KR890007939Y1 - 기판의 지지 구조체 - Google Patents
기판의 지지 구조체 Download PDFInfo
- Publication number
- KR890007939Y1 KR890007939Y1 KR2019850004879U KR850004879U KR890007939Y1 KR 890007939 Y1 KR890007939 Y1 KR 890007939Y1 KR 2019850004879 U KR2019850004879 U KR 2019850004879U KR 850004879 U KR850004879 U KR 850004879U KR 890007939 Y1 KR890007939 Y1 KR 890007939Y1
- Authority
- KR
- South Korea
- Prior art keywords
- printed circuit
- chassis
- pieces
- printed
- circuit board
- Prior art date
Links
- 239000002184 metal Substances 0.000 claims description 18
- 229910000679 solder Inorganic materials 0.000 claims description 14
- 239000000758 substrate Substances 0.000 claims description 13
- 238000005476 soldering Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/04—Arrangements of circuit components or wiring on supporting structure on conductive chassis
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4641—Manufacturing multilayer circuits by laminating two or more circuit boards having integrally laminated metal sheets or special power cores
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0215—Grounding of printed circuits by connection to external grounding means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0397—Tab
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/0919—Exposing inner circuit layers or metal planes at the side edge of the printed circuit board [PCB] or at the walls of large holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/063—Lamination of preperforated insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Combinations Of Printed Boards (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1984152747U JPH0412714Y2 (US06265458-20010724-C00056.png) | 1984-10-09 | 1984-10-09 | |
JP152747 | 1984-10-09 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR860005454U KR860005454U (ko) | 1986-06-11 |
KR890007939Y1 true KR890007939Y1 (ko) | 1989-11-10 |
Family
ID=15547276
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR2019850004879U KR890007939Y1 (ko) | 1984-10-09 | 1985-04-29 | 기판의 지지 구조체 |
Country Status (5)
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4873764A (en) * | 1987-12-23 | 1989-10-17 | Zenith Electronics Corporation | Component mounting process for printed circuit boards |
JPH02187093A (ja) * | 1989-01-13 | 1990-07-23 | Toshiba Corp | 印刷配線板 |
US5162971A (en) * | 1989-03-23 | 1992-11-10 | Matsushita Electric Industrial Co., Ltd. | High-density circuit module and process for producing same |
US5189638A (en) * | 1990-04-26 | 1993-02-23 | Mitsubishi Denki Kabushiki Kaisha | Portable semiconductor memory device |
DE4036081C2 (de) * | 1990-04-26 | 1994-10-06 | Mitsubishi Electric Corp | Halbleiterspeicher-Steckmodul |
US5090918A (en) * | 1990-05-31 | 1992-02-25 | John Fluke Mfg. Co., Inc. | Isothermal termination block having a multi-layer thermal conductor |
JP3018640B2 (ja) * | 1991-08-29 | 2000-03-13 | ソニー株式会社 | 回路接続基板構造 |
US5184283A (en) * | 1991-12-23 | 1993-02-02 | Ford Motor Company | Power device assembly and method |
US5311407A (en) * | 1992-04-30 | 1994-05-10 | Siemens Components, Inc. | Printed circuit based for mounted semiconductors and other electronic components |
US5272599A (en) * | 1993-03-19 | 1993-12-21 | Compaq Computer Corporation | Microprocessor heat dissipation apparatus for a printed circuit board |
JPH07105759B2 (ja) * | 1993-03-30 | 1995-11-13 | 山一電機株式会社 | 光電変換器 |
WO1997001263A1 (fr) * | 1995-06-20 | 1997-01-09 | Matsushita Electric Industrial Co., Ltd. | Dispositif de maintien de piece, substrat dote de ce dispositif et son procede de fabrication |
DE19535490A1 (de) * | 1995-09-23 | 1997-03-27 | Bosch Gmbh Robert | Schaltungsplatine sowie Verfahren zum Herstellen einer Schaltungsplatine |
DE19600617A1 (de) * | 1996-01-10 | 1997-07-17 | Bosch Gmbh Robert | Elektrisches Gerät |
US6078359A (en) * | 1996-07-15 | 2000-06-20 | The Regents Of The University Of California | Vacuum compatible miniature CCD camera head |
