KR900012520A - 인쇄회로기판의 천공장치와 그 방법 - Google Patents
인쇄회로기판의 천공장치와 그 방법Info
- Publication number
- KR900012520A KR900012520A KR1019900000757A KR900000757A KR900012520A KR 900012520 A KR900012520 A KR 900012520A KR 1019900000757 A KR1019900000757 A KR 1019900000757A KR 900000757 A KR900000757 A KR 900000757A KR 900012520 A KR900012520 A KR 900012520A
- Authority
- KR
- South Korea
- Prior art keywords
- circuit board
- printed circuit
- perforation device
- perforation
- printed
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/0093—Working by laser beam, e.g. welding, cutting or boring combined with mechanical machining or metal-working covered by other subclasses than B23K
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
- B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P23/00—Machines or arrangements of machines for performing specified combinations of different metal-working operations not covered by a single other subclass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
- H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/34—Coated articles, e.g. plated or painted; Surface treated articles
- B23K2101/35—Surface treated articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/12—Copper or alloys thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/16—Composite materials, e.g. fibre reinforced
- B23K2103/166—Multilayered materials
- B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/30—Organic material
- B23K2103/42—Plastics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09509—Blind vias, i.e. vias having one side closed
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09509—Blind vias, i.e. vias having one side closed
- H05K2201/09518—Deep blind vias, i.e. blind vias connecting the surface circuit to circuit layers deeper than the first buried circuit layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0207—Partly drilling through substrate until a controlled depth, e.g. with end-point detection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0548—Masks
- H05K2203/0554—Metal used as mask for etching vias, e.g. by laser ablation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Laser Beam Processing (AREA)
- Drilling And Boring (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP89-16157 | 1989-01-27 | ||
JP1016157A JPH02198193A (ja) | 1989-01-27 | 1989-01-27 | プリント基板の穴明け方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR900012520A true KR900012520A (ko) | 1990-08-04 |
KR930002697B1 KR930002697B1 (ko) | 1993-04-07 |
Family
ID=11908670
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019900000757A KR930002697B1 (ko) | 1989-01-27 | 1990-01-23 | 인쇄회로기판의 천공장치와 그 방법 |
Country Status (4)
Country | Link |
---|---|
US (1) | US5010232A (ko) |
JP (1) | JPH02198193A (ko) |
KR (1) | KR930002697B1 (ko) |
DE (1) | DE4002326A1 (ko) |
Families Citing this family (49)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2865809B2 (ja) * | 1990-06-01 | 1999-03-08 | 日立精工株式会社 | プリント基板の盲穴加工方法 |
IT1240531B (it) * | 1990-08-07 | 1993-12-17 | Pluritec Italia | Metodo e dispositivo di controllo della profondita' di lavorazione per una macchina utensile a controllo numerico |
JPH07112113B2 (ja) * | 1991-01-28 | 1995-11-29 | 松下電工株式会社 | 多層回路板のバイアホール加工方法 |
