KR900013013A - 경화성 및 유전성 폴리페닐렌 에테르-폴리에폭시드 조성물 - Google Patents
경화성 및 유전성 폴리페닐렌 에테르-폴리에폭시드 조성물 Download PDFInfo
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- KR900013013A KR900013013A KR1019900001896A KR900001896A KR900013013A KR 900013013 A KR900013013 A KR 900013013A KR 1019900001896 A KR1019900001896 A KR 1019900001896A KR 900001896 A KR900001896 A KR 900001896A KR 900013013 A KR900013013 A KR 900013013A
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- 239000000203 mixture Substances 0.000 title claims 24
- 229920000647 polyepoxide Polymers 0.000 title claims 4
- 229920000265 Polyparaphenylene Polymers 0.000 title 1
- -1 Polyphenylene Polymers 0.000 title 1
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims 6
- 125000000217 alkyl group Chemical group 0.000 claims 5
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims 4
- 239000000758 substrate Substances 0.000 claims 4
- 229930185605 Bisphenol Natural products 0.000 claims 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Natural products CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims 2
- LJCFOYOSGPHIOO-UHFFFAOYSA-N antimony pentoxide Chemical compound O=[Sb](=O)O[Sb](=O)=O LJCFOYOSGPHIOO-UHFFFAOYSA-N 0.000 claims 2
- 125000003118 aryl group Chemical group 0.000 claims 2
- 125000000732 arylene group Chemical group 0.000 claims 2
- 239000003365 glass fiber Substances 0.000 claims 2
- 125000001188 haloalkyl group Chemical group 0.000 claims 2
- 125000005843 halogen group Chemical group 0.000 claims 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims 2
- 229920000768 polyamine Polymers 0.000 claims 2
- 229920001955 polyphenylene ether Polymers 0.000 claims 2
- 229910052725 zinc Inorganic materials 0.000 claims 2
- 239000011701 zinc Substances 0.000 claims 2
- 125000004169 (C1-C6) alkyl group Chemical group 0.000 claims 1
- POILWHVDKZOXJZ-ARJAWSKDSA-M (z)-4-oxopent-2-en-2-olate Chemical compound C\C([O-])=C\C(C)=O POILWHVDKZOXJZ-ARJAWSKDSA-M 0.000 claims 1
- 125000001140 1,4-phenylene group Chemical group [H]C1=C([H])C([*:2])=C([H])C([H])=C1[*:1] 0.000 claims 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 claims 1
- GVLZQVREHWQBJN-UHFFFAOYSA-N 3,5-dimethyl-7-oxabicyclo[2.2.1]hepta-1,3,5-triene Chemical compound CC1=C(O2)C(C)=CC2=C1 GVLZQVREHWQBJN-UHFFFAOYSA-N 0.000 claims 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 claims 1
- 239000007983 Tris buffer Substances 0.000 claims 1
- 125000001931 aliphatic group Chemical group 0.000 claims 1
- 125000003342 alkenyl group Chemical group 0.000 claims 1
- 125000002947 alkylene group Chemical group 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- 125000004103 aminoalkyl group Chemical group 0.000 claims 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 claims 1
- 229910052794 bromium Inorganic materials 0.000 claims 1
- 125000004432 carbon atom Chemical group C* 0.000 claims 1
