KR890004469B1 - 종형 mosfet와 그 제조방법 - Google Patents

종형 mosfet와 그 제조방법 Download PDF

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Publication number
KR890004469B1
KR890004469B1 KR1019850005079A KR850005079A KR890004469B1 KR 890004469 B1 KR890004469 B1 KR 890004469B1 KR 1019850005079 A KR1019850005079 A KR 1019850005079A KR 850005079 A KR850005079 A KR 850005079A KR 890004469 B1 KR890004469 B1 KR 890004469B1
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South Korea
Prior art keywords
trench
diffusion layer
layer
conductive layer
forming
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Expired
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KR1019850005079A
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English (en)
Korean (ko)
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KR860001490A (ko
Inventor
시게루 나까지마
가즈시게 미네기시
겐지 미우라
다까시 모리에
도시후미 소마따니
Original Assignee
닛뽄덴신덴와 가부시끼가이샤
신또 히사시
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Publication of KR860001490A publication Critical patent/KR860001490A/ko
Application granted granted Critical
Publication of KR890004469B1 publication Critical patent/KR890004469B1/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/63—Vertical IGFETs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D10/00—Bipolar junction transistors [BJT]
    • H10D10/40—Vertical BJTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/01—Manufacture or treatment
    • H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/025—Manufacture or treatment of FETs having insulated gates [IGFET] of vertical IGFETs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H10D84/0123—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs
    • H10D84/0126—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs
    • H10D84/013—Manufacturing their source or drain regions, e.g. silicided source or drain regions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H10D84/0123—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs
    • H10D84/0126—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs
    • H10D84/016—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs the components including vertical IGFETs
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/168—V-Grooves

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  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Electrodes Of Semiconductors (AREA)
KR1019850005079A 1984-07-16 1985-07-16 종형 mosfet와 그 제조방법 Expired KR890004469B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP14603784A JPS6126261A (ja) 1984-07-16 1984-07-16 縦形ｍｏｓ電界効果トランジスタの製造方法
JP59-146037 1984-07-16

Publications (2)

Publication Number Publication Date
KR860001490A KR860001490A (ko) 1986-02-26
KR890004469B1 true KR890004469B1 (ko) 1989-11-04

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KR1019850005079A Expired KR890004469B1 (ko) 1984-07-16 1985-07-16 종형 mosfet와 그 제조방법

Country Status (4)

Country Link
US (1) US4683643A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JPS6126261A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
KR (1) KR890004469B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE (1) DE3525396A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

