KR880005201A - 반도체 봉지용 에폭시수지 조성물 - Google Patents

반도체 봉지용 에폭시수지 조성물 Download PDF

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Publication number
KR880005201A
KR880005201A KR1019860008521A KR860008521A KR880005201A KR 880005201 A KR880005201 A KR 880005201A KR 1019860008521 A KR1019860008521 A KR 1019860008521A KR 860008521 A KR860008521 A KR 860008521A KR 880005201 A KR880005201 A KR 880005201A
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KR
South Korea
Prior art keywords
epoxy resin
semiconductor encapsulation
resin composition
group
general formula
Prior art date
Application number
KR1019860008521A
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English (en)
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KR890004008B1 (ko
Inventor
이정대
문창모
박윤곡
Original Assignee
정상영
고려화학 주식회사
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Application filed by 정상영, 고려화학 주식회사 filed Critical 정상영
Priority to KR1019860008521A priority Critical patent/KR890004008B1/ko
Publication of KR880005201A publication Critical patent/KR880005201A/ko
Application granted granted Critical
Publication of KR890004008B1 publication Critical patent/KR890004008B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/04—Epoxynovolacs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/39—Thiocarbamic acids; Derivatives thereof, e.g. dithiocarbamates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/52—Phosphorus bound to oxygen only
    • C08K5/521—Esters of phosphoric acids, e.g. of H3PO4
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)

Abstract

내용 없음

Description

반도체 봉지용 에폭시수지 조성물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (3)

  1. 노볼락형 에폭시수지, 페놀수지계 경화제로 되는 에폭시수지에서 유기인산 에스테르와 다음 일반식(I)의 황함유 금속염의 혼합물 및 일반식(II)의 비스아마드계 화합물을 배합하는 것을 특징으로 하는 반도체 봉지용 에폭시수지 조성물.
    상기식에서 R3, R2는 서로 독립적으로 같거나 다를 수 있으며, 1관능성의 탄소수 3-10인 포화탄산화수소, 페닐기, 싸이클로헥실기, 벤질기등을 의미하며, M은 IIB족 금속중에서 선정된 아연 또는 카드미움을 의미하며, R3은 1관능성의 탄소수 15-25의 포화탄수의 포화탄화수소, R4는 수소, 메틸 또는 에틸기, R5는 2관능성 벤젠고리, 또는 싸이클로 헥산고리를 의미하며, n은 1-3의 정수를 의미한다.
  2. 제1항에 있어서, 유기인산에스테르와 일반식(I)의 황함유 금속염의 무게비가 98:2-90:10이고, 이 혼합물을 노볼락형 에폭시수지와 페놀수지게 경화제 전체무게 대하여 0.05-10 중량% 배합하는 것을 특징으로 하는 반도체 봉지용 에폭시수지 조성물.
  3. 제1항에 있어서, 일반식(II)의 비스아미드계 화합물을 전체 조성물에 대하여 0.5-5 중량% 배합되는 것을 특징으로 하는 반도체 봉지용 에폭시수지 조성물.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019860008521A 1986-10-11 1986-10-11 반도체 봉지용 에폭시수지 조성물 KR890004008B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019860008521A KR890004008B1 (ko) 1986-10-11 1986-10-11 반도체 봉지용 에폭시수지 조성물

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019860008521A KR890004008B1 (ko) 1986-10-11 1986-10-11 반도체 봉지용 에폭시수지 조성물

Publications (2)

Publication Number Publication Date
KR880005201A true KR880005201A (ko) 1988-06-28
KR890004008B1 KR890004008B1 (ko) 1989-10-16

Family

ID=19252747

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019860008521A KR890004008B1 (ko) 1986-10-11 1986-10-11 반도체 봉지용 에폭시수지 조성물

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KR (1) KR890004008B1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100616213B1 (ko) * 2004-12-22 2006-08-25 제일모직주식회사 반도체 소자 밀봉용 에폭시 수지 조성물

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KR890004008B1 (ko) 1989-10-16

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