- 239000003054 catalyst Substances 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 150000001875 compounds Chemical class 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 claims 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims 1
- 150000005826 halohydrocarbons Chemical class 0.000 claims 1
- 150000002460 imidazoles Chemical class 0.000 claims 1
- 125000000654 isopropylidene group Chemical group C(C)(C)=* 0.000 claims 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims 1
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 claims 1
- 125000002950 monocyclic group Chemical group 0.000 claims 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims 1
- 239000003960 organic solvent Substances 0.000 claims 1
- 125000004430 oxygen atom Chemical group O* 0.000 claims 1
- 239000011342 resin composition Substances 0.000 claims 1
- 150000003839 salts Chemical class 0.000 claims 1
- 239000002904 solvent Substances 0.000 claims 1
- 125000003944 tolyl group Chemical group 0.000 claims 1
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 claims 1
- CHJMFFKHPHCQIJ-UHFFFAOYSA-L zinc;octanoate Chemical compound [Zn+2].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O CHJMFFKHPHCQIJ-UHFFFAOYSA-L 0.000 claims 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C08L71/12—Polyphenylene oxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/681—Metal alcoholates, phenolates or carboxylates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C08L71/12—Polyphenylene oxides
- C08L71/123—Polyphenylene oxides not modified by chemical after-treatment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Reinforced Plastic Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Organic Insulating Materials (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
Claims (20)
- 하기 성분(I) 및 (Ⅱ)의 전체 중량에 기초하여, 화학적으로 결합된 보롬을 적어도 약 5중량%함유하고, (I) 본질적으로, 하기 식으로 표시된느 구조단위들로 이루어지고, 수평균 분자량이 약3,000-15,000인 폴리페닐렌 에테르 적어도 1종 약 30-60중량%,위 식에서, 각각의 단위들은 서로 독립적이며, 각각의 Q1은 독립적으로 할로겐 원자, 1차 또는 2차 저급알킬기, 페닐기, 할로알킬기, 아미노알킬기, 하이드로카르본옥시기, 또는 탄소 원자 적어도 2개가 할로겐과 산소 원자로 분리하는 할로하이드로카르본 옥시기이고, 각각의 Q2는 독립적으로 수소 원자, 할로겐원자, 1차 또는 2차 저급 알킬기, 페닐기, 할로알킬기, 하이드로카르본옥시기 또는 Q1에서 정의한 할로하이드로카르본옥시기이다. (Ⅱ) (A) 아릴치환체로서 브롬을 약 10-30% 함유 하며, 분자당 많아야 평균 최대 1개의 지방족 히드록 시기를 갖는 적어도 1종의 비스페놀 폴리글리시딜 에테르로 구성되는 폴리에폭시드 조성물 또는 상기 비스페놀 폴리글리시딜 에테르 및 적어도 1종의 비스페놀로 구성되는 혼합물 및 (B) 상기 폴리에폭시드 조성물의 불완전한 축함물 중의 적어도 1종 약 30-60중량%, (Ⅲ) 이미다졸류 및 아릴렌 폴리아민류 중의 적어도 1종 촉매유효량 및 (Ⅳ) 상기 경화성 조성물중에 가용성이거나 또는 안정하게 분산될 수 있는 염 형태의 아연 또는 알루미늄 공촉매 유효량으로 구성되며, 비활성 유기 용매의 유효량중에 용해되어 있는 것을 특징으로 하는 경화성 조성물.
- 제1항에 있어서, 에폭시 수지에 대한 경화제가 없는 것을 특징으로 하는 조성물.
- 제2항에 있어서, 본질적으로 성분 (Ⅰ)-(Ⅳ)로 이루어지는 것을 특징으로 하는 조성물.
- 제3항에 있어서, 성분(Ⅱ)가 하기 식의 화합물인 것을 특징으로 하는 조성물.위 식에서, m은 0-4이고, n은 최대 1의 평균값을 갖는다.
- 제4항에 있어서, n이 0이고, 성분(I)이 약 5,000-10,000범위의 수평균 분자량을 갖는 폴리(2,6-디메틸-1,4-페닐렌 에테르)인 것을 특징으로 하는 조성물.
- 제5항에 있어서, 용매가 톨루엔인 것을 특징으로 하는 조성물.
- 제5항에 있어서, 폴리페닐렌 에테르가 하기 식을 갖는 것을 특징으로 하는 조성물.위 식에서, 각 단위는 서로 독립적이며, 각각의 Q1은 메틸기 또는 CH2N(R2)|2이고, 각각의 R2는 독립적으로 수소원자 또는 1차 C1-6알킬기이며, A1및 A2는 각각 모노시클릭 2가 방향족기이고, Y는 1개 또는 2개의 원자가 A1과 A2로 분리하는 브리징기이며, X는 0 또는 양수이고, Z는 양수이다.
