KR900000857B1 - 납땜가능한 전도성 중합체조성물 및 그 제조방법 - Google Patents

납땜가능한 전도성 중합체조성물 및 그 제조방법 Download PDF

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Publication number
KR900000857B1
KR900000857B1 KR1019850003344A KR850003344A KR900000857B1 KR 900000857 B1 KR900000857 B1 KR 900000857B1 KR 1019850003344 A KR1019850003344 A KR 1019850003344A KR 850003344 A KR850003344 A KR 850003344A KR 900000857 B1 KR900000857 B1 KR 900000857B1
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KR
South Korea
Prior art keywords
acid
conductive polymer
polymer composition
metal
saturated monocarboxylic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
KR1019850003344A
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English (en)
Korean (ko)
Other versions
KR850008225A (ko
Inventor
세인트 죤 프랭크
웨인 마틴 프랭크
Original Assignee
엘렉트로 머티리얼즈 코오포레이션오브 어메리카
프랑수와 뷔이슨
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘렉트로 머티리얼즈 코오포레이션오브 어메리카, 프랑수와 뷔이슨 filed Critical 엘렉트로 머티리얼즈 코오포레이션오브 어메리카
Publication of KR850008225A publication Critical patent/KR850008225A/ko
Application granted granted Critical
Publication of KR900000857B1 publication Critical patent/KR900000857B1/ko
Expired legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F5/00—Screening processes; Screens therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24—Electrically-conducting paints
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wood Science & Technology (AREA)
  • General Physics & Mathematics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Epoxy Resins (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Laminated Bodies (AREA)
KR1019850003344A 1984-05-21 1985-05-16 납땜가능한 전도성 중합체조성물 및 그 제조방법 Expired KR900000857B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US06/612,184 US4548879A (en) 1984-05-21 1984-05-21 Solderable polymer thick films
US612184 1984-05-21
US612,184 1984-05-21

Publications (2)

Publication Number Publication Date
KR850008225A KR850008225A (ko) 1985-12-13
KR900000857B1 true KR900000857B1 (ko) 1990-02-17

Family

ID=24452091

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019850003344A Expired KR900000857B1 (ko) 1984-05-21 1985-05-16 납땜가능한 전도성 중합체조성물 및 그 제조방법

Country Status (8)

