KR900001944B1 - 수지조성물 및 그로부터 라미네이트를 제조하는 방법 - Google Patents

수지조성물 및 그로부터 라미네이트를 제조하는 방법 Download PDF

Info

Publication number
KR900001944B1
KR900001944B1 KR1019860006241A KR860006241A KR900001944B1 KR 900001944 B1 KR900001944 B1 KR 900001944B1 KR 1019860006241 A KR1019860006241 A KR 1019860006241A KR 860006241 A KR860006241 A KR 860006241A KR 900001944 B1 KR900001944 B1 KR 900001944B1
Authority
KR
South Korea
Prior art keywords
epoxy resin
resin composition
acid
curing agent
phenol
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
KR1019860006241A
Other languages
English (en)
Korean (ko)
Other versions
KR870001245A (ko
Inventor
섹스턴 다이안
Original Assignee
더 다우 케미칼 캄파니
리차드 지.워터맨
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 더 다우 케미칼 캄파니, 리차드 지.워터맨 filed Critical 더 다우 케미칼 캄파니
Publication of KR870001245A publication Critical patent/KR870001245A/ko
Application granted granted Critical
Publication of KR900001944B1 publication Critical patent/KR900001944B1/ko
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/08—Impregnating
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
    • B32B5/26—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer another layer next to it also being fibrous or filamentary
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G14/00—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00
    • C08G14/02—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes
    • C08G14/04—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes with phenols
    • C08G14/06—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes with phenols and monomers containing hydrogen attached to nitrogen
    • C08G14/08—Ureas; Thioureas
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Materials For Medical Uses (AREA)
  • Insulating Bodies (AREA)
  • Organic Insulating Materials (AREA)
  • Graft Or Block Polymers (AREA)
  • Catalysts (AREA)
  • Measurement Of Force In General (AREA)
KR1019860006241A 1985-07-31 1986-07-30 수지조성물 및 그로부터 라미네이트를 제조하는 방법 Expired KR900001944B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB19290 1985-07-31
GB8519290 1985-07-31
GB858519290A GB8519290D0 (en) 1985-07-31 1985-07-31 Resin composition

Publications (2)

Publication Number Publication Date
KR870001245A KR870001245A (ko) 1987-03-12
KR900001944B1 true KR900001944B1 (ko) 1990-03-26

Family

ID=10583118

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019860006241A Expired KR900001944B1 (ko) 1985-07-31 1986-07-30 수지조성물 및 그로부터 라미네이트를 제조하는 방법

Country Status (17)

