KR900006444A - 경화성 폴리페닐렌 에테르-폴리에폭사이드 조성물 및 이로부터 제조된 라미네이트 - Google Patents

경화성 폴리페닐렌 에테르-폴리에폭사이드 조성물 및 이로부터 제조된 라미네이트 Download PDF

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KR900006444A
KR900006444A KR1019890013937A KR890013937A KR900006444A KR 900006444 A KR900006444 A KR 900006444A KR 1019890013937 A KR1019890013937 A KR 1019890013937A KR 890013937 A KR890013937 A KR 890013937A KR 900006444 A KR900006444 A KR 900006444A
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composition
reagent
compound
reagents
ether
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KR940001721B1 (ko
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신-아이 차오 허버트
마리 월렌 자나
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아더 엠. 킹
제네랄 일렉트릭 캄파니
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C08L71/126—Polyphenylene oxides modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4021—Ureas; Thioureas; Guanidines; Dicyandiamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C08K5/098—Metal salts of carboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/29—Compounds containing one or more carbon-to-nitrogen double bonds
    • C08K5/31—Guanidine; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/14—Glass
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C08L71/123—Polyphenylene oxides not modified by chemical after-treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polyethers (AREA)

Abstract

내용 없음

Description

경화성 폴리페닐렌 에테르-폴리에폭사이드 조성물 및 이로부터 제조된 라미네이트
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (20)

  1. (A) 폴리페닐렌 에테르 하나 이상의 불포화카복실산 또는 부수물 하나 이상의 반응 생성물, (B) 폴리에폭시 화합물 하나 이상 및 (C) 에폭시 경화촉매를 함유하는 경화성 조성물.
  2. 제1항에 있어서, 시약 A의 제조에 사용되는 폴리페닐렌 에테르의 수평균 분자량이 약 12,000이상인 조성물.
  3. 제2항에 있어서, 시약 B가 하기 일반식(VI)의 비스페놀성 화합물의 폴리글리시딘 에테르하나 이상, 및 폴리글리시딜 에테르 다량과 아릴 모노글리시딜 에테르 하나 이상 및 비-비스페놀성 폴리에폭시 화합물 소량의 혼합물중에서 선택되는 조성물.
    상기식에서, 각각의 A1및 A2는 모노사이클릭 2가 방향족 래디칼이고; Y는 1개 또는 2개의 원자가 A1을 A2로부터 분리시키는 가교 래디칼이며; X는 평균 1 이하이다.
  4. 제3항에 있어서, 시약 A를, 시약 A 및 B의 총량을 기준으로 하여, 약 90중량% 이하로 함유하고, 시약 A의 제조에 사용되는 불포화 카복실산 또는 무수물이 말레산 무수물 또는 푸마르산인 조성물.
  5. 제4항에 있어서, 시약 A가 이의 수평균 분자량이 약 15,000 내지 40,000 범위인 폴리(2,6-디메틸-1,4-페닐렌 에테르)이고, 시약 A 및 B의 총량을 기준으로 하여, 약 30 내지 85중량%로 함유되는 조성물.
  6. 제5항에 있어서, 시약 B가 필수적으로 상기 비스페놀성 화합물의 폴리글리시딜 에테르로 이루어진 조성물.
  7. 제6항에 있어서, 각각의 A1및 A2가 P-페닐렌이고, Y는 이소프로필리덴이며, X는 0인 조성물.
  8. 제7항에 있어서, 시약 C가 알루미늄 트리스(아세틸아세토네이트) 또는 아연 비스(아세틸아세토네이트)인 조성물.
  9. 제8항에 있어서, 시약 C가 시약 A 및 B의 총량을 기준으로 하여 약 0.5 내지 10%범위의 양으로 존재하는 조성물.
  10. 제9항에 있어서, 시약 A의 제조에 사용되는 불포화 카복실산 또는 무수물이 푸마르산인 조성물.
  11. 제7항에 있어서, 추가로 페놀성 화합물 또는 염기성 질소 화합물 하나 이상을 경화 촉진제로서 함유하는 조성물.
  12. 제11항에 있어서, 촉진제가 염기성 질소 화합물이고, 촉진제 및 시약 A, B 및 C의 총량을 기준으로 하여, 염기성, 비-휘발성 질소 약 1000 내지 1500ppm을 제공하는 양으로 존재하는 조성물.
  13. 제11항에 있어서, 촉진젝가 테트라메틸구아니딘이고, 촉진제 및 시약 A, B 및 C의 총량을 기준으로 하여 약 1500 내지 2500ppm의 양으로 존재하는 조성물.
  14. 제1항이 조성물로 함침된 섬유상 기질을 함유하는 경화성 제품.
  15. 제11항의 조성물로 함침된 섬유상 기질을 함유하는 경화성 제품.
  16. 제14항에 있어서, 기질이 유리 섬유인 제품.
  17. 제15항에 있어서, 기질이 유리 섬유인 제품.
  18. 제17항의 제품에 열을 적용시켜 제조된 경화제품.
  19. 전도성 금속으로 피복된 제18항에 따르는 제품을 함유하는 인쇄 회로판 블랭크(printed circuit board blank).
  20. 제19항에 있어서, 금속이 구리인 인쇄 회로판 블랭크.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019890013937A 1988-10-03 1989-09-28 경화성 폴리페닐렌 에테르-폴리에폭사이드 조성물 및 이로부터 제조된 적층물 KR940001721B1 (ko)

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US25262488A 1988-10-03 1988-10-03
US252,624 1988-10-03

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KR900006444A true KR900006444A (ko) 1990-05-08
KR940001721B1 KR940001721B1 (ko) 1994-03-05

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JP (1) JPH0617452B2 (ko)
KR (1) KR940001721B1 (ko)
DE (1) DE3931809C2 (ko)
SE (1) SE8903225L (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1036402C (zh) * 1991-01-11 1997-11-12 旭化成工业株式会社 可固化的聚苯氧树脂组合物及由它制成的薄膜
JPH0579319A (ja) * 1991-09-20 1993-03-30 Hitachi Ltd エンジン排気浄化システム
US6197898B1 (en) 1997-11-18 2001-03-06 General Electric Company Melt-mixing thermoplastic and epoxy resin above Tg or Tm of thermoplastic with curing agent

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5815658B2 (ja) * 1975-08-08 1983-03-26 本田技研工業株式会社 バンキンセイリユウタイツギテヨウヨクシヤノ セイゾウホウホウ
JPS5869052A (ja) * 1981-10-21 1983-04-25 旭化成株式会社 新規な積層板及びその成形法
JPS5869046A (ja) * 1981-10-21 1983-04-25 旭化成株式会社 積層板及びその成形法
US4654405A (en) * 1985-12-05 1987-03-31 Borg-Warner Chemicals, Inc. Carboxylated phenylene ether resins
JPS6424825A (en) * 1987-07-20 1989-01-26 Mitsubishi Gas Chemical Co Epoxy resin composition

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JPH02135216A (ja) 1990-05-24
DE3931809A1 (de) 1990-04-05
SE8903225D0 (sv) 1989-10-02
DE3931809C2 (de) 1998-09-17
SE8903225L (sv) 1990-04-04
KR940001721B1 (ko) 1994-03-05
JPH0617452B2 (ja) 1994-03-09

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