- 제7항에 있어서, A1및 A2는 각각 p-페닐렌이고, Y는 이소프로필리덴인 것을 특징으로 하는 조성물.
- 제8항에 있어서, 성분(Ⅲ)이 적어도 1종의 이미다졸인 것을 특징으로 하는 조성물.
- 제8항에 있어서, 성분(Ⅲ)이 적어도 1종의 이미다졸과 적어도 1종의 아릴렌 폴리아민의 혼합물인 것을 특징으로 하는 조성물.
- 제8항에 있어서, 성분(Ⅳ)가 아세틸아세톤산아연, 옥타노산아연 또는 스테아린산아연인 것을 특징으로 하는 조성물.
- 제8항에 있어서, 또한 하기 식으로 표시되는 적어도 1종의 지방족 트리스(디알킬포스페이토)-티타네이트를 함유하는 것을 특징으로 하는 조성물.위 식에서, 수지 조성물 100중량부 당 약0.1-1.0 중량부의 양에서, R3은 1차 또는 2차 C2-6알킬기 또는 알케닐기이고, r4는 C1-3알킬렌기이며, R3은 1차 또는 2차 C1-5알킬기이고, R6은 1차 또는 2차 C5-12알킬기이며, X는 0내지 약 3이다.
- 제12항에 있어서, R3은 알릴기이고, R4는 메틸렌기이며, R5는 에틸기이고, R6은 옥틸기이며, x는 0또는 1인 것을 특징으로 하는 조성물.
- 제8항에 있어서, 또한 안정하게 분산된 오산화안티몬을 성분(I)-(Ⅳ) 100부 당 최대 약 5부 함유하는 것을 특징으로 하는 조성물.
- 제1항의 조성물로 함침된 섬유상 기질로 된 경화성 물품.
- 제8항의 조성물로 함침된 섬유상 기질로 된 경화성 물품.
- 제15항에 있어서, 기질이 유리섬유인 것을 특징으로 하는 물품.
- 제16항에 있어서, 기질이 유리섬유인 것을 특징으로 하는 물품.
- 제17항의 물품에 열 및 압력을 가함으로써 제조된 경화된 조성물에 의해 분리되는 인쇄 회로 기판 적어도 2장으로 구성된 다층 회로 어셈블리.
- 제18항의 물품에 열 및 압력을 가함으로써 제조된 경화된 조성물에 의해 분리되는 인쇄 회로 기판 적어도 2장으로 구성된 다층 회로 어셈블리.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US31285089A | 1989-02-17 | 1989-02-17 | |
| US312,850 | 1989-02-17 | ||
| US07/460,430 US5162450A (en) | 1989-02-17 | 1990-01-03 | Curable dielectric polyphenylene ether-polyepoxide compositions |
| US460,430 | 1990-01-03 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR900013013A true KR900013013A (ko) | 1990-09-03 |
| KR940004863B1 KR940004863B1 (ko) | 1994-06-02 |
Family
ID=26978569
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019900001896A KR940004863B1 (ko) | 1989-02-17 | 1990-02-16 | 경화가능한 절연성 폴리페닐렌 에테르-폴리에폭시드 조성물 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US5162450A (ko) |
| EP (1) | EP0383178B1 (ko) |
| JP (1) | JPH0617456B2 (ko) |
| KR (1) | KR940004863B1 (ko) |
| BR (1) | BR9000727A (ko) |
| DE (1) | DE69033344T2 (ko) |
| ES (1) | ES2139566T3 (ko) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR920701362A (ko) * | 1989-10-06 | 1992-08-11 | 아더 엠.킹 | 전기 적층품을 위한 폴리페닐렌 옥시드/하이브리드 에폭시 수지계 |
| US5098781A (en) * | 1990-12-28 | 1992-03-24 | General Electric Company | Thermoplastic film, reinforced hollow glass microsphere reinforced laminates for thin low dielectric constant substrates |
| EP0494722B1 (en) * | 1991-01-11 | 1995-09-13 | Asahi Kasei Kogyo Kabushiki Kaisha | A curable polyphenylene ether resin composition and a cured resin composition obtainable therefrom |
| US5834565A (en) * | 1996-11-12 | 1998-11-10 | General Electric Company | Curable polyphenylene ether-thermosetting resin composition and process |
| TW550278B (en) * | 1996-11-12 | 2003-09-01 | Gen Electric | A curable polyphenylene ether-thermosetting resin composition |
| US6197898B1 (en) | 1997-11-18 | 2001-03-06 | General Electric Company | Melt-mixing thermoplastic and epoxy resin above Tg or Tm of thermoplastic with curing agent |
| CN1101420C (zh) * | 1997-11-25 | 2003-02-12 | 通用电气公司 | 聚(亚苯基醚)热固性组合物 |
