DK364586A - Epoxyharpiksmateriale og dets anvendelse - Google Patents

Epoxyharpiksmateriale og dets anvendelse Download PDF

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Publication number
DK364586A
DK364586A DK364586A DK364586A DK364586A DK 364586 A DK364586 A DK 364586A DK 364586 A DK364586 A DK 364586A DK 364586 A DK364586 A DK 364586A DK 364586 A DK364586 A DK 364586A
Authority
DK
Denmark
Prior art keywords
epoxy resin
bisphenol
preparation
acid
resin material
Prior art date
Application number
DK364586A
Other languages
English (en)
Other versions
DK364586D0 (da
Inventor
Diane Sexton
Original Assignee
Dow Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Chemical Co filed Critical Dow Chemical Co
Publication of DK364586D0 publication Critical patent/DK364586D0/da
Publication of DK364586A publication Critical patent/DK364586A/da

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/08Impregnating
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50Amines
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/14Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/20Layered products comprising a layer of metal comprising aluminium or copper
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • B32B5/24Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
    • B32B5/26Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer another layer next to it also being fibrous or filamentary
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G14/00Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00
    • C08G14/02Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes
    • C08G14/04Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes with phenols
    • C08G14/06Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes with phenols and monomers containing hydrogen attached to nitrogen
    • C08G14/08Ureas; Thioureas
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62Alcohols or phenols
    • C08G59/621Phenols
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02Composition of the impregnated, bonded or embedded layer
    • B32B2260/021Fibrous or filamentary layer
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04Impregnation, embedding, or binder material
    • B32B2260/046Synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/20Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202Conductive
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/032Organic insulating material consisting of one material
    • H05K1/0326Organic insulating material consisting of one material containing O

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Materials For Medical Uses (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Organic Insulating Materials (AREA)
  • Insulating Bodies (AREA)
  • Catalysts (AREA)
  • Measurement Of Force In General (AREA)
  • Graft Or Block Polymers (AREA)
DK364586A 1985-07-31 1986-07-31 Epoxyharpiksmateriale og dets anvendelse DK364586A (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB858519290A GB8519290D0 (en) 1985-07-31 1985-07-31 Resin composition

Publications (2)

Publication Number Publication Date
DK364586D0 DK364586D0 (da) 1986-07-31
DK364586A true DK364586A (da) 1987-02-01

Family

ID=10583118

Family Applications (1)

Application Number Title Priority Date Filing Date
DK364586A DK364586A (da) 1985-07-31 1986-07-31 Epoxyharpiksmateriale og dets anvendelse

Country Status (17)

Country Link
US (2) US4713137A (da)
EP (1) EP0211382B1 (da)
JP (1) JPH0772225B2 (da)
KR (1) KR900001944B1 (da)
CN (1) CN1017248B (da)
AT (1) ATE106435T1 (da)
AU (1) AU593826B2 (da)
BR (1) BR8603615A (da)
CA (1) CA1292824C (da)
DE (1) DE3689869T2 (da)
DK (1) DK364586A (da)
ES (1) ES2001053A6 (da)
FI (1) FI89807C (da)
GB (1) GB8519290D0 (da)
IN (1) IN167874B (da)
MY (1) MY102533A (da)
NO (1) NO171414C (da)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1257434A (en) * 1985-08-26 1989-07-11 Gary W. Bogan Encapsulating compositions
DE3776642D1 (de) * 1986-12-15 1992-03-19 Siemens Nixdorf Inf Syst Verfahren zur herstellung von prepregs und deren verwendung.
US4732962A (en) * 1987-02-18 1988-03-22 General Motors Corporation High temperature epoxy tooling composition of bisphenol-A epoxy, trifunctional epoxy, anhydride curing agent and an imidazole catalyst
US4868059A (en) * 1987-11-16 1989-09-19 The Dow Chemical Company Curable composition containing a difunctional epoxy resin, a polyfunctional epoxy resin, a difunctional phenol and a polyfunctional phenol
US5179139A (en) * 1988-10-24 1993-01-12 Mitsubishi Rayon Co., Ltd. Dihydroxybiphenyl-advanced epoxy resin blends
JP2829369B2 (ja) * 1988-10-24 1998-11-25 三菱レイヨン株式会社 エポキシ樹脂組成物
US5043184A (en) * 1989-02-06 1991-08-27 Somar Corporation Method of forming electrically conducting layer
ATE107676T1 (de) * 1989-03-03 1994-07-15 Siemens Ag Epoxidharz-formmassen.
US5166289A (en) * 1990-12-19 1992-11-24 Exxon Chemical Patents Inc. Thermoset coating composition having improved hardness
DE4110219A1 (de) * 1991-03-28 1992-10-01 Huels Troisdorf Verfahren zur herstellung von prepregs mit loesungsmittelfreiem epoxidharz
MY131084A (en) * 1991-04-03 2007-07-31 Dow Chemical Co Epoxy resin compositions for use in electrical laminates.
US5478607A (en) * 1991-05-17 1995-12-26 Hitachi Telecon Technologies Ltd. Method for use of preflux, printed wiring board, and method for production thereof
US5364925A (en) * 1992-01-27 1994-11-15 The Dow Chemical Company Epoxy resin advanced with a dihydric phenol and further chain extended with an additional dihydric phenol for use in electrical laminates
WO1996028490A1 (fr) * 1995-03-14 1996-09-19 Nissan Chemical Industries, Ltd. Composition refractaire a base de resine epoxy
US6207595B1 (en) * 1998-03-02 2001-03-27 International Business Machines Corporation Laminate and method of manufacture thereof
JPH11279376A (ja) * 1998-03-27 1999-10-12 Hitachi Chem Co Ltd 印刷配線板用エポキシ樹脂組成物およびこれを用いた印刷配線板
ATE277103T1 (de) * 2002-01-28 2004-10-15 Abb Research Ltd Vergussmasse auf der basis duroplastischer epoxidharze
US7094843B2 (en) * 2002-08-19 2006-08-22 3M Innovative Properties Company Epoxy compositions having improved shelf life and articles containing the same
US6855738B2 (en) 2003-06-06 2005-02-15 Dow Global Technologies Inc. Nanoporous laminates
US7145221B2 (en) * 2004-03-31 2006-12-05 Endicott Interconnect Technologies, Inc. Low moisture absorptive circuitized substrate, method of making same, electrical assembly utilizing same, and information handling system utilizing same
US7270845B2 (en) * 2004-03-31 2007-09-18 Endicott Interconnect Technologies, Inc. Dielectric composition for forming dielectric layer for use in circuitized substrates
US7078816B2 (en) * 2004-03-31 2006-07-18 Endicott Interconnect Technologies, Inc. Circuitized substrate
WO2006046534A1 (ja) * 2004-10-27 2006-05-04 Nagase Chemtex Corporation 耐熱複合材料
EP2162481A1 (en) * 2007-06-15 2010-03-17 Dow Global Technologies Inc. Process for preparing composites using epoxy resin compositions
US8455573B2 (en) * 2010-12-20 2013-06-04 E I Du Pont De Nemours And Company Curable composition comprising imidazolium monocarboxylate salt
EP3261814B1 (en) 2015-02-27 2023-04-19 Huntsman Advanced Materials Licensing (Switzerland) GmbH A process for manufacturing a fiber reinforced composite article, the composite article obtained and the use thereof

