EP0427702A3 - Multilayer circuit board and method of making it - Google Patents

Multilayer circuit board and method of making it Download PDF

Info

Publication number
EP0427702A3
EP0427702A3 EP19900890297 EP90890297A EP0427702A3 EP 0427702 A3 EP0427702 A3 EP 0427702A3 EP 19900890297 EP19900890297 EP 19900890297 EP 90890297 A EP90890297 A EP 90890297A EP 0427702 A3 EP0427702 A3 EP 0427702A3
Authority
EP
European Patent Office
Prior art keywords
making
circuit board
multilayer circuit
multilayer
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP19900890297
Other languages
German (de)
Other versions
EP0427702A2 (en
Inventor
Robert Dipl.-Ing. Vodiunig
Johannes Dipl.-Ing. Stahr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&S Austria Technologie und Systemtechnik AG
Original Assignee
AT&S Austria Technologie und Systemtechnik AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AT&S Austria Technologie und Systemtechnik AG filed Critical AT&S Austria Technologie und Systemtechnik AG
Publication of EP0427702A2 publication Critical patent/EP0427702A2/en
Publication of EP0427702A3 publication Critical patent/EP0427702A3/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/0909—Preformed cutting or breaking line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
EP19900890297 1989-11-07 1990-11-06 Multilayer circuit board and method of making it Withdrawn EP0427702A3 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
AT256289A AT399250B (en) 1989-11-07 1989-11-07 MULTILAYER CIRCUIT BOARD AND METHOD FOR THEIR PRODUCTION
AT2562/89 1989-11-07

Publications (2)

Publication Number Publication Date
EP0427702A2 EP0427702A2 (en) 1991-05-15
EP0427702A3 true EP0427702A3 (en) 1992-08-05

Family

ID=3536491

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19900890297 Withdrawn EP0427702A3 (en) 1989-11-07 1990-11-06 Multilayer circuit board and method of making it

Country Status (2)

Country Link
EP (1) EP0427702A3 (en)
AT (1) AT399250B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5288542A (en) * 1992-07-14 1994-02-22 International Business Machines Corporation Composite for providing a rigid-flexible circuit board construction and method for fabrication thereof
AT399349B (en) * 1993-08-26 1995-04-25 Chemiefaser Lenzing Ag METHOD FOR CLEANING AQUEOUS AMINOXIDE SOLUTIONS
CN112533360B (en) * 2020-12-07 2022-03-18 惠州市特创电子科技股份有限公司 Hot-press bonding method of high-frequency circuit board and processing method of circuit board

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0087051A2 (en) * 1982-02-17 1983-08-31 Siemens Aktiengesellschaft Substrate material for flexible printed circuits
EP0148379A1 (en) * 1983-12-02 1985-07-17 Siemens Aktiengesellschaft Multilayer circuits made of a thermoplastic composite

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0087051A2 (en) * 1982-02-17 1983-08-31 Siemens Aktiengesellschaft Substrate material for flexible printed circuits
EP0148379A1 (en) * 1983-12-02 1985-07-17 Siemens Aktiengesellschaft Multilayer circuits made of a thermoplastic composite

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
ELECTRONIC PACKAGING AND PRODUCTION. Bd. 28, Nr. 8, August 1988, NEWTON, MASSACHUSETTS US Seite 16; 'Plasma treatment strengthens bonds' *
FEINWERKTECHNIK + MESSTECHNIK. Bd. 84, Nr. 7, 1976, DE Seiten 317 - 320; D. ACKERMANN ET AL.: 'Starr-flexible Mehrlagenleiterplatten: Dreidimensionale Gedruckte Schaltungen ...' *

Also Published As

Publication number Publication date
EP0427702A2 (en) 1991-05-15
AT399250B (en) 1995-04-25
ATA256289A (en) 1994-08-15

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