KR890000153A - 폴리머필름의 선택적 촉매 활성화 - Google Patents
폴리머필름의 선택적 촉매 활성화 Download PDFInfo
- Publication number
- KR890000153A KR890000153A KR870012542A KR870012542A KR890000153A KR 890000153 A KR890000153 A KR 890000153A KR 870012542 A KR870012542 A KR 870012542A KR 870012542 A KR870012542 A KR 870012542A KR 890000153 A KR890000153 A KR 890000153A
- Authority
- KR
- South Korea
- Prior art keywords
- polymer
- article
- metal
- group
- cluster
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
- C23C18/1875—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment only one step pretreatment
- C23C18/1879—Use of metal, e.g. activation, sensitisation with noble metals
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J31/00—Catalysts comprising hydrides, coordination complexes or organic compounds
- B01J31/02—Catalysts comprising hydrides, coordination complexes or organic compounds containing organic compounds or metal hydrides
- B01J31/06—Catalysts comprising hydrides, coordination complexes or organic compounds containing organic compounds or metal hydrides containing polymers
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1862—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by radiant energy
- C23C18/1865—Heat
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
- C23C18/1875—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment only one step pretreatment
- C23C18/1882—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2026—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by radiant energy
- C23C18/2033—Heat
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
- C23C18/2066—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12424—Mass of only fibers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
- Y10T428/249978—Voids specified as micro
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/256—Heavy metal or aluminum or compound thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
- Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
- Y10T428/264—Up to 3 mils
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2913—Rod, strand, filament or fiber
- Y10T428/2927—Rod, strand, filament or fiber including structurally defined particulate matter
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2913—Rod, strand, filament or fiber
- Y10T428/2933—Coated or with bond, impregnation or core
- Y10T428/294—Coated or with bond, impregnation or core including metal or compound thereof [excluding glass, ceramic and asbestos]
- Y10T428/2942—Plural coatings
- Y10T428/2944—Free metal in coating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2913—Rod, strand, filament or fiber
- Y10T428/2933—Coated or with bond, impregnation or core
- Y10T428/294—Coated or with bond, impregnation or core including metal or compound thereof [excluding glass, ceramic and asbestos]
- Y10T428/2958—Metal or metal compound in coating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2913—Rod, strand, filament or fiber
- Y10T428/298—Physical dimension
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도와 제2도는, 본 발명에서 사용한 방법에 대한 물의 효과를 구체적으로 도시한 그래프이고,
제3도는 본발명방법중 여러예에 있어서 금속농도의 효과를 도시한 그래프이다.
Claims (24)
- 적어도 하나의 플리머와 적어도 하나의 원소주기율표 제1B족 또는 제8족에 속하는 금속으로된 착화합물을 포함하는 촉매적으로 활성인 표면층을 갖는 것을 특징으로하는 물건.
- 제1항에 있어서, 폴리머는 비닐폴리머나 또는 폴리부타디엔, 폴리크로로푸렌 및 폴리이소푸렌으로 구성된 군으로부터 선택된 불포화폴리머임을 특징으로하는 물건.
- 제2항에 있어서, 폴리머는 비닐폴리머이고 금속은 팔라듐, 백금, 이리듐, 루테늄, 로듐, 오스뮴, 금, 은 또는 이들의 혼합물이며, 폴리머와 금속은 폴리머의 모노머 단위체와 금속 원자의 몰비가 약 20:1 이상으로 표면층에 존재하도록 함을 특징으로 하는 물건.
- 제3항에 있어서, 표면층은 복사에너지에 노출시켜 활성화 되므로써 무전해 도금된 것임을 특징으로하는 물건.
- 제4항에 있어서, 표면층은 선택적으로 활성화되어 무전해 도금된 것임을 특징으로하는 물건.
- 공칭치수가 약 100나노미터 이하의 환원된 금속 클루스터로 환원될 수 있는 적어도 하나의 원소주기율표 제1B족 또는 제8족 원소의 발생클루스터를 포함하는 폴리머 표면층을 갖는 것을 특징으로하는 물건.
