DE69033344D1 - Härtbare, dielektrische Polyphenylenether-Polyepoxid-Zusammensetzungen - Google Patents

Härtbare, dielektrische Polyphenylenether-Polyepoxid-Zusammensetzungen

Info

Publication number
DE69033344D1
DE69033344D1 DE69033344T DE69033344T DE69033344D1 DE 69033344 D1 DE69033344 D1 DE 69033344D1 DE 69033344 T DE69033344 T DE 69033344T DE 69033344 T DE69033344 T DE 69033344T DE 69033344 D1 DE69033344 D1 DE 69033344D1
Authority
DE
Germany
Prior art keywords
polyepoxide
curable
polyphenylene ether
dielectric compositions
dielectric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69033344T
Other languages
English (en)
Other versions
DE69033344T2 (de
Inventor
Michael John Davis
James Estel Tracy
Edward Fuhua Chu
Herbert Shin-I Chao
Robert Edgar Colborn
James Robert Presley
Jana Marie Whalen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of DE69033344D1 publication Critical patent/DE69033344D1/de
Application granted granted Critical
Publication of DE69033344T2 publication Critical patent/DE69033344T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/681—Metal alcoholates, phenolates or carboxylates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C08L71/123—Polyphenylene oxides not modified by chemical after-treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Organic Insulating Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
DE69033344T 1989-02-17 1990-02-07 Härtbare, dielektrische Polyphenylenether-Polyepoxid-Zusammensetzungen Expired - Fee Related DE69033344T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US31285089A 1989-02-17 1989-02-17
US07/460,430 US5162450A (en) 1989-02-17 1990-01-03 Curable dielectric polyphenylene ether-polyepoxide compositions

Publications (2)

Publication Number Publication Date
DE69033344D1 true DE69033344D1 (de) 1999-12-16
DE69033344T2 DE69033344T2 (de) 2000-06-21

Family

ID=26978569

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69033344T Expired - Fee Related DE69033344T2 (de) 1989-02-17 1990-02-07 Härtbare, dielektrische Polyphenylenether-Polyepoxid-Zusammensetzungen

Country Status (7)

Country Link
US (1) US5162450A (de)
EP (1) EP0383178B1 (de)
JP (1) JPH0617456B2 (de)
KR (1) KR940004863B1 (de)
BR (1) BR9000727A (de)
DE (1) DE69033344T2 (de)
ES (1) ES2139566T3 (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR920701362A (ko) * 1989-10-06 1992-08-11 아더 엠.킹 전기 적층품을 위한 폴리페닐렌 옥시드/하이브리드 에폭시 수지계
US5098781A (en) * 1990-12-28 1992-03-24 General Electric Company Thermoplastic film, reinforced hollow glass microsphere reinforced laminates for thin low dielectric constant substrates
EP0494722B1 (de) * 1991-01-11 1995-09-13 Asahi Kasei Kogyo Kabushiki Kaisha Eine härtbare Polyphenylenetherharzzusammensetzung und eine daraus herstellbare gehärtete Harzzusammensetzung
US5834565A (en) * 1996-11-12 1998-11-10 General Electric Company Curable polyphenylene ether-thermosetting resin composition and process
TW550278B (en) * 1996-11-12 2003-09-01 Gen Electric A curable polyphenylene ether-thermosetting resin composition
US6197898B1 (en) 1997-11-18 2001-03-06 General Electric Company Melt-mixing thermoplastic and epoxy resin above Tg or Tm of thermoplastic with curing agent
CN1101420C (zh) * 1997-11-25 2003-02-12 通用电气公司 聚(亚苯基醚)热固性组合物
US6194495B1 (en) * 1998-03-23 2001-02-27 General Electric Company Cyanate ester based thermoset compositions
SG80588A1 (en) * 1998-04-04 2001-05-22 Gen Electric A curable polyphenylene ether-thermosetting resin composition and process
US6576718B1 (en) 1999-10-05 2003-06-10 General Electric Company Powder coating of thermosetting resin(s) and poly(phenylene ethers(s))
US7022777B2 (en) * 2001-06-28 2006-04-04 General Electric Moldable poly(arylene ether) thermosetting compositions, methods, and articles
US6783841B2 (en) 2001-09-14 2004-08-31 Tonoga, Inc. Low signal loss bonding ply for multilayer circuit boards
US6500529B1 (en) * 2001-09-14 2002-12-31 Tonoga, Ltd. Low signal loss bonding ply for multilayer circuit boards
US7476867B2 (en) * 2005-05-27 2009-01-13 Iba Device and method for quality assurance and online verification of radiation therapy
US20080076884A1 (en) * 2006-09-21 2008-03-27 Gary William Yeager Poly(arylene ether) composition and method
US20080076885A1 (en) * 2006-09-21 2008-03-27 Gary William Yeager Poly(arylene ether) composition and method
US20080085989A1 (en) * 2006-10-05 2008-04-10 Gary William Yeager Poly(arylene ether) copolymer
US7655278B2 (en) * 2007-01-30 2010-02-02 Sabic Innovative Plastics Ip B.V. Composite-forming method, composites formed thereby, and printed circuit boards incorporating them
US20090004488A1 (en) * 2007-06-26 2009-01-01 Doosan Corporation Resine Composition For Printed Circuit Board and Composite Substrate And Copper Laminates Using The Same
US20090004484A1 (en) * 2007-06-26 2009-01-01 Doosan Corporation Resine Composition For Printed Circuit Board And Composite Substrate And Copper Laminates Using The Same
US20100003828A1 (en) * 2007-11-28 2010-01-07 Guowen Ding Methods for adjusting critical dimension uniformity in an etch process with a highly concentrated unsaturated hydrocarbon gas
US8859672B2 (en) * 2011-06-27 2014-10-14 Sabic Global Technologies B.V. Poly(arylene ether)-poly(hydroxy ether) block copolymer and method of making