DE19636181A1 (de) * | 1996-09-06 | 1998-03-12 | Philips Patentverwaltung | HF-Modul, z. B. Tuner |
FR2822632B1 (fr) * | 2001-03-21 | 2004-01-23 | Sagem | Carte electronique et circuit correspondant |
JP3787291B2 (ja) * | 2001-08-22 | 2006-06-21 | ペンタックス株式会社 | Emcコア支持、シールド、及び放熱の為の構造 |
DE20211560U1 (de) * | 2002-07-12 | 2003-12-11 | Ghw Grote & Hartmann Gmbh | Leiterplattenelement mit einer Stromversorgungsvorrichtung für auf der Leiterplatte angeordnete elektrische und elektronische Bauelemente |
WO2005002302A1 (en) * | 2003-06-24 | 2005-01-06 | Bae Systems Plc | Flexi-rigid printed circuit board with integral flexible heat sink area |
US20050276024A1 (en) * | 2004-06-10 | 2005-12-15 | Westbury Steven D | Flexi-rigid printed circuit board with integral flexible heat sink area |
JP2023085706A (ja) * | 2021-12-09 | 2023-06-21 | 日本航空電子工業株式会社 | 組立体及びハーネス組立体 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2586854A (en) * | 1947-04-19 | 1952-02-26 | Farnsworth Res Corp | Printed circuit construction |
US3202879A (en) * | 1959-12-24 | 1965-08-24 | Ibm | Encapsulated circuit card |
DE1195829C2 (de) * | 1962-11-28 | 1979-07-26 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Elektrisches geraetechassis und verfahren zu seiner herstellung |
FR1403061A (fr) * | 1964-05-06 | 1965-06-18 | Commissariat Energie Atomique | Masse électrique, notamment pour plaquettes de circuits imprimés |
US3348101A (en) * | 1964-05-27 | 1967-10-17 | Itt | Cordwood module with heat sink fence |
US3409805A (en) * | 1965-08-12 | 1968-11-05 | Foxboro Co | Printed-circuit board coupling circuit with d-c isolation |
US3506877A (en) * | 1968-09-25 | 1970-04-14 | Us Navy | Hermetically sealed and shielded circuit module |
DE1911779B2 (de) * | 1969-03-07 | 1971-10-21 | Verdrahtungsanordnung zur elektrischen verbindung voneinan der verschiedener anschlussebenen | |
GB1411080A (en) * | 1971-11-17 | 1975-10-22 | Lucas Industries Ltd | Mounting arrangements for printed circuit boards |
IT1008331B (it) * | 1973-03-28 | 1976-11-10 | Rca Corp | Pannello composito a circuito stampato |
AT348018B (de) * | 1975-04-16 | 1979-01-25 | Siemens Ag Oesterreich | Traegerplatte |
US3996500A (en) * | 1975-06-16 | 1976-12-07 | Richco Plastic Company | Chassis connector and circuit board clip |
US4250616A (en) * | 1979-03-23 | 1981-02-17 | Methode Electronics, Inc. | Method of producing multilayer backplane |
US4310870A (en) * | 1979-12-31 | 1982-01-12 | Motorola, Inc. | Chassis captivation arrangement for an electronic device |
DE3021655C2 (de) * | 1980-06-10 | 1983-05-26 | Rose-Elektrotechnik Gmbh & Co Kg Elektrotechnische Fabrik, 4952 Porta Westfalica | Vorrichtung zum Positionieren von Leiterkarten, Montagewänden oder -platten in Elektronik-Schaltgehäusen |
US4498119A (en) * | 1980-11-03 | 1985-02-05 | Lockheed Corporation | Electronic circuit board and method and apparatus for thermal management thereof |
US4388672A (en) * | 1981-05-01 | 1983-06-14 | Motorola Inc. | Printed circuit board assembly |
-
1984
- 1984-10-09 JP JP1984152747U patent/JPH0412714Y2/ja not_active Expired
-
1985
- 1985-04-29 KR KR2019850004879U patent/KR890007939Y1/ko not_active IP Right Cessation
- 1985-09-27 GB GB08523890A patent/GB2165399B/en not_active Expired
- 1985-10-08 DE DE19853535923 patent/DE3535923A1/de active Granted
- 1985-10-09 US US06/785,784 patent/US4725920A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPS6166993U (US06265458-20010724-C00056.png) | 1986-05-08 |
JPH0412714Y2 (US06265458-20010724-C00056.png) | 1992-03-26 |
DE3535923C2 (US06265458-20010724-C00056.png) | 1989-02-02 |
US4725920A (en) | 1988-02-16 |
GB8523890D0 (en) | 1985-10-30 |
GB2165399B (en) | 1988-06-22 |
DE3535923A1 (de) | 1986-04-10 |
KR860005454U (ko) | 1986-06-11 |
GB2165399A (en) | 1986-04-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
REGI | Registration of establishment | ||
LAPS | Lapse due to unpaid annual fee |