- 제6항에 있어서, 환원된 금속의 공칭치수는 실질적으로 약 10나노미터 이하임을 특징으로하는 물건.
- 제7항에 있어서, 원소는 팔라듐임을 특징으로하는 물건.
- 제6항에 있어서, 표면층은 외부표면의 배면에 발생클루스터를 갖는 것을 특징으로하는 물건.
- 적어도 하나의 폴리머와 적어도 하나의 원소주기율표 제1B족 또는 8족 금속의 클루스터를 포함하되 플리머의 모노머 단위체와 금속원자의 몰비가 충분히 높아 금속의 발생클루스터의 형성과 동시에 발생클루스터를 금속클루스터로 훤원시켜 형성하는 복사 에너지로 활성화되기 전까지는 촉매적으로 비활성인 표면층이 되는 촉매적으로활성인 표면층을 갖는 것을 특징으로하는 물건.
- 제10항에 있어서, 폴리머는 비닐폴리머이고 몰비는 적어도 약 20:1이며 폴리머가 불포화폴리머인 경우 몰비를 적어도 약 30:1임을 특징으로 하는 물건.
- 촉매적으로 활성인 표면층의 배면이 적어도 하나의 폴리머와 적어도 하나의 원조주기율표 제1B족 또는 제8족 금속의 포함함을 특징으로 하는 물건.
- 적어도 하나의 폴리머와 공칭치수가 약 100나노미터 이하인 적어도 하나이 원소주기율표 제1B족 또는 8족 금속의 클루스터로 구성된 촉매적으로 활성인 층을 갖는 표면의 적어도 일면이 무전해적으로 금속 도금된 것을 특징으로하는 물건.
- 제13항에 있어서, 도금된 금속은 무전해도금된 산화방지성 구리임을 특징으로하는 물건.
- 제14항에 있어서, 구리는 약 250나노미터까자의 입자크기를 갖는 것임을 특징으로 하는 물건.
- 제13항에 있어서, 기질은 폴리머섬유사를 포함함을 특징으로하는 물건.
- 제13항에 있어서, 기질은 폴리모포음을 포함함을 특징으로하는 물건.
- 무전해도금된 선화방지성 구리층의 두께가 3마이크로미터 이하인 표면을 갖는 것을 특징으로하는 물건.
- 복사에너지로 필름을 형성화시키기 전까지는 필름이 촉매적으로 비활성을 유지하도록 폴리머의 모노머단위체와 금속원자의 몰비를 충분히 높은 수준으로 유지시킨 적어도 하나의 폴림와 적어도 하나의 원소주기율표 제1B족 또는 제8족 금속으로 구성된 것을 특징으로하는 촉매적으로 활성인 필름형성용액.
- 제19항에 있어서, 폴리머는 비질포리머이고 비율은 적어도 20:1 임을 특징으로하는 필름형성용액.
- 폴리머기질상에 산화저항성 구리가 무전해적으로 도금된 층을 갖는 것을 특징으로하는 전기전도성 섬유사.
- 형성된 필름이 촉매적으로 비활성인 상태를 유지하도록 폴리머의 모노머 단위체와 그속원자의 몰비가 충분히 높게 적어도 하나의 폴리머와 적어도 하나의 원소주기율표 제1B족 또는 제8족 금속으로 구성된 필름 형성용액을 물건의 표면에 피복하여 피복층을 형성한 후, 물건상의 피복층을 건조하여 촉매적으로 비활성인 폴리머 표면층을 얻고 여기에 에너지를 공급하여 발생기 금속 클루스터를 갖는 부분을 형성한 다음, 이를 환원제로 처리하여 금속의 클루스터를 형성시킴을 특징으로하는 물건상에 촉매적으로 활성화 될 수 있는 표면을 제공하는 방법.
- 특허청구의 범위 제22항의 방법으로 얻어진 촉매적으로 활성화 될수 있는 표면을 무전해도금용액과 접촉시켜 무전해적으로 금속을 도금시킴을 특징으로하는 무전해도금방법.