Country Link
US (2) US4713137A (cg-RX-API-DMAC10.html)
EP (1) EP0211382B1 (cg-RX-API-DMAC10.html)
JP (1) JPH0772225B2 (cg-RX-API-DMAC10.html)
KR (1) KR900001944B1 (cg-RX-API-DMAC10.html)
CN (1) CN1017248B (cg-RX-API-DMAC10.html)
AT (1) ATE106435T1 (cg-RX-API-DMAC10.html)
AU (1) AU593826B2 (cg-RX-API-DMAC10.html)
BR (1) BR8603615A (cg-RX-API-DMAC10.html)
CA (1) CA1292824C (cg-RX-API-DMAC10.html)
DE (1) DE3689869T2 (cg-RX-API-DMAC10.html)
DK (1) DK364586A (cg-RX-API-DMAC10.html)
ES (1) ES2001053A6 (cg-RX-API-DMAC10.html)
FI (1) FI89807C (cg-RX-API-DMAC10.html)
GB (1) GB8519290D0 (cg-RX-API-DMAC10.html)
IN (1) IN167874B (cg-RX-API-DMAC10.html)
MY (1) MY102533A (cg-RX-API-DMAC10.html)
NO (1) NO171414C (cg-RX-API-DMAC10.html)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1257434A (en) * 1985-08-26 1989-07-11 Gary W. Bogan Encapsulating compositions
DE3776642D1 (de) * 1986-12-15 1992-03-19 Siemens Nixdorf Inf Syst Verfahren zur herstellung von prepregs und deren verwendung.
US4732962A (en) * 1987-02-18 1988-03-22 General Motors Corporation High temperature epoxy tooling composition of bisphenol-A epoxy, trifunctional epoxy, anhydride curing agent and an imidazole catalyst
US4868059A (en) * 1987-11-16 1989-09-19 The Dow Chemical Company Curable composition containing a difunctional epoxy resin, a polyfunctional epoxy resin, a difunctional phenol and a polyfunctional phenol
US5179139A (en) * 1988-10-24 1993-01-12 Mitsubishi Rayon Co., Ltd. Dihydroxybiphenyl-advanced epoxy resin blends
KR0136590B1 (en) * 1988-10-24 1998-04-25 Mitsubishi Rayon Co Epoxy resin composition
US5043184A (en) * 1989-02-06 1991-08-27 Somar Corporation Method of forming electrically conducting layer
ATE107676T1 (de) * 1989-03-03 1994-07-15 Siemens Ag Epoxidharz-formmassen.
US5166289A (en) * 1990-12-19 1992-11-24 Exxon Chemical Patents Inc. Thermoset coating composition having improved hardness
DE4110219A1 (de) * 1991-03-28 1992-10-01 Huels Troisdorf Verfahren zur herstellung von prepregs mit loesungsmittelfreiem epoxidharz
EP0507271A3 (en) * 1991-04-03 1993-04-21 The Dow Chemical Company Epoxy resin compositions for use in electrical laminates
US5478607A (en) * 1991-05-17 1995-12-26 Hitachi Telecon Technologies Ltd. Method for use of preflux, printed wiring board, and method for production thereof
US5364925A (en) * 1992-01-27 1994-11-15 The Dow Chemical Company Epoxy resin advanced with a dihydric phenol and further chain extended with an additional dihydric phenol for use in electrical laminates
WO1996028490A1 (en) * 1995-03-14 1996-09-19 Nissan Chemical Industries, Ltd. Heat-resistant epoxy resin composition
US6207595B1 (en) * 1998-03-02 2001-03-27 International Business Machines Corporation Laminate and method of manufacture thereof
JPH11279376A (ja) * 1998-03-27 1999-10-12 Hitachi Chem Co Ltd 印刷配線板用エポキシ樹脂組成物およびこれを用いた印刷配線板
ATE277103T1 (de) * 2002-01-28 2004-10-15 Abb Research Ltd Vergussmasse auf der basis duroplastischer epoxidharze
US7094843B2 (en) * 2002-08-19 2006-08-22 3M Innovative Properties Company Epoxy compositions having improved shelf life and articles containing the same
US6855738B2 (en) 2003-06-06 2005-02-15 Dow Global Technologies Inc. Nanoporous laminates
US7145221B2 (en) * 2004-03-31 2006-12-05 Endicott Interconnect Technologies, Inc. Low moisture absorptive circuitized substrate, method of making same, electrical assembly utilizing same, and information handling system utilizing same
US7078816B2 (en) * 2004-03-31 2006-07-18 Endicott Interconnect Technologies, Inc. Circuitized substrate
US7270845B2 (en) * 2004-03-31 2007-09-18 Endicott Interconnect Technologies, Inc. Dielectric composition for forming dielectric layer for use in circuitized substrates
DE602005014500D1 (de) * 2004-10-27 2009-06-25 Nitto Boseki Co Ltd Wärmebeständiger verbundwerkstoff
KR101442304B1 (ko) * 2007-06-15 2014-09-22 다우 글로벌 테크놀로지스 엘엘씨 에폭시 수지 조성물을 사용한 복합재 제조 방법
US8455573B2 (en) * 2010-12-20 2013-06-04 E I Du Pont De Nemours And Company Curable composition comprising imidazolium monocarboxylate salt
EP3261814B1 (en) 2015-02-27 2023-04-19 Huntsman Advanced Materials Licensing (Switzerland) GmbH A process for manufacturing a fiber reinforced composite article, the composite article obtained and the use thereof