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1643309U (de) * 1952-02-11 1952-09-04 Loewe Opta Ag Schallplattengeraet mit mitteln zur inbetriebnahme von schallplatten verschiedener laufgeschwindigkeit.
US3468824A (en) * 1965-12-13 1969-09-23 Morton Int Inc Epoxy composition
US3367978A (en) * 1966-05-03 1968-02-06 Gen Electric 4-(phenoxy)phenols
US3689444A (en) * 1971-04-23 1972-09-05 Celanese Coatings Co Latent catalysts for one-component epoxy resin/anhydride compositions
US3812214A (en) * 1971-10-28 1974-05-21 Gen Electric Hardenable composition consisting of an epoxy resin and a metal acetylacetonate
US4137275A (en) * 1976-04-27 1979-01-30 Westinghouse Electric Corp. Latent accelerators for curing epoxy resins
JPS5335981A (en) * 1976-09-14 1978-04-03 Japan Atom Energy Res Inst Cable with resistance against radial rays
JPS5869052A (ja) * 1981-10-21 1983-04-25 旭化成株式会社 新規な積層板及びその成形法
JPS58219217A (ja) * 1982-06-15 1983-12-20 Asahi Chem Ind Co Ltd 変性エポキシ樹脂
US4661559A (en) * 1983-05-20 1987-04-28 Union Carbide Corporation Impact resistant matrix resins for advanced composites
ZA84548B (en) * 1983-05-20 1984-12-24 Union Carbide Corp Impact resistant matrix resins for advanced composites
GB8421525D0 (en) * 1984-08-24 1984-09-26 Ciba Geigy Ag Powder coating compositions
JPH068340B2 (ja) * 1985-04-24 1994-02-02 東レ株式会社 プリプレグ用マトリツクス樹脂組成物
JPS6220555A (ja) * 1985-07-18 1987-01-29 Mitsubishi Electric Corp エポキシ樹脂組成物
JPH0657795B2 (ja) * 1986-02-14 1994-08-03 旭硝子株式会社 耐熱樹脂フイルム
JPS6424825A (en) * 1987-07-20 1989-01-26 Mitsubishi Gas Chemical Co Epoxy resin composition
US4853423A (en) * 1988-07-14 1989-08-01 General Electric Company Curable polyphenylene ether-polyepoxide compositions useful in printed circuit board production
US4975319A (en) * 1988-07-14 1990-12-04 General Electric Company Printed circuit board from fibers impregnated with epoxy resin mixture, halogenated bisphenol and polyphenylene ether
US5001010A (en) * 1988-10-11 1991-03-19 General Electric Company Curable polyphenylene ether-polyepoxide compositions from melt processed polyphenylene ethers, and laminates prepared therefrom
US5043367A (en) * 1988-12-22 1991-08-27 General Electric Company Curable dielectric polyphenylene ether-polyepoxide compositions useful in printed circuit board production

Also Published As

Publication number Publication date
JPH02269732A (ja) 1990-11-05
KR940004863B1 (ko) 1994-06-02
JPH0617456B2 (ja) 1994-03-09
EP0383178A3 (de) 1991-07-03
EP0383178B1 (de) 1999-11-10
EP0383178A2 (de) 1990-08-22
DE69033344T2 (de) 2000-06-21
US5162450A (en) 1992-11-10
ES2139566T3 (es) 2000-02-16
BR9000727A (pt) 1991-01-22
KR900013013A (ko) 1990-09-03

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee