KR900008059A - 알루미늄-결합판과 그로부터 제조된 타게트 - Google Patents

알루미늄-결합판과 그로부터 제조된 타게트 Download PDF

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Publication number
KR900008059A
KR900008059A KR1019890015291A KR890015291A KR900008059A KR 900008059 A KR900008059 A KR 900008059A KR 1019890015291 A KR1019890015291 A KR 1019890015291A KR 890015291 A KR890015291 A KR 890015291A KR 900008059 A KR900008059 A KR 900008059A
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aluminum
layer
bonded plate
aluminium
laminated
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KR1019890015291A
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KR0160114B1 (ko
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두망 크리스티앙
쉬미쯔 노르버트
콰데레르 한스
Original Assignee
쥐르겐 헤르만스, 한스-페터 야스퍼
베레니그테 알루미늄-베르케 아게
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Application filed by 쥐르겐 헤르만스, 한스-페터 야스퍼, 베레니그테 알루미늄-베르케 아게 filed Critical 쥐르겐 헤르만스, 한스-페터 야스퍼
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/04—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/22—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded
    • B23K20/233—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded without ferrous layer
    • B23K20/2333—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded without ferrous layer one layer being aluminium, magnesium or beryllium
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B32B15/016—Layered products comprising a layer of metal all layers being exclusively metallic all layers being formed of aluminium or aluminium alloys
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12639—Adjacent, identical composition, components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12736—Al-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12736—Al-base component
    • Y10T428/12764—Next to Al-base component

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  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Laminated Bodies (AREA)
  • Metal Rolling (AREA)
  • Cookers (AREA)
  • Materials For Medical Uses (AREA)

Abstract

내용 없음

Description

알루미늄-결합판과 그로부터 제조된 타게트
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본발명에 따른 알루미늄 결합판의 횡단면도,
제2도 및 제3도는 본 발명에 따라서 생산된 알루미늄 결합판을 20:1로 확대하여 나타낸 횡단면도.

Claims (7)

  1. 음극비산을 이용한 도금을 위한 타게트로써 이용 가능한 알루미늄-결합판은 순수알루미늄(A1≥99.99)에 이원 또는 삼원으로 용해된 합금으로된 사용층과 지주층으로 구성되었으며, 상기 지주층은 최하경도 HB≥70의 연단된 합금으로 구성되어 있는 것을 특징으로 하는 알루미늄-결합판.
  2. 제1항에 있어서, 알루미늄-결합판은 지주층과 사용층으로 압연도금되어 있는 것을 특징으로 하는 알루미늄-결합판.
  3. 제1항에 있어서, 사용층은 신장도 S＜4에서 평균 입자직경 ＜4mm인것을 특징으로 하는 알루미늄-결합판.
  4. 제1항에 있어서, 사용층의 두께는 10-20mm이며 지주층의 두께는 3-10mm인 것을 특징으로 하는 알루미늄-결합판.
  5. 전제두께중, 20-35%의 지주제작재료 부분에 의해 사용층과 지주층이 온도 350-450℃, 압연도 최하 20%로서 열압연되며, 그후 금속온도 450-550℃사이에서 30분이내에 용해·가열되고 물에 담그었다가 2-16시간동안 160-180℃에 따뜻하게 방치해두는 것을 특징으로 하는 알루미늄-결합판의 제조방법.
  6. 제1항 내지 제4항에 의해 결합판에서 생성된 스퍼터 테크닉을 위한 타게트.
  7. A1MgSi로된 지주층에 의해 금속온도 485-495℃에서 3-10분간 용해·가열되는 것을 특징으로 하는 타게트 제조방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019890015291A 1988-11-25 1989-10-24 복합알루미늄판 및 이것으로 제조된 타겟 KR0160114B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3839775A DE3839775C2 (de) 1988-11-25 1988-11-25 Kathoden-Zerstäubungstarget und Verfahren zu seiner Herstellung
DEP3839775.7 1988-11-25

Publications (2)

Publication Number Publication Date
KR900008059A true KR900008059A (ko) 1990-06-02
KR0160114B1 KR0160114B1 (ko) 1999-01-15

Family

ID=6367855

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019890015291A KR0160114B1 (ko) 1988-11-25 1989-10-24 복합알루미늄판 및 이것으로 제조된 타겟

Country Status (8)

Country Link
US (1) US5032468A (ko)
EP (1) EP0370211B1 (ko)
JP (1) JP2636941B2 (ko)
KR (1) KR0160114B1 (ko)
AT (1) ATE155826T1 (ko)
AU (1) AU615594B2 (ko)
BR (1) BR8905955A (ko)
DE (2) DE3839775C2 (ko)

