KR880010481A - 액상 박막 결정 성장방법 및 장치 - Google Patents
액상 박막 결정 성장방법 및 장치 Download PDFInfo
- Publication number
- KR880010481A KR880010481A KR870001489A KR870001489A KR880010481A KR 880010481 A KR880010481 A KR 880010481A KR 870001489 A KR870001489 A KR 870001489A KR 870001489 A KR870001489 A KR 870001489A KR 880010481 A KR880010481 A KR 880010481A
- Authority
- KR
- South Korea
- Prior art keywords
- melt
- substrate
- crystal growth
- holder
- temperature
- Prior art date
Links
- 239000007788 liquid Substances 0.000 title claims description 6
- 238000002109 crystal growth method Methods 0.000 title claims 2
- 239000010409 thin film Substances 0.000 title description 3
- 239000013078 crystal Substances 0.000 claims description 9
- 239000004973 liquid crystal related substance Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 14
- 239000010410 layer Substances 0.000 claims 3
- 238000010438 heat treatment Methods 0.000 claims 2
- 239000000155 melt Substances 0.000 claims 2
- 239000010453 quartz Substances 0.000 claims 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 2
- 239000002356 single layer Substances 0.000 claims 1
- 239000010408 film Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/0405, H01L21/0445, H01L21/06, H01L21/16 and H01L21/18 with or without impurities, e.g. doping materials
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B19/00—Liquid-phase epitaxial-layer growth
- C30B19/02—Liquid-phase epitaxial-layer growth using molten solvents, e.g. flux
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B19/00—Liquid-phase epitaxial-layer growth
- C30B19/06—Reaction chambers; Boats for supporting the melt; Substrate holders
- C30B19/063—Sliding boat system
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B19/00—Liquid-phase epitaxial-layer growth
- C30B19/08—Heating of the reaction chamber or the substrate
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/0405, H01L21/0445, H01L21/06, H01L21/16 and H01L21/18 with or without impurities, e.g. doping materials
- H01L21/38—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions
- H01L21/388—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions using diffusion into or out of a solid from or into a liquid phase, e.g. alloy diffusion processes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/101—Liquid Phase Epitaxy, LPE
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Inorganic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 종래의 슬라이드식 액상 박막 결정 성장장치의 단면도.
제2도는 본 발명의 실시예에 따른 보조 가열기의 개략도.
제3(A)-(H)도는 본 발명의 실시예에 따른 액상 박막 결정 성장장치를 이용한 액상 박막 결정 성장공정도와 그에 따른 온도분포도.
Claims (2)
- 석영관(22) 내부에 기판홀더(23)와 복수개의 용융액홀도(27,28)와 용융액홀더 지지판(24)으로 구성된 보우트가 있고 석영관(22) 외부에 전기로(21)가 설치된 액상 결정 성장장치에 있어서, 각 용융액홀더(27,28)를 필요한 만큼 분리시켜 배치하고 각각의 용융액홀더(27,28)에 보조가열기(31,32)를 설치하여 각 용융액을 선택적으로 가열하고 냉각시킬수 있음을 특징으로 하는 액상 결정 성장장치.