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US5017504A (en) * 1986-12-01 1991-05-21 Mitsubishi Denki Kabushiki Kaisha Vertical type MOS transistor and method of formation thereof
US5082795A (en) * 1986-12-05 1992-01-21 General Electric Company Method of fabricating a field effect semiconductor device having a self-aligned structure
US4890144A (en) * 1987-09-14 1989-12-26 Motorola, Inc. Integrated circuit trench cell
JPS6486561A (en) * 1987-06-17 1989-03-31 Nec Corp Vertical mos transistor
JPH0795582B2 (ja) * 1987-11-17 1995-10-11 三菱電機株式会社 半導体装置の溝型キャパシタセルの製造方法
JP2507502B2 (ja) * 1987-12-28 1996-06-12 三菱電機株式会社 半導体装置
US5100823A (en) * 1988-02-29 1992-03-31 Motorola, Inc. Method of making buried stacked transistor-capacitor
US5060029A (en) * 1989-02-28 1991-10-22 Small Power Communication Systems Research Laboratories Co., Ltd. Step cut type insulated gate SIT having low-resistance electrode and method of manufacturing the same
US4954854A (en) * 1989-05-22 1990-09-04 International Business Machines Corporation Cross-point lightly-doped drain-source trench transistor and fabrication process therefor
US5021355A (en) * 1989-05-22 1991-06-04 International Business Machines Corporation Method of fabricating cross-point lightly-doped drain-source trench transistor
US5162250A (en) * 1989-06-30 1992-11-10 Texas Instruments, Incorporated Method for interconnecting a filament channel transistor with a wordline conductor
US5066603A (en) * 1989-09-06 1991-11-19 Gte Laboratories Incorporated Method of manufacturing static induction transistors
US5023196A (en) * 1990-01-29 1991-06-11 Motorola Inc. Method for forming a MOSFET with substrate source contact
US5250450A (en) * 1991-04-08 1993-10-05 Micron Technology, Inc. Insulated-gate vertical field-effect transistor with high current drive and minimum overlap capacitance
US5285093A (en) * 1992-10-05 1994-02-08 Motorola, Inc. Semiconductor memory cell having a trench structure
US5349224A (en) * 1993-06-30 1994-09-20 Purdue Research Foundation Integrable MOS and IGBT devices having trench gate structure
JP3395473B2 (ja) * 1994-10-25 2003-04-14 富士電機株式会社 横型トレンチｍｉｓｆｅｔおよびその製造方法
US5719067A (en) * 1996-09-06 1998-02-17 Advanced Micro Devices, Inc. Trench transistor and method for making same
US5940707A (en) * 1996-10-08 1999-08-17 Advanced Micro Devices, Inc. Vertically integrated advanced transistor formation
RU2108641C1 (ru) * 1997-02-17 1998-04-10 Научно-производственный комплекс "Технологический центр" Московского института электронной техники Вертикальный мдп-транзистор интегральной схемы
KR100259078B1 (ko) * 1997-08-14 2000-06-15 김영환 박막트랜지스터 및 이의 제조방법
US6429481B1 (en) * 1997-11-14 2002-08-06 Fairchild Semiconductor Corporation Field effect transistor and method of its manufacture
DE19845003C1 (de) * 1998-09-30 2000-02-10 Siemens Ag Vertikaler Feldeffekttransistor mit innenliegendem ringförmigen Gate und Herstellverfahren
US7033876B2 (en) * 2001-07-03 2006-04-25 Siliconix Incorporated Trench MIS device having implanted drain-drift region and thick bottom oxide and process for manufacturing the same
US20060038223A1 (en) * 2001-07-03 2006-02-23 Siliconix Incorporated Trench MOSFET having drain-drift region comprising stack of implanted regions
US7291884B2 (en) 2001-07-03 2007-11-06 Siliconix Incorporated Trench MIS device having implanted drain-drift region and thick bottom oxide
US7009247B2 (en) * 2001-07-03 2006-03-07 Siliconix Incorporated Trench MIS device with thick oxide layer in bottom of gate contact trench
US6849898B2 (en) * 2001-08-10 2005-02-01 Siliconix Incorporated Trench MIS device with active trench corners and thick bottom oxide
US6764906B2 (en) * 2001-07-03 2004-07-20 Siliconix Incorporated Method for making trench mosfet having implanted drain-drift region
US6690040B2 (en) * 2001-09-10 2004-02-10 Agere Systems Inc. Vertical replacement-gate junction field-effect transistor
US20030052365A1 (en) * 2001-09-18 2003-03-20 Samir Chaudhry Structure and fabrication method for capacitors integratible with vertical replacement gate transistors
US6759730B2 (en) 2001-09-18 2004-07-06 Agere Systems Inc. Bipolar junction transistor compatible with vertical replacement gate transistor
US6686604B2 (en) * 2001-09-21 2004-02-03 Agere Systems Inc. Multiple operating voltage vertical replacement-gate (VRG) transistor
US6709904B2 (en) * 2001-09-28 2004-03-23 Agere Systems Inc. Vertical replacement-gate silicon-on-insulator transistor
US6773994B2 (en) 2001-12-26 2004-08-10 Agere Systems Inc. CMOS vertical replacement gate (VRG) transistors
US7078296B2 (en) 2002-01-16 2006-07-18 Fairchild Semiconductor Corporation Self-aligned trench MOSFETs and methods for making the same
DE10224201B4 (de) * 2002-05-31 2010-11-25 Infineon Technologies Ag Halbleiterbauelement mit Durchbruchstrompfad und Herstellungsverfahren desselben
DE102004063991B4 (de) * 2004-10-29 2009-06-18 Infineon Technologies Ag Verfahren zur Herstellung von dotierten Halbleitergebieten in einem Halbleiterkörper eines lateralen Trenchtransistors
JP2007220734A (ja) * 2006-02-14 2007-08-30 Elpida Memory Inc 半導体装置及びその製造方法
US7982284B2 (en) * 2006-06-28 2011-07-19 Infineon Technologies Ag Semiconductor component including an isolation structure and a contact to the substrate
JP2010532096A (ja) * 2007-06-28 2010-09-30 スリーエム イノベイティブ プロパティズ カンパニー ゲート構造体を形成する方法
US8022472B2 (en) * 2007-12-04 2011-09-20 Rohm Co., Ltd. Semiconductor device and method of manufacturing semiconductor device
US8476704B2 (en) * 2011-08-19 2013-07-02 Nan Ya Technology Corporation Circuit structure with vertical double gate
KR102188883B1 (ko) * 2013-12-13 2020-12-14 삼성전자주식회사 반도체 소자 및 그 제조 방법
US10403751B2 (en) 2017-01-13 2019-09-03 Samsung Electronics Co., Ltd. Semiconductor device and method of manufacturing the same
CN114843177B (zh) * 2022-04-14 2025-07-22 捷捷微电(南通)科技有限公司 一种沟槽肖特基结构制作方法

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US3518509A (en) * 1966-06-17 1970-06-30 Int Standard Electric Corp Complementary field-effect transistors on common substrate by multiple epitaxy techniques
JPS5681974A (en) * 1979-12-07 1981-07-04 Toshiba Corp Manufacture of mos type semiconductor device
US4587712A (en) * 1981-11-23 1986-05-13 General Electric Company Method for making vertical channel field controlled device employing a recessed gate structure
US4476622A (en) * 1981-12-24 1984-10-16 Gte Laboratories Inc. Recessed gate static induction transistor fabrication
JPS58207675A (ja) * 1982-05-28 1983-12-03 Oki Electric Ind Co Ltd Ｍｉｓ型半導体装置
US4577208A (en) * 1982-09-23 1986-03-18 Eaton Corporation Bidirectional power FET with integral avalanche protection
JPH0665225B2 (ja) * 1984-01-13 1994-08-22 株式会社東芝 半導体記憶装置の製造方法
US4528047A (en) * 1984-06-25 1985-07-09 International Business Machines Corporation Method for forming a void free isolation structure utilizing etch and refill techniques

Also Published As

Publication number Publication date
JPH0527976B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1993-04-22
DE3525396C2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1992-11-19
KR860001490A (ko) 1986-02-26
DE3525396A1 (de) 1986-01-16
JPS6126261A (ja) 1986-02-05
US4683643A (en) 1987-08-04

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