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3314912A (en) * 1963-01-23 1967-04-18 Hooker Chemical Corp Epoxy resin compositions containing triorgano phosphate diluents
US3640917A (en) * 1968-01-25 1972-02-08 Hoechst Ag Cellular plastics of epoxy resins and process for their manufacture
DE1770400A1 (de) * 1968-05-13 1972-04-06 Hoechst Ag Verfahren zur Herstellung von Epoxidharzschaumstoffen
US3577370A (en) * 1968-08-05 1971-05-04 Armour Ind Chem Co Modifier for phenolic resins
US3842037A (en) * 1972-06-08 1974-10-15 Shell Oil Co Process for preparing higher molecular weight polyepoxide products by condensing lower molecular weight polyepoxide with polyhydric phenols
US4046733A (en) * 1975-12-30 1977-09-06 Westinghouse Electric Corporation Sulfonic acid composition for forming thermoparticulating coating
GB2038348A (en) * 1978-12-12 1980-07-23 Desai Polymer Dev Phenolic materials
US4331582A (en) * 1980-01-14 1982-05-25 Hitco Epoxy latent catalyst
US4366295A (en) * 1981-06-01 1982-12-28 The Dow Chemical Company Stable precatalyzed epoxy resin compositions
US4433014A (en) * 1982-06-21 1984-02-21 Desoto, Inc. Pigmented, corrosion resistant, thermosetting coating compositions
US4393181A (en) * 1982-06-30 1983-07-12 Shell Oil Company Polyfunctional phenolic-melamine epoxy resin curing agents
US4438254A (en) * 1983-02-28 1984-03-20 The Dow Chemical Company Process for producing epoxy resins
EP0160054A1 (en) * 1983-10-25 1985-11-06 The Commonwealth Of Australia Hearing aid amplification method and apparatus
CA1276358C (en) * 1984-01-31 1990-11-13 Dieter H. Klein Epoxy resin for preparing electric laminates
US4528359A (en) * 1984-05-16 1985-07-09 The Dow Chemical Company Adducts of epoxy resins and amino-substituted aromatic sulfonic acid amides
US4668718A (en) * 1984-10-05 1987-05-26 Ciba-Geigy Corporation Self-extinguishing, track-resistant epoxy resin moulding composition and use thereof
US4604317A (en) * 1984-10-05 1986-08-05 The Dow Chemical Company Curable compositions containing a polyepoxide and a halogenated bisphenol

Also Published As

Publication number Publication date
KR870001245A (ko) 1987-03-12
EP0211382A3 (en) 1988-08-24
FI863136A (fi) 1987-02-01
EP0211382B1 (en) 1994-06-01
US4959400A (en) 1990-09-25
US4713137A (en) 1987-12-15
DK364586D0 (da) 1986-07-31
DE3689869T2 (de) 1994-11-17
ES2001053A6 (es) 1988-04-16
AU6074886A (en) 1987-02-05
FI89807B (fi) 1993-08-13
EP0211382A2 (en) 1987-02-25
NO171414B (no) 1992-11-30
CN86105670A (zh) 1987-03-25
DE3689869D1 (de) 1994-07-07
NO171414C (no) 1993-03-10
JPH0772225B2 (ja) 1995-08-02
AU593826B2 (en) 1990-02-22
FI89807C (fi) 1993-11-25
NO863074L (no) 1987-02-02
ATE106435T1 (de) 1994-06-15
KR900001944B1 (ko) 1990-03-26
CN1017248B (zh) 1992-07-01
CA1292824C (en) 1991-12-03
GB8519290D0 (en) 1985-09-04
IN167874B (da) 1991-01-05
NO863074D0 (no) 1986-07-30
MY102533A (en) 1992-07-31
JPS6270415A (ja) 1987-03-31
FI863136A0 (fi) 1986-07-31
BR8603615A (pt) 1987-03-10

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Legal Events

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AHB Application shelved due to non-payment