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3314912A (en) * 1963-01-23 1967-04-18 Hooker Chemical Corp Epoxy resin compositions containing triorgano phosphate diluents
US3640917A (en) * 1968-01-25 1972-02-08 Hoechst Ag Cellular plastics of epoxy resins and process for their manufacture
DE1770400A1 (de) * 1968-05-13 1972-04-06 Hoechst Ag Verfahren zur Herstellung von Epoxidharzschaumstoffen
US3577370A (en) * 1968-08-05 1971-05-04 Armour Ind Chem Co Modifier for phenolic resins
US3842037A (en) * 1972-06-08 1974-10-15 Shell Oil Co Process for preparing higher molecular weight polyepoxide products by condensing lower molecular weight polyepoxide with polyhydric phenols
US4046733A (en) * 1975-12-30 1977-09-06 Westinghouse Electric Corporation Sulfonic acid composition for forming thermoparticulating coating
GB2038348A (en) * 1978-12-12 1980-07-23 Desai Polymer Dev Phenolic materials
US4331582A (en) * 1980-01-14 1982-05-25 Hitco Epoxy latent catalyst
US4366295A (en) * 1981-06-01 1982-12-28 The Dow Chemical Company Stable precatalyzed epoxy resin compositions
US4433014A (en) * 1982-06-21 1984-02-21 Desoto, Inc. Pigmented, corrosion resistant, thermosetting coating compositions
US4393181A (en) * 1982-06-30 1983-07-12 Shell Oil Company Polyfunctional phenolic-melamine epoxy resin curing agents
US4438254A (en) * 1983-02-28 1984-03-20 The Dow Chemical Company Process for producing epoxy resins
WO1985002085A1 (en) * 1983-10-25 1985-05-09 The Commonwealth Of Australia Hearing aid amplification method and apparatus
CA1276358C (en) * 1984-01-31 1990-11-13 Dieter H. Klein Epoxy resin for preparing electric laminates
US4528359A (en) * 1984-05-16 1985-07-09 The Dow Chemical Company Adducts of epoxy resins and amino-substituted aromatic sulfonic acid amides
US4668718A (en) * 1984-10-05 1987-05-26 Ciba-Geigy Corporation Self-extinguishing, track-resistant epoxy resin moulding composition and use thereof
US4604317A (en) * 1984-10-05 1986-08-05 The Dow Chemical Company Curable compositions containing a polyepoxide and a halogenated bisphenol

Also Published As

Publication number Publication date
BR8603615A (pt) 1987-03-10
FI863136L (fi) 1987-02-01
DE3689869T2 (de) 1994-11-17
EP0211382A2 (en) 1987-02-25
EP0211382A3 (en) 1988-08-24
FI89807B (fi) 1993-08-13
DE3689869D1 (de) 1994-07-07
US4959400A (en) 1990-09-25
DK364586A (da) 1987-02-01
FI863136A0 (fi) 1986-07-31
NO171414B (no) 1992-11-30
JPH0772225B2 (ja) 1995-08-02
EP0211382B1 (en) 1994-06-01
CA1292824C (en) 1991-12-03
MY102533A (en) 1992-07-31
NO863074L (no) 1987-02-02
CN1017248B (zh) 1992-07-01
DK364586D0 (da) 1986-07-31
FI89807C (fi) 1993-11-25
ES2001053A6 (es) 1988-04-16
CN86105670A (zh) 1987-03-25
AU593826B2 (en) 1990-02-22
AU6074886A (en) 1987-02-05
JPS6270415A (ja) 1987-03-31
US4713137A (en) 1987-12-15
IN167874B (cg-RX-API-DMAC10.html) 1991-01-05
GB8519290D0 (en) 1985-09-04
ATE106435T1 (de) 1994-06-15
NO863074D0 (no) 1986-07-30
KR870001245A (ko) 1987-03-12
NO171414C (no) 1993-03-10

Similar Documents

Publication Publication Date Title
US4959400A (en) Resin composition comprising a polyhydric phenolic hardener
US20020032279A1 (en) Flame retardant resin and flame retardant composition containing the same
AU557131B2 (en) Epoxy resin composition and process for preparing laminates therefrom
US20090321117A1 (en) A curable epoxy resin composition having a mixed catalyst system and laminates made therefrom
US4604317A (en) Curable compositions containing a polyepoxide and a halogenated bisphenol
WO2007075769A1 (en) A curable epoxy resin composition and laminates made therefrom
US5075155A (en) Novel prepregs
US4756954A (en) Epoxy resin laminating varnish and laminates prepared therefrom
US5405931A (en) Epoxy resin compositions for use in electrical laminates
US6214455B1 (en) Bisphenol A and novolak epoxy resins with nitrogen-containing phenolic resin
US5830973A (en) Phosphorus-modified epoxy resins comprising epoxy resins and phosphorus-containing compounds
EP0154789B1 (en) Polyfunctional phenolic reaction product, a process for its preparation and its use
JPH069752A (ja) エポキシ樹脂組成物及びその硬化物
US5854371A (en) Phosphorus-modified epoxy resin mixtures comprising epoxy resins, phosphorus-containing compounds and a curing agent
KR19980018789A (ko) 비스에폭시 화합물 및 p-구아나민의 부가물(adduct of bisepoxy compound and p-guanamine)
US5006615A (en) Hydantoin or barbituric acid-extended epoxy resin composition

Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

G160 Decision to publish patent application
PG1605 Publication of application before grant of patent

St.27 status event code: A-2-2-Q10-Q13-nap-PG1605

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

FPAY Annual fee payment

Payment date: 19941223

Year of fee payment: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 19960327

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 19960327

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000