Country Link
US (1) US4548879A (https=)
EP (1) EP0162698B1 (https=)
JP (1) JPS612202A (https=)
KR (1) KR900000857B1 (https=)
AT (1) ATE52355T1 (https=)
CA (1) CA1286439C (https=)
DE (1) DE3577369D1 (https=)
PH (1) PH20682A (https=)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4689250A (en) * 1984-11-16 1987-08-25 Siemens Aktiengesellschaft Cross-linked polymer coated metal particle filler compositions
DE3809350A1 (de) * 1988-03-19 1989-09-28 Hoechst Ceram Tec Ag Verfahren zur erhoehung der brennschwindung von keramischen foliengiessmassen
JPH0457961A (ja) * 1990-06-22 1992-02-25 Keiji Tanaka でんぷんを用いたしみ抜き剤
US5882722A (en) * 1995-07-12 1999-03-16 Partnerships Limited, Inc. Electrical conductors formed from mixtures of metal powders and metallo-organic decompositions compounds
US6338809B1 (en) * 1997-02-24 2002-01-15 Superior Micropowders Llc Aerosol method and apparatus, particulate products, and electronic devices made therefrom
JP2001513697A (ja) 1997-02-24 2001-09-04 スーペリア マイクロパウダーズ リミテッド ライアビリティ カンパニー エアロゾル法及び装置、粒子製品、並びに該粒子製品から製造される電子装置
US20030148024A1 (en) * 2001-10-05 2003-08-07 Kodas Toivo T. Low viscosity precursor compositons and methods for the depositon of conductive electronic features
US7629017B2 (en) * 2001-10-05 2009-12-08 Cabot Corporation Methods for the deposition of conductive electronic features
US20060159838A1 (en) * 2005-01-14 2006-07-20 Cabot Corporation Controlling ink migration during the formation of printable electronic features
US7524528B2 (en) 2001-10-05 2009-04-28 Cabot Corporation Precursor compositions and methods for the deposition of passive electrical components on a substrate
US6951666B2 (en) * 2001-10-05 2005-10-04 Cabot Corporation Precursor compositions for the deposition of electrically conductive features
JP4763237B2 (ja) * 2001-10-19 2011-08-31 キャボット コーポレイション 基板上に導電性電子部品を製造する方法
US7553512B2 (en) 2001-11-02 2009-06-30 Cabot Corporation Method for fabricating an inorganic resistor
WO2004015002A2 (en) * 2002-08-07 2004-02-19 Dow Corning Toray Silicone Co., Ltd. Thermoconductive filler, thermocoductive silicone elastomer composition, and semiconductor devices
US6878184B1 (en) 2002-08-09 2005-04-12 Kovio, Inc. Nanoparticle synthesis and the formation of inks therefrom
US7078276B1 (en) 2003-01-08 2006-07-18 Kovio, Inc. Nanoparticles and method for making the same
US7527749B2 (en) * 2004-10-18 2009-05-05 Georgia Tech Research Corporation Electrically conductive adhesives and methods of making
WO2006076606A2 (en) 2005-01-14 2006-07-20 Cabot Corporation Optimized multi-layer printing of electronics and displays
TW200640596A (en) 2005-01-14 2006-12-01 Cabot Corp Production of metal nanoparticles
US8383014B2 (en) 2010-06-15 2013-02-26 Cabot Corporation Metal nanoparticle compositions
WO2006076609A2 (en) 2005-01-14 2006-07-20 Cabot Corporation Printable electronic features on non-uniform substrate and processes for making same
WO2006076608A2 (en) 2005-01-14 2006-07-20 Cabot Corporation A system and process for manufacturing custom electronics by combining traditional electronics with printable electronics
US7824466B2 (en) 2005-01-14 2010-11-02 Cabot Corporation Production of metal nanoparticles
US20080010815A1 (en) * 2006-07-17 2008-01-17 W.E.T. Automotive Group Ag Heating tape structure

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE500569A (https=) * 1950-01-13
AU6743574A (en) * 1973-05-07 1975-10-02 Douglas Arnold Griswold Luminescent screen
DE2616394C3 (de) * 1976-04-14 1980-08-07 Battelle-Institut E.V., 6000 Frankfurt Verfahren zur Herstellung von supraleitfähigem, aus einer Kunststoff- oder Glas-Matrix mit eingelagerten Teilchen bestehendem Material
US4331714A (en) * 1979-06-29 1982-05-25 E. I. Dupont De Nemours And Company Process of making flake silver powders with chemisorbed monolayer of dispersant
US4333966A (en) * 1979-07-30 1982-06-08 Graham Magnetics, Inc. Method of forming a conductive metal pattern
JPS56103260A (en) * 1980-01-22 1981-08-18 Asahi Kagaku Kenkyusho:Kk Conductive paint containing copper powder
JPS57125273A (en) * 1981-01-29 1982-08-04 Toyamaken Electrically conductive coating material made with hydroquinone derivative
JPS6058268B2 (ja) * 1981-10-29 1985-12-19 藤倉化成株式会社 導電性銅ペ−スト組成物
JPS6099182A (ja) * 1983-11-04 1985-06-03 Atsugi Chuo Kenkyusho Kk シアノアクリレート混合用金属粉

Also Published As

Publication number Publication date
DE3577369D1 (de) 1990-05-31
ATE52355T1 (de) 1990-05-15
KR850008225A (ko) 1985-12-13
JPH0371726B2 (https=) 1991-11-14
US4548879A (en) 1985-10-22
EP0162698B1 (en) 1990-04-25
EP0162698A1 (en) 1985-11-27
CA1286439C (en) 1991-07-16
PH20682A (en) 1987-03-24
JPS612202A (ja) 1986-01-08

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