- 슬라이드식 액상 결정 성장방법에 있어서, 특정 분위기의 반응관(21)내에 보우트를 삽입하고 나서 주가열전기로(21)를 제1온도상태까지 가열하고 보조가열기(31,32)를 이용하여 제1용융액(29)과 제2용융액(30)의 온도를 내용물이 충분히 용융되는 온도인 제2온도상태로 높이는 제1공정과, 기판홀더(23)를 슬라이드시켜 제1기판(25)를 제1용융액(29)과 접촉시키고 제1용융액(29)의 온도만을 제3온도상태로 내려서 제1기판(25)상에 제1층 결정 성장을 시키는 제2공정과, 제1기판(25)상에 소정두께의 결정 성장이 끝난 후 기판홀더(23)를 슬라이드시켜 제1기판(25)과 제1용융액을 분리하고 제1용융액의온도가 다시 제1온도상태가 되도록 제1보조가열기를 가열하는 제3공정과, 기판홀더(23)를 슬라이드시켜 제1기판(25)을 제2용융액(30)에 접촉시키고 제2기판(26)은 제1용융액(29)에 접촉시켜 제1용융액(29)은 제3온도상태로 내리고 제2용융액(30)은 제4온도상태로 내려서 제1기판(25)상에는 제2층 결정 성장을 시키고 제2기판(26)상에는 제1층 결정 성장을 시킨후 기판홀더(23)를 슬라이드시켜 용융액(29,30)과 기판(26,25)을 각각 분리하여 결정 성장을 중단하는 제4공정을 구비하여 반복 실시함으로써 다수 결정층 성장시 복수개의 용융액홀더를 사용하여 복수개의 기판상에 동일한 조건의 다수 결정 성장층을 형성함을 특징으로 하는 액상 결정 성장방법.※참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR870001489A KR880010481A (ko) | 1987-02-21 | 1987-02-21 | 액상 박막 결정 성장방법 및 장치 |
JP63034124A JPS63209122A (ja) | 1987-02-21 | 1988-02-18 | 液相薄膜結晶成長方法及び装置 |
US07/157,981 US4918029A (en) | 1987-02-21 | 1988-02-19 | Method for liquid-phase thin film epitaxy |
US07/509,300 US5068516A (en) | 1987-02-21 | 1990-04-16 | Device for liquid-phase thin film epitaxy |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR870001489A KR880010481A (ko) | 1987-02-21 | 1987-02-21 | 액상 박막 결정 성장방법 및 장치 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR880010481A true KR880010481A (ko) | 1988-10-10 |
Family
ID=19259602
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR870001489A KR880010481A (ko) | 1987-02-21 | 1987-02-21 | 액상 박막 결정 성장방법 및 장치 |
Country Status (3)
Country | Link |
---|---|
US (2) | US4918029A (ko) |
JP (1) | JPS63209122A (ko) |
KR (1) | KR880010481A (ko) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5185288A (en) * | 1988-08-26 | 1993-02-09 | Hewlett-Packard Company | Epitaxial growth method |
KR930006955B1 (ko) * | 1990-12-07 | 1993-07-24 | 한국과학기술연구원 | 디렉트 모니터링 전기로를 이용한 수평대역용융 단결정 성장장치 |
US5438181A (en) * | 1993-12-14 | 1995-08-01 | Essex Specialty Products, Inc. | Apparatus for heating substrate having electrically-conductive and non-electrically-conductive portions |
US6031211A (en) * | 1997-07-11 | 2000-02-29 | Concept Systems Design, Inc. | Zone heating system with feedback control |
KR100347544B1 (ko) | 1999-02-13 | 2002-08-07 | 주식회사 하이닉스반도체 | 반도체 소자의 접합 제조 방법 |
KR100314276B1 (ko) | 1999-04-12 | 2001-11-15 | 박종섭 | 반도체 소자의 제조방법 |
KR100353526B1 (ko) | 1999-06-18 | 2002-09-19 | 주식회사 하이닉스반도체 | 반도체 소자의 제조방법 |
KR100345681B1 (ko) | 1999-06-24 | 2002-07-27 | 주식회사 하이닉스반도체 | 반도체소자의 삼중웰 형성방법 |
KR100332119B1 (ko) | 1999-06-28 | 2002-04-10 | 박종섭 | 반도체 소자 제조 방법 |
KR100332106B1 (ko) | 1999-06-29 | 2002-04-10 | 박종섭 | 반도체 소자의 트랜지스터 제조 방법 |
KR100332107B1 (ko) | 1999-06-29 | 2002-04-10 | 박종섭 | 반도체 소자의 트랜지스터 제조 방법 |
KR100332108B1 (ko) | 1999-06-29 | 2002-04-10 | 박종섭 | 반도체 소자의 트랜지스터 및 그 제조 방법 |
KR100301246B1 (ko) | 1999-06-30 | 2001-11-01 | 박종섭 | 반도체 소자의 제조 방법 |
KR20010061029A (ko) | 1999-12-28 | 2001-07-07 | 박종섭 | 엘리베이티드 소오스/드레인 구조의 모스 트랜지스터형성방법 |