| US6194495B1 (en) * | 1998-03-23 | 2001-02-27 | General Electric Company | Cyanate ester based thermoset compositions |
| SG80588A1 (en) * | 1998-04-04 | 2001-05-22 | Gen Electric | A curable polyphenylene ether-thermosetting resin composition and process |
| US6576718B1 (en) * | 1999-10-05 | 2003-06-10 | General Electric Company | Powder coating of thermosetting resin(s) and poly(phenylene ethers(s)) |
| US7022777B2 (en) * | 2001-06-28 | 2006-04-04 | General Electric | Moldable poly(arylene ether) thermosetting compositions, methods, and articles |
| US6500529B1 (en) * | 2001-09-14 | 2002-12-31 | Tonoga, Ltd. | Low signal loss bonding ply for multilayer circuit boards |
| US6783841B2 (en) | 2001-09-14 | 2004-08-31 | Tonoga, Inc. | Low signal loss bonding ply for multilayer circuit boards |
| WO2006126075A2 (en) * | 2005-05-27 | 2006-11-30 | Ion Beam Applications, S.A. | Device and method for quality assurance and online verification of radiation therapy |
| US20080076885A1 (en) * | 2006-09-21 | 2008-03-27 | Gary William Yeager | Poly(arylene ether) composition and method |
| US20080076884A1 (en) * | 2006-09-21 | 2008-03-27 | Gary William Yeager | Poly(arylene ether) composition and method |
| US20080085989A1 (en) * | 2006-10-05 | 2008-04-10 | Gary William Yeager | Poly(arylene ether) copolymer |
| US7655278B2 (en) * | 2007-01-30 | 2010-02-02 | Sabic Innovative Plastics Ip B.V. | Composite-forming method, composites formed thereby, and printed circuit boards incorporating them |
| US20090004484A1 (en) * | 2007-06-26 | 2009-01-01 | Doosan Corporation | Resine Composition For Printed Circuit Board And Composite Substrate And Copper Laminates Using The Same |
| US20090004488A1 (en) * | 2007-06-26 | 2009-01-01 | Doosan Corporation | Resine Composition For Printed Circuit Board and Composite Substrate And Copper Laminates Using The Same |
| US20100003828A1 (en) * | 2007-11-28 | 2010-01-07 | Guowen Ding | Methods for adjusting critical dimension uniformity in an etch process with a highly concentrated unsaturated hydrocarbon gas |
| US8859672B2 (en) * | 2011-06-27 | 2014-10-14 | Sabic Global Technologies B.V. | Poly(arylene ether)-poly(hydroxy ether) block copolymer and method of making |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1643309U (de) * | 1952-02-11 | 1952-09-04 | Loewe Opta Ag | Schallplattengeraet mit mitteln zur inbetriebnahme von schallplatten verschiedener laufgeschwindigkeit. |
| US3468824A (en) * | 1965-12-13 | 1969-09-23 | Morton Int Inc | Epoxy composition |
| US3367978A (en) * | 1966-05-03 | 1968-02-06 | Gen Electric | 4-(phenoxy)phenols |
| US3689444A (en) * | 1971-04-23 | 1972-09-05 | Celanese Coatings Co | Latent catalysts for one-component epoxy resin/anhydride compositions |
| US3812214A (en) * | 1971-10-28 | 1974-05-21 | Gen Electric | Hardenable composition consisting of an epoxy resin and a metal acetylacetonate |
