KR880012705A - 폴리아미드 수지 조성물 - Google Patents

폴리아미드 수지 조성물 Download PDF

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Publication number
KR880012705A
KR880012705A KR1019880003977A KR880003977A KR880012705A KR 880012705 A KR880012705 A KR 880012705A KR 1019880003977 A KR1019880003977 A KR 1019880003977A KR 880003977 A KR880003977 A KR 880003977A KR 880012705 A KR880012705 A KR 880012705A
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KR
South Korea
Prior art keywords
polyamide resin
resin composition
composition according
fine silica
coupling agent
Prior art date
Application number
KR1019880003977A
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English (en)
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KR960005920B1 (ko
Inventor
미쯔히꼬 다무라
마사아끼 미야모또
마사야 우에다
에이이찌 가모시다
Original Assignee
시바따 마쓰지로
미쓰비시 가세이 고교 기부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 시바따 마쓰지로, 미쓰비시 가세이 고교 기부시끼가이샤 filed Critical 시바따 마쓰지로
Publication of KR880012705A publication Critical patent/KR880012705A/ko
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Publication of KR960005920B1 publication Critical patent/KR960005920B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)

Abstract

내용 없음

Description

폴리아미드 수지 조성물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (12)

  1. 폴리아미드 수지, 이 폴리아미드 수지를 기준으로 하여 0.01 내지 1중량%의 미세 실리카 및 이 미세실리카를 기준으로 하여 1 내지 99중량%의 실란 커플링제를 함유하는 폴리아미드 수지 조성물.
  2. 제1항에 있어서, 상기 미세 실리카의 사용량이 상기 폴리아미드 수지를 기준으로 하여 0.05 내지 0.5중량%인 폴리아미드 수지 조성물.
  3. 제1항에 있어서, 코울터계수기 법에 의해 측정한 상기 미세 실리카의 평균입경이 0.01 내지 20μm인 폴리아미드 수지 조성물.
  4. 제1항에 있어서, 상기 미세 실리카가 습윤공정에 의해 제조된, 폴리아미드 수지 조성물.
  5. 제1항에 있어서, 상기 실란 커플링제의 사용량이 상기 미세 실리카를 기준으로 하여 5 내지 70중량%인 폴리아미드 수지 조성물.
  6. 제1항에 있어서, 상기 실란 커플링제의 사용량이 상기 미세 실리카를 기준으로 하여 10 내지 40중량%인 폴리아미드 수지 조성물.
  7. 제1항에 있어서, 상기 실란 커플링제가 아미노알킬기를 갖는 폴리아미드 수지 조성물.
  8. 제1항 또는 제7항에 있어서, 상기 실란 커플링제가-(아미노프로필)트리에톡시실란 또는 N-(β-아미노레틸)--(아미노프로필)트리메톡시실란인 폴리아미드 수지 조성물.
  9. 제1항에 따르는 상기 폴리아미드 수지 조성물로 부터 제조된 포장물질.
  10. 제9항에 있어서, 상기 포장물질이 필름 또는 시이트인 포장물질.
  11. 제1항에 따른 폴리아미드 수지 조성물의 포장물질의 제조를 위한 용도.
  12. 제11항에 있어서, 상기 포장물질이 필름 또는 시이트인 용도.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019880003977A 1987-04-08 1988-04-08 폴리아미드 수지 조성물 KR960005920B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP62-86269 1987-04-08
JP86269/87 1987-04-08
JP62086269A JPH0676546B2 (ja) 1987-04-08 1987-04-08 ポリアミドフィルム

Publications (2)

Publication Number Publication Date
KR880012705A true KR880012705A (ko) 1988-11-28
KR960005920B1 KR960005920B1 (ko) 1996-05-03

Family

ID=13882098

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019880003977A KR960005920B1 (ko) 1987-04-08 1988-04-08 폴리아미드 수지 조성물

Country Status (4)

Country Link
US (1) US4804720A (ko)
JP (1) JPH0676546B2 (ko)
KR (1) KR960005920B1 (ko)
DE (1) DE3811544B4 (ko)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2268182B (en) * 1992-06-25 1996-01-31 Asahi Chemical Ind Polyamide resin composition and molded articles obtained therefrom
JP3569987B2 (ja) † 1994-12-22 2004-09-29 東洋紡績株式会社 ２軸配向ポリアミド系樹脂フィルム
US5589119A (en) * 1994-12-22 1996-12-31 New Southland, Inc. Silicone elastomer seals for molded plastic parts
DK0818508T3 (da) * 1996-07-11 2001-11-19 Wolff Walsrode Ag Polyamidblandinger indeholdende faststofpartikler
DE69808251D1 (de) * 1998-06-04 2002-10-31 Becker & Co Naturinwerk Biaxial verstreckte, handfüllbare, Schlauchfolie zur Verpackung und Umhüllung von Lebensmitteln
DE19961972A1 (de) * 1999-12-22 2001-06-28 Degussa Organosilan- und/oder Organosiloxan-haltige Mittel für gefülltes Polyamid
CN103140541A (zh) * 2010-09-20 2013-06-05 3M创新有限公司 用于挤出和注模的纳米粒子加工助剂
JP7091732B2 (ja) * 2017-03-15 2022-06-28 Ｕｂｅ株式会社 ポリアミド樹脂組成物、フィルム及びフィルム積層体
CN110709472B (zh) 2017-05-30 2022-09-27 Ｕｂｅ株式会社 聚酰胺树脂组合物及使用其的脱模薄膜

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS545420B2 (ko) * 1973-12-26 1979-03-16
JPS517056A (ja) * 1974-07-08 1976-01-21 Teijin Ltd Naironjushisoseibutsu
JPS517055A (ja) * 1974-07-08 1976-01-21 Teijin Ltd Horiamidososeibutsu
JPS5198757A (ja) * 1975-02-26 1976-08-31 Horiamidojushisoseibutsu
JPS5852820B2 (ja) * 1976-01-12 1983-11-25 帝人株式会社 二軸配向フイルム
US4097469A (en) * 1976-04-15 1978-06-27 Phillips Petroleum Company Process for preparing polyamides of PACP
JPS5835626A (ja) * 1981-08-26 1983-03-02 Toshiba Corp バス争奪制御方式
JPS5852820A (ja) * 1981-09-24 1983-03-29 Nec Corp 半導体装置の製造方法
JPS60158220A (ja) * 1984-01-27 1985-08-19 Mitsui Petrochem Ind Ltd 摺動材用成形材料
US4692361A (en) * 1984-09-28 1987-09-08 Baxter Travenol Laboratories, Inc. Film laminate with gas barrier for sterile flexible containers
US4684697A (en) * 1985-04-30 1987-08-04 Ppg Industries, Inc. Compositions based on silane hydrolyzates and vinyl polymers containing hydrolyzable silyl groups
JPS6232146A (ja) * 1985-08-06 1987-02-12 Mitsubishi Chem Ind Ltd ポリアミドフイルムまたはシ−ト
US4678835A (en) * 1986-01-30 1987-07-07 Ppg Industries, Inc. Coating composition containing an ungelled reaction product as a curative
JP3104451B2 (ja) * 1993-02-05 2000-10-30 日本電気株式会社 半導体装置の製造方法

Also Published As

Publication number Publication date
DE3811544B4 (de) 2006-05-04
DE3811544A1 (de) 1988-10-27
US4804720A (en) 1989-02-14
KR960005920B1 (ko) 1996-05-03
JPH0676546B2 (ja) 1994-09-28
JPS63251460A (ja) 1988-10-18

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