- 제23항에 있어서, 무전해적으로 도금된 금속은 실질적으로 산화방지성 구리임을 특징으로하는 방법.※참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US92849986A | 1986-11-07 | 1986-11-07 | |
US928449 | 1986-11-07 | ||
US928,499 | 1986-11-07 | ||
US064,898 | 1987-06-19 | ||
US07/064,898 US4900618A (en) | 1986-11-07 | 1987-06-19 | Oxidation-resistant metal coatings |
US064898 | 1987-06-19 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR890000153A true KR890000153A (ko) | 1989-03-13 |
KR910002491B1 KR910002491B1 (ko) | 1991-04-23 |
Family
ID=26745016
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019870012542A KR910002491B1 (ko) | 1986-11-07 | 1987-11-06 | 폴리머 필름의 선택적 촉매활성화 |
Country Status (7)
Country | Link |
---|---|
US (1) | US4900618A (ko) |
EP (1) | EP0271466B1 (ko) |
JP (1) | JPH07110921B2 (ko) |
KR (1) | KR910002491B1 (ko) |
AU (1) | AU598055B2 (ko) |
CA (1) | CA1340386C (ko) |
DE (1) | DE3789705T2 (ko) |
Families Citing this family (43)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02251801A (ja) * | 1989-03-24 | 1990-10-09 | Nippon Paint Co Ltd | 基板上の機能性パターンの間隙に金属メッキ層を形成する方法 |
US5227223A (en) * | 1989-12-21 | 1993-07-13 | Monsanto Company | Fabricating metal articles from printed images |
WO1991014975A1 (en) * | 1990-03-22 | 1991-10-03 | Monsanto Company | Electrolessly deposited metal holograms |
JPH04234765A (ja) * | 1990-08-29 | 1992-08-24 | Xerox Corp | 基体、ベルトおよび静電写真像形成部材、並びにこれらの製造方法 |
DE4113525C2 (de) * | 1991-04-25 | 1995-08-03 | Heraeus Noblelight Gmbh | Verfahren zur Metallisierung von Flächen von Bauelementen und ihre Verwendung |
US5411795A (en) * | 1992-10-14 | 1995-05-02 | Monsanto Company | Electroless deposition of metal employing thermally stable carrier polymers |
US5681441A (en) * | 1992-12-22 | 1997-10-28 | Elf Technologies, Inc. | Method for electroplating a substrate containing an electroplateable pattern |
US5348574A (en) * | 1993-07-02 | 1994-09-20 | Monsanto Company | Metal-coated polyimide |
AUPN705195A0 (en) * | 1995-12-08 | 1996-01-11 | Cardiac Crc Nominees Pty Limited | Electroless deposition of metallic coatings on non-conducting substrates |
US5981066A (en) * | 1996-08-09 | 1999-11-09 | Mtc Ltd. | Applications of metallized textile |
US5871091A (en) * | 1997-07-31 | 1999-02-16 | Robert L. Phillips | Package and method of manufacture for flexible cutting line |
US6051172A (en) * | 1997-07-31 | 2000-04-18 | Robert L. Phillips | Method of manufacture for flexible cutting line |
US6294729B1 (en) | 1997-10-31 | 2001-09-25 | Laird Technologies | Clad polymer EMI shield |
FR2771309B1 (fr) * | 1997-11-24 | 2000-02-11 | Messier Bugatti | Elaboration de support de catalyseur en fibres de carbone active |
CA2401168A1 (en) | 2000-02-28 | 2001-09-07 | Amesbury Group, Inc. | Methods and apparatus for emi shielding |
IL135487A (en) * | 2000-04-05 | 2005-07-25 | Cupron Corp | Antimicrobial and antiviral polymeric materials and a process for preparing the same |
US20040247653A1 (en) * | 2000-04-05 | 2004-12-09 | The Cupron Corporation | Antimicrobial and antiviral polymeric materials and a process for preparing the same |
US20050150514A1 (en) * | 2000-04-05 | 2005-07-14 | The Cupron Corporation | Device for cleaning tooth and gum surfaces |
