AT348018B - Traegerplatte - Google Patents

Traegerplatte

Info

Publication number
AT348018B
AT348018B AT289675A AT289675A AT348018B AT 348018 B AT348018 B AT 348018B AT 289675 A AT289675 A AT 289675A AT 289675 A AT289675 A AT 289675A AT 348018 B AT348018 B AT 348018B
Authority
AT
Austria
Prior art keywords
carrier plate
carrier
plate
Prior art date
Application number
AT289675A
Other languages
English (en)
Other versions
ATA289675A (de
Inventor
Karl Ing Hofmann
Erwin Dipl Ing Leitner
Original Assignee
Siemens Ag Oesterreich
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag Oesterreich filed Critical Siemens Ag Oesterreich
Priority to AT289675A priority Critical patent/AT348018B/de
Priority to CH222476A priority patent/CH608313A5/xx
Priority to DE19762612986 priority patent/DE2612986A1/de
Priority to FR7611152A priority patent/FR2308276A1/fr
Priority to BE166260A priority patent/BE840877A/xx
Publication of ATA289675A publication Critical patent/ATA289675A/de
Application granted granted Critical
Publication of AT348018B publication Critical patent/AT348018B/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10015—Non-printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10401—Eyelets, i.e. rings inserted into a hole through a circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10651—Component having two leads, e.g. resistor, capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
AT289675A 1975-04-16 1975-04-16 Traegerplatte AT348018B (de)

Priority Applications (5)

Application Number Priority Date Filing Date Title
AT289675A AT348018B (de) 1975-04-16 1975-04-16 Traegerplatte
CH222476A CH608313A5 (en) 1975-04-16 1976-02-24 Assembly for radio-frequency circuits with a high power loss, especially for broadband amplifiers
DE19762612986 DE2612986A1 (de) 1975-04-16 1976-03-26 Traegerplatte fuer den aufbau von hochfrequenz-bauelementen oder hochfrequenz- bauelementegruppen hoher verlustleistung, insbesondere fuer breitbandverstaerker
FR7611152A FR2308276A1 (fr) 1975-04-16 1976-04-15 Plaque-support pour le montage de composants haute frequence, notamment pour des amplificateurs a large bande
BE166260A BE840877A (fr) 1975-04-16 1976-04-16 Plaque-support pour le montage de composants haute frequence, notamment pour des amplificateurs a large bande

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
AT289675A AT348018B (de) 1975-04-16 1975-04-16 Traegerplatte

Publications (2)

Publication Number Publication Date
ATA289675A ATA289675A (de) 1978-06-15
AT348018B true AT348018B (de) 1979-01-25

Family

ID=3542020

Family Applications (1)

Application Number Title Priority Date Filing Date
AT289675A AT348018B (de) 1975-04-16 1975-04-16 Traegerplatte

Country Status (5)

Country Link
AT (1) AT348018B (de)
BE (1) BE840877A (de)
CH (1) CH608313A5 (de)
DE (1) DE2612986A1 (de)
FR (1) FR2308276A1 (de)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3535923A1 (de) * 1984-10-09 1986-04-10 Alps Electric Co., Ltd., Tokio/Tokyo Substrathaltender aufbau
DE3910699A1 (de) * 1989-04-03 1990-10-04 Omt Oberflaechen Materialtech Leiterplatte fuer integrierte schaltungen
DE4010193A1 (de) * 1990-03-30 1991-10-31 Rheinmetall Gmbh Leiterkarte fuer eine leistungs-elektronikschaltung

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60218692A (ja) * 1984-04-13 1985-11-01 三菱電機株式会社 デイスプレイ装置
AT387678B (de) * 1987-02-06 1989-02-27 Siemens Ag Oesterreich Sperrfilter
DE4118398C2 (de) * 1991-06-05 1994-07-21 Ant Nachrichtentech Elektronik-Baugruppe mit Metallgehäuse

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1008331B (it) * 1973-03-28 1976-11-10 Rca Corp Pannello composito a circuito stampato

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3535923A1 (de) * 1984-10-09 1986-04-10 Alps Electric Co., Ltd., Tokio/Tokyo Substrathaltender aufbau
DE3910699A1 (de) * 1989-04-03 1990-10-04 Omt Oberflaechen Materialtech Leiterplatte fuer integrierte schaltungen
US5262921A (en) * 1990-03-03 1993-11-16 Rheinmetall Gmbh Directly cooled circuit board for an electronic power circuit
DE4010193A1 (de) * 1990-03-30 1991-10-31 Rheinmetall Gmbh Leiterkarte fuer eine leistungs-elektronikschaltung
DE4010193C3 (de) * 1990-03-30 1998-03-26 Rheinmetall Ind Ag Leiterkarte für eine Leistungs-Elektronikschaltung

Also Published As

Publication number Publication date
DE2612986A1 (de) 1976-10-28
FR2308276B1 (de) 1979-07-13
BE840877A (fr) 1976-08-16
ATA289675A (de) 1978-06-15
CH608313A5 (en) 1978-12-29
FR2308276A1 (fr) 1976-11-12

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Legal Events

Date Code Title Description
ELJ Ceased due to non-payment of the annual fee
ELJ Ceased due to non-payment of the annual fee