SE8903225L - Haerdbara polyfenyleneter-polyepoxid-kompositioner och laminat framstaellda daerav - Google Patents

Haerdbara polyfenyleneter-polyepoxid-kompositioner och laminat framstaellda daerav

Info

Publication number
SE8903225L
SE8903225L SE8903225A SE8903225A SE8903225L SE 8903225 L SE8903225 L SE 8903225L SE 8903225 A SE8903225 A SE 8903225A SE 8903225 A SE8903225 A SE 8903225A SE 8903225 L SE8903225 L SE 8903225L
Authority
SE
Sweden
Prior art keywords
esp
cpd
amt
glyc
ether
Prior art date
Application number
SE8903225A
Other languages
English (en)
Swedish (sv)
Other versions
SE8903225D0 (sv
Inventor
H Shin-Chao
Original Assignee
Gen Electric Co Int
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gen Electric Co Int filed Critical Gen Electric Co Int
Publication of SE8903225D0 publication Critical patent/SE8903225D0/xx
Publication of SE8903225L publication Critical patent/SE8903225L/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C08L71/126—Polyphenylene oxides modified by chemical after-treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4021—Ureas; Thioureas; Guanidines; Dicyandiamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C08K5/098—Metal salts of carboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/29—Compounds containing one or more carbon-to-nitrogen double bonds
    • C08K5/31—Guanidine; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/14—Glass
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C08L71/123—Polyphenylene oxides not modified by chemical after-treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polyethers (AREA)
SE8903225A 1988-10-03 1989-10-02 Haerdbara polyfenyleneter-polyepoxid-kompositioner och laminat framstaellda daerav SE8903225L (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US25262488A 1988-10-03 1988-10-03

Publications (2)

Publication Number Publication Date
SE8903225D0 SE8903225D0 (sv) 1989-10-02
SE8903225L true SE8903225L (sv) 1990-04-04

Family

ID=22956826

Family Applications (1)

Application Number Title Priority Date Filing Date
SE8903225A SE8903225L (sv) 1988-10-03 1989-10-02 Haerdbara polyfenyleneter-polyepoxid-kompositioner och laminat framstaellda daerav

Country Status (4)

Country Link
JP (1) JPH0617452B2 (xx)
KR (1) KR940001721B1 (xx)
DE (1) DE3931809C2 (xx)
SE (1) SE8903225L (xx)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0494722B1 (en) * 1991-01-11 1995-09-13 Asahi Kasei Kogyo Kabushiki Kaisha A curable polyphenylene ether resin composition and a cured resin composition obtainable therefrom
JPH0579319A (ja) * 1991-09-20 1993-03-30 Hitachi Ltd エンジン排気浄化システム
US6197898B1 (en) 1997-11-18 2001-03-06 General Electric Company Melt-mixing thermoplastic and epoxy resin above Tg or Tm of thermoplastic with curing agent

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5815658B2 (ja) * 1975-08-08 1983-03-26 本田技研工業株式会社 バンキンセイリユウタイツギテヨウヨクシヤノ セイゾウホウホウ
JPS5869046A (ja) * 1981-10-21 1983-04-25 旭化成株式会社 積層板及びその成形法
JPS5869052A (ja) * 1981-10-21 1983-04-25 旭化成株式会社 新規な積層板及びその成形法
US4654405A (en) * 1985-12-05 1987-03-31 Borg-Warner Chemicals, Inc. Carboxylated phenylene ether resins
JPS6424825A (en) * 1987-07-20 1989-01-26 Mitsubishi Gas Chemical Co Epoxy resin composition

Also Published As

Publication number Publication date
KR900006444A (ko) 1990-05-08
JPH0617452B2 (ja) 1994-03-09
SE8903225D0 (sv) 1989-10-02
DE3931809A1 (de) 1990-04-05
JPH02135216A (ja) 1990-05-24
DE3931809C2 (de) 1998-09-17
KR940001721B1 (ko) 1994-03-05

Similar Documents

Publication Publication Date Title
KR101227201B1 (ko) 양친매성 블록 공중합체-강인화된 에폭시 수지 및 그로부터제조된 전기 적층물
KR100205271B1 (ko) 열경화성수지조성물, 경화물, 프리프레그, 금속장적층판 및 배선판
KR101281381B1 (ko) 복합재 제조에 유용한 조성물 및 이것으로 생산된 복합재
CN102181143B (zh) 一种高频用热固性树脂组合物、半固化片及层压板
US4912172A (en) Compositions comprising polyphenylene ethers, polyepoxides and aluminum or zinc diketone salt
CN1051325C (zh) 磷改性的环氧树脂及其制备方法和应用
KR20090125241A (ko) 합성물-형성 방법, 이에 의해 형성된 합성물, 및 이를 도입한 인쇄 회로 기판
CN102276961A (zh) 无卤无磷环氧树脂组合物及使用其制作的半固化片及层压板
KR900001790A (ko) 인쇄 회로판 제조에 유용한 경화성 폴리페닐렌 에테르-폴리에폭사이드 조성물
KR100384190B1 (ko) 다기능성시안산염에스테르및에폭시배합물
IE57890B1 (en) Epoxy resin composition and a process for preparing laminates therefrom
KR20150024153A (ko) 인쇄회로기판용 절연 수지 조성물 및 이를 이용한 제품
WO1991005015A1 (en) Resin composition for electrical laminates
CN106832786A (zh) 一种高阻燃性环氧树脂组合物
SE8903225L (sv) Haerdbara polyfenyleneter-polyepoxid-kompositioner och laminat framstaellda daerav
KR0139001B1 (ko) 방향족 디아민 경화제를 포함하는 에폭시 수지 조성물
KR940009279A (ko) 전기 적층체용 폴리페닐렌 에테르/폴리에폭사이드 수지 시스템
US5880247A (en) Phosphorus-containing dicarboxylic acid (anhydride)-modified epoxy resin
US5830973A (en) Phosphorus-modified epoxy resins comprising epoxy resins and phosphorus-containing compounds
EP3504283B1 (en) Solid homogeneous amorphous high heat epoxy blends, articles, and uses thereof
EP0467474A2 (en) Cyanamide-cured maleimide/epoxy resin compositions
EP0398917B1 (en) Ethers of the condensation products of phenoldicyclopentadiene adducts as thermosetting resins
KR890003873A (ko) 경화제 조성물, 이를 함유한 적층 니스 및 이로부터 제조한 적층물
JP2653603B2 (ja) 熱硬化性樹脂組成物
US4804721A (en) Ethers of the condensation products of phenoldicyclopentadiene adducts with aldehydes and ketones as thermosetting resins

Legal Events

Date Code Title Description
NAV Patent application has lapsed

Ref document number: 8903225-4