JP2002012625A (ja) * | 2000-06-28 | 2002-01-15 | Denki Kagaku Kogyo Kk | クロロプレン系重合体及びその製造方法 |
EP1369525A4 (en) * | 2000-12-26 | 2005-01-26 | Mitsubishi Materials Corp | METALLIC COATING FIBER AND ELECTRO-CONDUCTIVE COMPOSITION CONTAINING THE SAME, PROCESS FOR PRODUCING THE SAME, AND USE THEREOF |
GB2381274A (en) * | 2001-10-29 | 2003-04-30 | Qinetiq Ltd | High resolution patterning method |
US20050123589A1 (en) * | 2002-04-18 | 2005-06-09 | The Cupron Corporation | Method and device for inactivating viruses |
US7296690B2 (en) * | 2002-04-18 | 2007-11-20 | The Cupron Corporation | Method and device for inactivating viruses |
IL149206A (en) * | 2002-04-18 | 2007-07-24 | Cupron Corp | Method and device for inactivation of hiv |
US6867983B2 (en) * | 2002-08-07 | 2005-03-15 | Avery Dennison Corporation | Radio frequency identification device and method |
US20040167483A1 (en) * | 2003-02-21 | 2004-08-26 | The Cupron Corporation C/O Law Offices Of Mr. Sylavin Jakabovics | Disposable diaper for combating diaper rash |
US20040197386A1 (en) * | 2003-04-01 | 2004-10-07 | The Cupron Corporation | Disposable paper-based hospital and operating theater products |
US7364756B2 (en) * | 2003-08-28 | 2008-04-29 | The Cuprin Corporation | Anti-virus hydrophilic polymeric material |
IL157625A0 (en) * | 2003-08-28 | 2004-03-28 | Cupron Corp | Anti-virus hydrophilic polymeric material |
US7480393B2 (en) * | 2003-11-19 | 2009-01-20 | Digimarc Corporation | Optimized digital watermarking functions for streaming data |
US6943288B1 (en) | 2004-06-04 | 2005-09-13 | Schlegel Systems, Inc. | EMI foil laminate gasket |
NZ555072A (en) * | 2004-11-07 | 2010-09-30 | Cupron Corp | Copper containing materials for treating wounds, burns and other skin conditions |
US9403041B2 (en) * | 2004-11-09 | 2016-08-02 | Cupron Inc. | Methods and materials for skin care |
US20070040686A1 (en) * | 2005-08-16 | 2007-02-22 | X-Cyte, Inc., A California Corporation | RFID inlays and methods of their manufacture |
US20070040688A1 (en) * | 2005-08-16 | 2007-02-22 | X-Cyte, Inc., A California Corporation | RFID inlays and methods of their manufacture |
WO2007119966A1 (en) * | 2006-04-13 | 2007-10-25 | Lg Chem, Ltd. | Resin composition comprising catalyst precursor for electroless plating to form electromagnetic wave shielding layer, methods for forming metal patterns using the resin composition and metal patterns formed by the methods |
JP4917841B2 (ja) * | 2006-06-09 | 2012-04-18 | ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. | 樹脂表面への無電解めっき方法 |
KR100958289B1 (ko) * | 2007-07-09 | 2010-05-19 | 주식회사 엘지화학 | 전자파 차폐용 촉매 전구체 수지 조성물, 이를 이용한 금속패턴 형성방법 및 이에 따라 형성된 금속패턴 |
EP2222891B1 (en) | 2007-11-23 | 2019-01-02 | The University Court Of The University Of Dundee | Nano-particle dispersions |
TW201117696A (en) * | 2009-11-13 | 2011-05-16 | Members Of Xing In Kunshan Industry Sales Mfg Ltd | Local casing structure disposed at a wireless apparatus |
BR112013014687B1 (pt) * | 2010-12-16 | 2019-02-05 | Energia Technologies, Inc. | método de desoxigenação de hidrocarbonetos oxigenados |