KR100510996B1 (ko) | 1999-12-30 | 2005-08-31 | 주식회사 하이닉스반도체 | 선택적 에피텍셜 성장 공정의 최적화 방법 |
KR100327596B1 (ko) | 1999-12-31 | 2002-03-15 | 박종섭 | Seg 공정을 이용한 반도체소자의 콘택 플러그 제조방법 |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3031338A (en) * | 1959-04-03 | 1962-04-24 | Alloyd Res Corp | Metal deposition process and apparatus |
US3385921A (en) * | 1967-06-21 | 1968-05-28 | Electroglas Inc | Diffusion furnace with high speed recovery |
US3521018A (en) * | 1968-09-26 | 1970-07-21 | Ibm | Temperature sensor |
JPS5318151B2 (ko) * | 1971-12-14 | 1978-06-13 | ||
JPS4881474A (ko) * | 1972-01-19 | 1973-10-31 | ||
JPS491174A (ko) * | 1972-04-14 | 1974-01-08 | ||
US3950195A (en) * | 1975-02-21 | 1976-04-13 | Bell Telephone Laboratories, Incorporated | Lpe technique for reducing edge growth |
JPS5335581U (ko) * | 1976-09-01 | 1978-03-29 | ||
JPS5384457A (en) * | 1976-12-29 | 1978-07-25 | Fujitsu Ltd | Liquid-phase epitaxial growth method |
US4154631A (en) * | 1977-05-27 | 1979-05-15 | The United States Of America As Represented By The Secretary Of The Navy | Equilibrium growth technique for preparing PbSx Se1-x epilayers |
JPS584811B2 (ja) * | 1978-10-31 | 1983-01-27 | 富士通株式会社 | 半導体装置の製造方法 |
JPS5683933A (en) * | 1979-12-13 | 1981-07-08 | Sharp Corp | Liquid phase epitaxial growth |
NL185375C (nl) * | 1980-01-16 | 1990-03-16 | Philips Nv | Inrichting voor het epitaxiaal aanbrengen van een laag halfgeleidermateriaal. |
US4348580A (en) * | 1980-05-07 | 1982-09-07 | Tylan Corporation | Energy efficient furnace with movable end wall |
JPS6037076B2 (ja) * | 1980-06-11 | 1985-08-23 | 潤一 西澤 | 3−6族化合物半導体の温度液相成長法 |
JPS5943087B2 (ja) * | 1980-11-26 | 1984-10-19 | 財団法人 半導体研究振興会 | 液相結晶成長装置 |
US4416623A (en) * | 1982-02-01 | 1983-11-22 | Kanto Yakin Kogyo Kabushiki Kaisha | Muffle furnace |
JPS58148426A (ja) * | 1982-03-01 | 1983-09-03 | Semiconductor Res Found | 成長装置 |
JPS59104122A (ja) * | 1982-12-07 | 1984-06-15 | Toshiba Corp | 3−5族液相エピタキシヤル成長方法 |
JPS59136515A (ja) * | 1983-10-13 | 1984-08-06 | Honda Motor Co Ltd | 3弁式多気筒内燃機関 |
DE3539981C1 (de) * | 1985-11-11 | 1987-06-11 | Telog Systems Gmbh | Verfahren und Vorrichtung zur Behandlung von Halbleitermaterialien |
JPS62164122A (ja) * | 1986-01-16 | 1987-07-20 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | キ−ストロ−ク装置 |
US4711989A (en) * | 1986-05-19 | 1987-12-08 | Thermco Systems, Inc. | Diffusion furnace multizone temperature control |
JPS63136515A (ja) * | 1986-11-27 | 1988-06-08 | Nec Corp | 液相エピタキシヤル成長方法 |
-
1987
- 1987-02-21 KR KR870001489A patent/KR880010481A/ko not_active Application Discontinuation
-
1988
- 1988-02-18 JP JP63034124A patent/JPS63209122A/ja active Pending
- 1988-02-19 US US07/157,981 patent/US4918029A/en not_active Expired - Lifetime
-
1990
- 1990-04-16 US US07/509,300 patent/US5068516A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US5068516A (en) | 1991-11-26 |
JPS63209122A (ja) | 1988-08-30 |
US4918029A (en) | 1990-04-17 |
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