US5483100A (en) * | 1992-06-02 | 1996-01-09 | Amkor Electronics, Inc. | Integrated circuit package with via interconnections formed in a substrate |
JPH07336055A (ja) * | 1994-06-06 | 1995-12-22 | Hitachi Seiko Ltd | レーザ加工方法及びその装置 |
US5841099A (en) * | 1994-07-18 | 1998-11-24 | Electro Scientific Industries, Inc. | Method employing UV laser pulses of varied energy density to form depthwise self-limiting blind vias in multilayered targets |
US6043453A (en) * | 1996-02-23 | 2000-03-28 | Hitachi Via Mechanics Ltd. | Apparatus for laser processing with a mechanical cutter |
US7062845B2 (en) | 1996-06-05 | 2006-06-20 | Laservia Corporation | Conveyorized blind microvia laser drilling system |
WO1997046349A1 (en) * | 1996-06-05 | 1997-12-11 | Burgess Larry W | Blind via laser drilling system |
US6631558B2 (en) * | 1996-06-05 | 2003-10-14 | Laservia Corporation | Blind via laser drilling system |
DE69737991T2 (de) * | 1996-11-20 | 2008-04-30 | Ibiden Co., Ltd., Ogaki | Laserbearbeitungsvorrichtung, verfahren und vorrichtung zur herstellung einer mehrschichtigen, gedruckten leiterplatte |
US7732732B2 (en) * | 1996-11-20 | 2010-06-08 | Ibiden Co., Ltd. | Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board |
JPH11145581A (ja) * | 1997-11-10 | 1999-05-28 | Hitachi Seiko Ltd | プリント基板の穴明け方法および装置 |
US6601297B1 (en) | 1998-08-28 | 2003-08-05 | Dyconex Patente Ag | Method for producing micro-openings |
TW503143B (en) | 2000-10-06 | 2002-09-21 | Hitachi Via Mechanics Ltd | Method and apparatus for drilling printed wiring boards |
TW532050B (en) * | 2000-11-09 | 2003-05-11 | Matsushita Electric Ind Co Ltd | Circuit board and method for manufacturing the same |
JP3790433B2 (ja) * | 2001-02-28 | 2006-06-28 | 日本無線株式会社 | プリント配線板の製造方法 |
US6804269B2 (en) * | 2001-06-19 | 2004-10-12 | Hitachi Via Mechanics, Ltd. | Laser beam delivery system with trepanning module |
US6884962B2 (en) * | 2002-03-18 | 2005-04-26 | Hitachi Via Mechanics, Ltd. | Beam or wave front |
US6909735B2 (en) * | 2003-04-10 | 2005-06-21 | Hitachi Via Mechanics, Ltd. | System and method for generating and controlling multiple independently steerable laser beam for material processing |
US20040251243A1 (en) * | 2003-04-10 | 2004-12-16 | Lizotte Todd E. | System and method for generating and controlling multiple independently steerable laser beams for material processing |
US8290239B2 (en) * | 2005-10-21 | 2012-10-16 | Orbotech Ltd. | Automatic repair of electric circuits |
DE102005055553A1 (de) | 2005-11-18 | 2007-05-24 | Johnson Controls Interiors Gmbh & Co. Kg | Verfahren zur Erzeugung einer Schwächungszone, insbesondere einer Sollbruchlinie für eine Airbag-Austrittsöffnung, Bauteil und Vorrichtung |
ATE512743T1 (de) * | 2007-11-23 | 2011-07-15 | Siemens Ag | Vorrichtung und verfahren zur bearbeitung von löchern |
KR101026036B1 (ko) * | 2008-04-10 | 2011-03-30 | 삼성전기주식회사 | 관통홀 형성 방법 |
US20100243617A1 (en) * | 2009-03-26 | 2010-09-30 | Electro Scientific Industries, Inc. | Printed circuit board via drilling stage assembly |
JP2010264508A (ja) * | 2009-04-13 | 2010-11-25 | Nippon Sharyo Seizo Kaisha Ltd | 加工装置 |
CN102950386A (zh) * | 2011-08-16 | 2013-03-06 | 悦虎电路(苏州)有限公司 | 一种线路板激光直接成孔后的孔顶悬铜解决方法 |
CN103167735B (zh) * | 2011-12-12 | 2016-10-26 | 深南电路有限公司 | 带有台阶槽的pcb板加工方法及多层pcb板 |
CN103458626A (zh) * | 2013-08-09 | 2013-12-18 | 北大方正集团有限公司 | 一种制作盲孔的方法以及装置 |