US8784952B2 (en) * | 2011-08-19 | 2014-07-22 | Earthone Circuit Technologies Corporation | Method of forming a conductive image on a non-conductive surface |
EP2581469B1 (en) * | 2011-10-10 | 2015-04-15 | Enthone, Inc. | Aqueous activator solution and process for electroless copper deposition on laser-direct structured substrates |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1521445C3 (de) * | 1965-06-01 | 1979-11-29 | Photocircuits Corp., Glen Cove, N.Y. (V.St.A.) | Verfahren zur Herstellung von für die stromlose Metallbeschichtung aktivierten Isolierstoffoberflächen |
US3904783A (en) * | 1970-11-11 | 1975-09-09 | Nippon Telegraph & Telephone | Method for forming a printed circuit |
US4082898A (en) * | 1975-06-23 | 1978-04-04 | Ppg Industries, Inc. | Electroless deposition of electrically nonconductive copper-boron coatings on nonmetallic substrates |
JPS53139872A (en) * | 1977-05-10 | 1978-12-06 | Toray Industries | Porous body comprising metal coated carbon fiber |
DE2743768C3 (de) * | 1977-09-29 | 1980-11-13 | Bayer Ag, 5090 Leverkusen | Metallisiertes Textilmaterial |
US4169171A (en) * | 1977-11-07 | 1979-09-25 | Harold Narcus | Bright electroless plating process and plated articles produced thereby |
US4220678A (en) * | 1978-08-17 | 1980-09-02 | Nathan Feldstein | Dispersions for activating non-conductors for electroless plating |
DE2847486A1 (de) * | 1978-11-02 | 1980-05-14 | Bayer Ag | Verwendung von metallisierten textilen flaechengebilden als strahlenschutz gegen mikrowellen |
US4379184A (en) * | 1979-02-28 | 1983-04-05 | Tsvetkov Nikolai S | Process for forming a reflecting copper coating on a face of a glass substrate |
DE3106506A1 (de) * | 1981-02-21 | 1982-10-07 | Bayer Ag, 5090 Leverkusen | Metallisierte kohlenstoffasern und verbundwerkstoffe, die diese fasern enthalten |
JPS58139495A (ja) * | 1982-01-22 | 1983-08-18 | セイコーエプソン株式会社 | プリント配線板 |
DE3202484A1 (de) * | 1982-01-27 | 1983-08-04 | Bayer Ag, 5090 Leverkusen | Metallisierte halbleiter und verfahren zu ihrer herstellung |
DE3215413A1 (de) * | 1982-04-24 | 1983-10-27 | Bayer Ag, 5090 Leverkusen | Metallisierte polymergranulate, ihre herstellung und verwendung |
US4497867A (en) * | 1983-02-14 | 1985-02-05 | Vsesojuzny Nauchno-Isslefovatelsky, Proektno-Konstruktorsky I Tekhnologichesky Institut Kabelnoi Promyshlennosti "Vniikp" | Multiwire twisted conductor and device for coating twisted conductor wires |
FR2544341A1 (fr) * | 1983-04-15 | 1984-10-19 | Rhone Poulenc Rech | Procede de metallisation de films souples electriquement isolants et articles obtenus |
DE3337856A1 (de) * | 1983-10-18 | 1985-04-25 | Bayer Ag, 5090 Leverkusen | Verfahren zur aktivierung von substraten fuer die stromlose metallisierung |
DE3339857A1 (de) * | 1983-11-04 | 1985-05-15 | Bayer Ag, 5090 Leverkusen | Verfahren zur vorbehandlung von polyamidsubstraten fuer die stromlose metallisierung |
JPS6115982A (ja) * | 1984-06-29 | 1986-01-24 | Hitachi Chem Co Ltd | 無電解めつき法 |
JPS6115983A (ja) * | 1984-06-29 | 1986-01-24 | Hitachi Chem Co Ltd | 無電解めつき用触媒 |
JPS61179875A (ja) * | 1984-10-26 | 1986-08-12 | Nissan Chem Ind Ltd | 金属導体被膜形成方法 |