Families Citing this family (28)

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Publication number Priority date Publication date Assignee Title
US5268236A (en) * 1988-11-25 1993-12-07 Vereinigte Aluminum-Werke Ag Composite aluminum plate for physical coating processes and methods for producing composite aluminum plate and target
US5260142A (en) * 1990-12-28 1993-11-09 Honda Giken Kogyo Kabushiki Kaisha Corrosion-resistant clad material made of aluminum alloys
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US5230459A (en) * 1992-03-18 1993-07-27 Tosoh Smd, Inc. Method of bonding a sputter target-backing plate assembly assemblies produced thereby
KR100348437B1 (ko) * 1992-06-16 2002-10-30 죤슨매트히일렉트로닉스인코오퍼레이티드 스퍼터링타겟어셈블리의제조방법및새로운타겟어셈블리
US5693203A (en) * 1992-09-29 1997-12-02 Japan Energy Corporation Sputtering target assembly having solid-phase bonded interface
US5342496A (en) * 1993-05-18 1994-08-30 Tosoh Smd, Inc. Method of welding sputtering target/backing plate assemblies
US5392981A (en) * 1993-12-06 1995-02-28 Regents Of The University Of California Fabrication of boron sputter targets
AT400174B (de) * 1994-02-21 1995-10-25 Miba Gleitlager Ag Gleitlager
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US5863398A (en) * 1996-10-11 1999-01-26 Johnson Matthey Electonics, Inc. Hot pressed and sintered sputtering target assemblies and method for making same
FR2756572B1 (fr) * 1996-12-04 1999-01-08 Pechiney Aluminium Alliages d'aluminium a temperature de recristallisation elevee utilisee dans les cibles de pulverisation cathodiques
KR100315076B1 (ko) * 1996-12-13 2002-02-28 존슨매테이일렉트로닉스, 인코퍼레이티드 석출경화된후면판을갖는확산결합된스퍼터링타겟조립체및그의제조방법
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US6451179B1 (en) * 1997-01-30 2002-09-17 Applied Materials, Inc. Method and apparatus for enhancing sidewall coverage during sputtering in a chamber having an inductively coupled plasma
KR20010005546A (ko) 1997-03-19 2001-01-15 존슨매테이일렉트로닉스, 인코퍼레이티드 후면에 확산 니켈 플레이트된 타겟과 그의 생성방법
JPH10270446A (ja) * 1997-03-24 1998-10-09 Internatl Business Mach Corp <Ibm> 多層配線層および金属配線層の形成方法
JPH10330929A (ja) * 1997-05-28 1998-12-15 Japan Energy Corp スパッタリングタ−ゲット用バッキングプレ−ト及びスパッタリングタ−ゲット／バッキングプレ−ト組立体
US6451185B2 (en) 1998-08-12 2002-09-17 Honeywell International Inc. Diffusion bonded sputtering target assembly with precipitation hardened backing plate and method of making same
US6780794B2 (en) 2000-01-20 2004-08-24 Honeywell International Inc. Methods of bonding physical vapor deposition target materials to backing plate materials
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US20050112344A1 (en) * 2003-08-20 2005-05-26 Redfern Sean M. Apparatus and method for use in printed circuit board drilling applications
AT501392B1 (de) * 2004-09-13 2007-02-15 Amag Rolling Gmbh Verbundwerkstoff auf aluminiumbasis für einen wärmetauscher mit einem grundwerkstoff
EP2191701B1 (en) 2007-09-28 2013-03-20 Tri-Star Laminates, Inc. Entry sheet, method of manufacturing thereof and methods for drilling holes in printed circuit boards
WO2017023603A1 (en) 2015-08-03 2017-02-09 Honeywell International Inc. Frictionless forged aluminum alloy sputtering target with improved properties
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JP2533573B2 (ja) * 1987-10-05 1996-09-11 田中貴金属工業株式会社 スパッタリング用タ―ゲット

Also Published As

Publication number Publication date
JP2636941B2 (ja) 1997-08-06
EP0370211A2 (de) 1990-05-30
EP0370211A3 (de) 1990-07-18
DE58909809D1 (de) 1997-09-04
AU615594B2 (en) 1991-10-03
BR8905955A (pt) 1990-06-19
KR0160114B1 (ko) 1999-01-15
AU4547789A (en) 1990-06-07
US5032468A (en) 1991-07-16
DE3839775A1 (de) 1990-06-13
JPH02290968A (ja) 1990-11-30
DE3839775C2 (de) 1998-12-24
ATE155826T1 (de) 1997-08-15
EP0370211B1 (de) 1997-07-23

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