KR20150025245A (ko) * | 2013-08-28 | 2015-03-10 | 삼성전기주식회사 | 인쇄회로기판용 동박 적층판 및 그의 제조방법 |
JP2015047621A (ja) * | 2013-09-02 | 2015-03-16 | 三菱重工業株式会社 | 複合加工装置及び複合加工方法 |
CN104582302B (zh) * | 2013-10-10 | 2017-11-21 | 北大方正集团有限公司 | 一种制作阶梯槽的方法和装置 |
WO2015084934A2 (en) * | 2013-12-04 | 2015-06-11 | Microlution Inc. | Multi-station laser machine |
CN104162583A (zh) * | 2014-07-21 | 2014-11-26 | 苏州璟瑜自动化科技有限公司 | 带胶片感光对比检测与覆膜定位的冲孔系统 |
CN104625621A (zh) * | 2014-12-15 | 2015-05-20 | 贵州黎阳航空动力有限公司 | 一种航空发动机用封严涨圈镀铬端面微孔加工方法 |
US10237983B2 (en) | 2014-12-23 | 2019-03-19 | Sanmina Corporation | Method for forming hole plug |
WO2016106428A1 (en) * | 2014-12-23 | 2016-06-30 | Sanmina Corporation | Hole plug for thin laminate |
CN104923620A (zh) * | 2015-06-23 | 2015-09-23 | 苏州璟瑜自动化科技有限公司 | 基于热成像检测反馈调节的钣金冲孔装置 |
CN104923626A (zh) * | 2015-06-24 | 2015-09-23 | 苏州璟瑜自动化科技有限公司 | 带胶片感光对比检测与覆膜定位的冲孔系统及方法 |
CN104923632A (zh) * | 2015-06-25 | 2015-09-23 | 苏州璟瑜自动化科技有限公司 | 基于裂纹检测反馈的钣金冲孔装置及其方法 |
CN104942432B (zh) * | 2015-07-14 | 2017-05-24 | 湖南科瑞特科技股份有限公司 | 全印制电子及印制电路激光成型和喷印一体机 |
CN105163499B (zh) * | 2015-08-31 | 2018-04-13 | 北大方正集团有限公司 | 一种pcb板阶梯槽的制备方法 |
CN105592631A (zh) * | 2015-12-18 | 2016-05-18 | 景旺电子科技(龙川)有限公司 | 一种金属基印制板背钻制作方法 |
CN105792526A (zh) * | 2016-04-01 | 2016-07-20 | 广州兴森快捷电路科技有限公司 | 一种双面板的盲槽制作方法 |
CN112839443A (zh) * | 2019-11-25 | 2021-05-25 | 深南电路股份有限公司 | 线路板及其制作方法 |
DE102022104052B4 (de) * | 2022-02-21 | 2024-03-07 | KSG GmbH | Verfahren zum Herstellen einer Mehrlagen-Leiterplatte mit einer Sackloch-Kontaktierung |
CN116390363B (zh) * | 2023-06-02 | 2023-10-20 | 淄博芯材集成电路有限责任公司 | 基于镭射光圈直径及强度调整的hdi印刷电路板开窗方法 |
CN116437578B (zh) * | 2023-06-13 | 2023-09-15 | 江油星联电子科技有限公司 | 一种印刷电路板生产用贯孔装置 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2933700C2 (de) * | 1979-08-21 | 1984-04-19 | C. Behrens Ag, 3220 Alfeld | Werkzeugmaschine mit als Laser-Schneideinrichtung ausgebildeter Schmelzschneideinrichtung |
JPS5864097A (ja) * | 1981-10-14 | 1983-04-16 | 株式会社日立製作所 | 多層印刷回路板の製造方法 |
JPS5923587A (ja) * | 1982-07-30 | 1984-02-07 | 富士通株式会社 | プリント基板の穿孔方法 |
US4504727A (en) * | 1982-12-30 | 1985-03-12 | International Business Machines Corporation | Laser drilling system utilizing photoacoustic feedback |
JPS60180687A (ja) * | 1984-02-28 | 1985-09-14 | Sony Corp | プリント配線基板の加工方法 |
EP0164564A1 (de) * | 1984-05-18 | 1985-12-18 | Siemens Aktiengesellschaft | Anordnung zur Sacklocherzeugung in einem laminierten Aufbau |
JPS6195792A (ja) * | 1984-10-17 | 1986-05-14 | Hitachi Ltd | 印刷配線板の製造方法 |
JPS61251189A (ja) * | 1985-04-30 | 1986-11-08 | 日立コンデンサ株式会社 | プリント配線板の製造方法 |
US4857696A (en) * | 1987-06-12 | 1989-08-15 | Raycon Textron Inc. | Laser/EDM drilling manufacturing cell |
-
1989
- 1989-01-27 JP JP1016157A patent/JPH02198193A/ja active Pending
-
1990
- 1990-01-23 US US07/468,914 patent/US5010232A/en not_active Expired - Lifetime
- 1990-01-23 KR KR1019900000757A patent/KR930002697B1/ko not_active IP Right Cessation
- 1990-01-26 DE DE4002326A patent/DE4002326A1/de active Granted
Also Published As
Publication number | Publication date |
---|---|
DE4002326A1 (de) | 1990-08-02 |
DE4002326C2 (ko) | 1991-09-19 |
US5010232A (en) | 1991-04-23 |
KR930002697B1 (ko) | 1993-04-07 |
JPH02198193A (ja) | 1990-08-06 |
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