JPH0243826B2 (ja) * | 1985-07-03 | 1990-10-01 | Kogyo Gijutsuin | Goseijushihyomenjonokinzokupataankeiseihoho |
US4710403A (en) * | 1986-05-05 | 1987-12-01 | Minnesota Mining And Manufacturing Company | Metallized polymers |
-
1987
- 1987-06-19 US US07/064,898 patent/US4900618A/en not_active Expired - Fee Related
- 1987-11-06 EP EP19870870156 patent/EP0271466B1/en not_active Expired - Lifetime
- 1987-11-06 CA CA 551313 patent/CA1340386C/en not_active Expired - Fee Related
- 1987-11-06 DE DE19873789705 patent/DE3789705T2/de not_active Expired - Fee Related
- 1987-11-06 JP JP27942787A patent/JPH07110921B2/ja not_active Expired - Lifetime
- 1987-11-06 KR KR1019870012542A patent/KR910002491B1/ko not_active IP Right Cessation
- 1987-11-06 AU AU80873/87A patent/AU598055B2/en not_active Ceased
Also Published As
Publication number | Publication date |
---|---|
EP0271466A2 (en) | 1988-06-15 |
CA1340386C (en) | 1999-02-09 |
DE3789705D1 (de) | 1994-06-01 |
JPH07110921B2 (ja) | 1995-11-29 |
AU598055B2 (en) | 1990-06-14 |
JPS63159410A (ja) | 1988-07-02 |
EP0271466B1 (en) | 1994-04-27 |
KR910002491B1 (ko) | 1991-04-23 |
AU8087387A (en) | 1988-05-12 |
US4900618A (en) | 1990-02-13 |
EP0271466A3 (en) | 1988-10-12 |
DE3789705T2 (de) | 1994-10-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR890000153A (ko) | 폴리머필름의 선택적 촉매 활성화 | |
US5437916A (en) | Flexible printed circuits | |
US3954570A (en) | Sensitized polyimides and circuit elements thereof | |
US4472458A (en) | Process for the production of metallized semiconductors | |
US5275861A (en) | Radiation shielding fabric | |
US4261800A (en) | Method of selectively depositing a metal on a surface of a substrate | |
KR960023235A (ko) | 무전해 도금법에서의 촉매화 방법 | |
JPS586781B2 (ja) | キンゾクハクマクケイセイホウ | |
US4035500A (en) | Method of depositing a metal on a surface of a substrate | |
US3501332A (en) | Metal plating of plastics | |
FR2544341A1 (fr) | Procede de metallisation de films souples electriquement isolants et articles obtenus | |
KR900004962A (ko) | 피막 형성 방법 | |
US5348574A (en) | Metal-coated polyimide | |
US3668003A (en) | Printed circuits | |
US3791340A (en) | Method of depositing a metal pattern on a surface | |
JPS601890A (ja) | プリント回路製造のアデイテイブ法 | |
US5075037A (en) | Selective catalytic activation of polymeric films | |
KR920006544A (ko) | 크롬도금용 양극 및 그 제조방법 그리고 크롬도금 전해 장치 및 양극을 사용하는 크롬도금 전해 방법 | |
US3556956A (en) | Electroless plating of substrates | |
Lee et al. | Economical selective metallization of insulating surfaces | |
JP2006219715A (ja) | 耐熱性絶縁樹脂の金属めっき方法 | |
Perrins | The Mechanism for the Adhesion of Electroplate to Propylene Copolymer | |
KR20220109387A (ko) | 전기증착을 위한 랙 코팅 상의 원치 않는 도금의 방지 | |
SU761600A1 (ru) | Раствор для обработки полимерной поверхности после ее активирования для химической металлизации 1 | |
SU367747A1 (ru) | Способ металлизации поверхности комбинированной подложки диэлектрик-металл |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
G160 | Decision to publish patent application | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 19980409 Year of fee payment: 8 |
|
LAPS | Lapse due to unpaid annual fee |