| US4137275A (en) * | 1976-04-27 | 1979-01-30 | Westinghouse Electric Corp. | Latent accelerators for curing epoxy resins |
| JPS5335981A (en) * | 1976-09-14 | 1978-04-03 | Japan Atom Energy Res Inst | Cable with resistance against radial rays |
| JPS5869052A (ja) * | 1981-10-21 | 1983-04-25 | 旭化成株式会社 | 新規な積層板及びその成形法 |
| JPS58219217A (ja) * | 1982-06-15 | 1983-12-20 | Asahi Chem Ind Co Ltd | 変性エポキシ樹脂 |
| US4661559A (en) * | 1983-05-20 | 1987-04-28 | Union Carbide Corporation | Impact resistant matrix resins for advanced composites |
| ZA84548B (en) * | 1983-05-20 | 1984-12-24 | Union Carbide Corp | Impact resistant matrix resins for advanced composites |
| GB8421525D0 (en) * | 1984-08-24 | 1984-09-26 | Ciba Geigy Ag | Powder coating compositions |
| JPH068340B2 (ja) * | 1985-04-24 | 1994-02-02 | 東レ株式会社 | プリプレグ用マトリツクス樹脂組成物 |
| JPS6220555A (ja) * | 1985-07-18 | 1987-01-29 | Mitsubishi Electric Corp | エポキシ樹脂組成物 |
| JPH0657795B2 (ja) * | 1986-02-14 | 1994-08-03 | 旭硝子株式会社 | 耐熱樹脂フイルム |
| JPS6424825A (en) * | 1987-07-20 | 1989-01-26 | Mitsubishi Gas Chemical Co | Epoxy resin composition |
| US4975319A (en) * | 1988-07-14 | 1990-12-04 | General Electric Company | Printed circuit board from fibers impregnated with epoxy resin mixture, halogenated bisphenol and polyphenylene ether |
| US4853423A (en) * | 1988-07-14 | 1989-08-01 | General Electric Company | Curable polyphenylene ether-polyepoxide compositions useful in printed circuit board production |
| US5001010A (en) * | 1988-10-11 | 1991-03-19 | General Electric Company | Curable polyphenylene ether-polyepoxide compositions from melt processed polyphenylene ethers, and laminates prepared therefrom |
| US5043367A (en) * | 1988-12-22 | 1991-08-27 | General Electric Company | Curable dielectric polyphenylene ether-polyepoxide compositions useful in printed circuit board production |
-
1990
- 1990-01-03 US US07/460,430 patent/US5162450A/en not_active Expired - Lifetime
- 1990-02-07 DE DE69033344T patent/DE69033344T2/de not_active Expired - Fee Related
- 1990-02-07 ES ES90102393T patent/ES2139566T3/es not_active Expired - Lifetime
- 1990-02-07 EP EP90102393A patent/EP0383178B1/en not_active Expired - Lifetime
- 1990-02-16 JP JP2034052A patent/JPH0617456B2/ja not_active Expired - Fee Related
- 1990-02-16 KR KR1019900001896A patent/KR940004863B1/ko not_active IP Right Cessation
- 1990-02-16 BR BR909000727A patent/BR9000727A/pt not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| EP0383178A2 (en) | 1990-08-22 |
| EP0383178B1 (en) | 1999-11-10 |
| DE69033344D1 (de) | 1999-12-16 |
| EP0383178A3 (en) | 1991-07-03 |
| BR9000727A (pt) | 1991-01-22 |
| DE69033344T2 (de) | 2000-06-21 |
| KR940004863B1 (ko) | 1994-06-02 |
| JPH02269732A (ja) | 1990-11-05 |
| US5162450A (en) | 1992-11-10 |
| ES2139566T3 (es) | 2000-02-16 |
| JPH0617456B2 (ja) | 1994-03-09 |
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