sv) Bestrykningsanordning
AR002901A1 (es) Proceso para cristalizacion de poli(etilennaftalen dicarboxilato)
FR2434476A1 (fr) Procede de fabrication d'un ensemble de cathode chauffe indirectement
JPS5472847A (en) Method of conveying web
JPS5681923A (en) Manufacture of thin film
JPS5483971A (en) Crosslinked olefinic resin film having improved heat sealability
KR830007431A (ko) 규산(珪酸) 소오다의 제조방법과 그 장치
JPS52129296A (en) Thin film light emitting element
JPS52152242A (en) Thermal element for typing
BR7900949A (pt) Processo para a producao de um gas de aquecimento contendo metano,mediante reacao de metanol,evaporado,com vapor de agua
KR860006824A (ko) 음극선관
JPS6425985A (en) Reduced-pressure vapor growing device
JPS52103882A (en) Incandescent electric lamp
JPS52114632A (en) Pressure sensitive adhesive tape or sheet
JPS559838A (en) Printing device
JPS5254388A (en) Light emitting diode
SU638497A1 (ru) Устройство дл оклейки стен пленочным материалом с клеевым слоем

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20090910

Year of fee payment: 18

EXPY Expiration of term