KR900000206B1 - 전력용 반도체 모듈의 배선구조 - Google Patents

전력용 반도체 모듈의 배선구조 Download PDF

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Publication number
KR900000206B1
KR900000206B1 KR1019850002304A KR850002304A KR900000206B1 KR 900000206 B1 KR900000206 B1 KR 900000206B1 KR 1019850002304 A KR1019850002304 A KR 1019850002304A KR 850002304 A KR850002304 A KR 850002304A KR 900000206 B1 KR900000206 B1 KR 900000206B1
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South Korea
Prior art keywords
power semiconductor
conductive layer
conductor
semiconductor module
wiring structure
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KR1019850002304A
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Korean (ko)
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KR850008557A (ko
Inventor
시노부 다까하마
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미쓰비시 전기 주식회사
카다 야마히도 하지로
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Publication of KR850008557A publication Critical patent/KR850008557A/ko
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
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    • H01L23/00—Details of semiconductor or other solid state devices
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    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
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    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
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    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
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    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
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    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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    • Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
    • Y10S257/915—Active solid-state devices, e.g. transistors, solid-state diodes with titanium nitride portion or region

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Inverter Devices (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
KR1019850002304A 1984-05-11 1985-04-06 전력용 반도체 모듈의 배선구조 Expired KR900000206B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP59-95113 1984-05-11
JP59095113A JPS60239051A (ja) 1984-05-11 1984-05-11 半導体装置

Publications (2)

Publication Number Publication Date
KR850008557A KR850008557A (ko) 1985-12-18
KR900000206B1 true KR900000206B1 (ko) 1990-01-23

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KR1019850002304A Expired KR900000206B1 (ko) 1984-05-11 1985-04-06 전력용 반도체 모듈의 배선구조

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US (1) US5038194A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JPS60239051A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
KR (1) KR900000206B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE (1) DE3516995A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

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DE3604313A1 (de) * 1986-02-12 1987-08-13 Bbc Brown Boveri & Cie Leistungshalbleitermodul
US4907068A (en) * 1987-01-21 1990-03-06 Siemens Aktiengesellschaft Semiconductor arrangement having at least one semiconductor body
JPH0740790B2 (ja) * 1987-02-23 1995-05-01 株式会社東芝 大電力パワ−モジユ−ル
IT1202657B (it) * 1987-03-09 1989-02-09 Sgs Microelettronica Spa Procedimento di fabbricazione di un dispositivo modulare di potenza a semiconduttore e dispositivo con esso ottenento
DE3717489A1 (de) * 1987-05-23 1988-12-01 Asea Brown Boveri Leistungshalbleitermodul und verfahren zur herstellung des moduls
JPH03106029A (ja) * 1989-09-20 1991-05-02 Fujitsu Ltd ウエハ・スケール・ｉｃ
US5731970A (en) * 1989-12-22 1998-03-24 Hitachi, Ltd. Power conversion device and semiconductor module suitable for use in the device
US5038197A (en) * 1990-06-26 1991-08-06 Harris Semiconductor Patents, Inc. Hermetically sealed die package with floating source
NL9101453A (nl) * 1990-09-10 1992-04-01 Barmag Barmer Maschf Frequentie-omvormer.
DE4105155C2 (de) * 1991-02-20 1994-07-07 Export Contor Ausenhandelsgese Stromrichterschaltungsanordnung
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DE3516995A1 (de) 1985-11-14
DE3516995C2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1993-06-24
KR850008557A (ko) 1985-12-18
JPS60239051A (ja) 1985-11-27
US5038194A (en) 1991-08-06

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