ZA889270B - Apparatus and method for the manufacture of printed circuit board and prototypes - Google Patents

Apparatus and method for the manufacture of printed circuit board and prototypes

Info

Publication number
ZA889270B
ZA889270B ZA889270A ZA889270A ZA889270B ZA 889270 B ZA889270 B ZA 889270B ZA 889270 A ZA889270 A ZA 889270A ZA 889270 A ZA889270 A ZA 889270A ZA 889270 B ZA889270 B ZA 889270B
Authority
ZA
South Africa
Prior art keywords
prototypes
manufacture
circuit board
printed circuit
printed
Prior art date
Application number
ZA889270A
Inventor
Paul Frederick Mills
Frederick Mills Paul
Original Assignee
Versatronics Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Versatronics Limited filed Critical Versatronics Limited
Publication of ZA889270B publication Critical patent/ZA889270B/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
ZA889270A 1987-12-10 1988-12-12 Apparatus and method for the manufacture of printed circuit board and prototypes ZA889270B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB878728865A GB8728865D0 (en) 1987-12-10 1987-12-10 Apparatus & method for manufacture of printed circuit board & prototypes

Publications (1)

Publication Number Publication Date
ZA889270B true ZA889270B (en) 1989-08-30

Family

ID=10628294

Family Applications (1)

Application Number Title Priority Date Filing Date
ZA889270A ZA889270B (en) 1987-12-10 1988-12-12 Apparatus and method for the manufacture of printed circuit board and prototypes

Country Status (6)

Country Link
CN (1) CN1035409A (en)
AU (1) AU2935789A (en)
GB (1) GB8728865D0 (en)
IL (1) IL88634A0 (en)
WO (1) WO1989005566A1 (en)
ZA (1) ZA889270B (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1055194C (en) * 1997-11-21 2000-08-02 厦门市科学技术委员会 Covered copper plate fast printing method
CN100544549C (en) * 2005-09-30 2009-09-23 鸿富锦精密工业（深圳）有限公司 Circuit board aided design system and method
CN101778538B (en) * 2006-06-02 2013-04-17 刘扬名 Device system for producing nano spraying circuit boards
CN102765136A (en) * 2012-07-12 2012-11-07 深圳市常兴金刚石磨具有限公司 Grinding machining method for small-sized drill bit
CN102975501B (en) * 2012-12-18 2015-07-15 武汉大学 Circuit board printing system and printing method
CN113301789B (en) * 2021-05-21 2023-04-11 长春思为科技有限公司 Circuit board production equipment for multi-station surface mounting
CN114599149B (en) * 2022-05-10 2022-07-15 四川英创力电子科技股份有限公司 Double-sided precise targeting device and method for HDI board

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1140976A (en) * 1966-09-23 1969-01-22 Marconi Co Ltd Improvements in or relating to photographic picture or pattern apparatus
GB1367601A (en) * 1971-11-23 1974-09-18 Harris G P Circuit systems
US4485387A (en) * 1982-10-26 1984-11-27 Microscience Systems Corp. Inking system for producing circuit patterns
US4654956A (en) * 1985-04-16 1987-04-07 Protocad, Inc. Drill apparatus for use with computer controlled plotter

Also Published As

Publication number Publication date
GB8728865D0 (en) 1988-01-27
CN1035409A (en) 1989-09-06
AU2935789A (en) 1989-07-05
WO1989005566A1 (en) 1989-06-15
IL88634A0 (en) 1989-07-31

Similar Documents

Publication Publication Date Title
EP0251257A3 (en) Method and device for reflow-soldering and reflow-desoldering of printed circuit boards
GB8729701D0 (en) Test apparatus for printed circuit boards
EP0059434A3 (en) Multi-layer printed circuit board and process for production thereof
JPS57149799A (en) Method and device for producing multilayer printed circuit board
GB2126835B (en) System and method for producing artwork for printed circuit boards
GB8912083D0 (en) Device and method for separating printed circuit boards
EP0231795A3 (en) Method for making printed circuit boards
GB2201294B (en) Multilayer printed wiring boards and method for making same
GB2142191B (en) Apparatus for the mounting and wiring of printed circuit boards
ZA873846B (en) Method for manufacture of printed circuit boards
ZA889270B (en) Apparatus and method for the manufacture of printed circuit board and prototypes
ZA873844B (en) Method for manufacture of printed circuit boards
GB2091493B (en) Method and apparatus for making printed circuit boards
EP0152600A3 (en) Method and apparatus for the treatment of printed circuit boards
EP0319827A3 (en) Wiring method and apparatus for electronic circuit boards or the like
EP0457339A3 (en) Method and apparatus for the production of circuit boards
GB8815275D0 (en) Method of manufacturing printed circuit boards
JPS5749297A (en) Printed circuit board and method of producing same
GB2133220B (en) Apparatus for the mounting and wiring of printed circuit boards
JPS5783090A (en) Printed circuit board and method of producing same
JPS5738511A (en) Printed circuit board and method of producing same
ZA873845B (en) Method for manufacture of printed circuit boards
GB2197132B (en) Metal-core printed circuit boards and process for making same
JPS5738578A (en) Printed circuit board and method of producing same
JPS5750492A (en) Printed circuit board and method of producing same