KR900018259A - 에폭시 수지 조성물 - Google Patents

에폭시 수지 조성물 Download PDF

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Publication number
KR900018259A
KR900018259A KR1019900006985A KR900006985A KR900018259A KR 900018259 A KR900018259 A KR 900018259A KR 1019900006985 A KR1019900006985 A KR 1019900006985A KR 900006985 A KR900006985 A KR 900006985A KR 900018259 A KR900018259 A KR 900018259A
Authority
KR
South Korea
Prior art keywords
epoxy resin
copolymer
resin composition
molecule
organopolysiloxane
Prior art date
Application number
KR1019900006985A
Other languages
English (en)
Other versions
KR950005311B1 (ko
Inventor
히사시 시미즈
가즈또시 도미요시
하쓰지 시라이즈
도시오 시오바라
Original Assignee
고다까 유따로
신에쓰 가가꾸 고오교 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 고다까 유따로, 신에쓰 가가꾸 고오교 가부시끼가이샤 filed Critical 고다까 유따로
Publication of KR900018259A publication Critical patent/KR900018259A/ko
Application granted granted Critical
Publication of KR950005311B1 publication Critical patent/KR950005311B1/ko

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Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/42Block-or graft-polymers containing polysiloxane sequences
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Abstract

내용 없음

Description

에폭시 수지 조성물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (1)

  1. 에폭시 수지와 경화제, 무기질 충전제를 함유하는 에폭시 수지 조성물(A)에, 알케닐기 함유 에폭시 수지와 하기식(Ⅰ)
    (위 식에서, R은 수소 원자 또는 메틸기이고, a,b,c,d는 각각 a≥1, b≥0, c≥0, d≥0의 정수로서, b+c≥1이며, 메틸기와 페닐기의 합계에 대한 페닐기 함유율이 4-15몰%이고, 1분자중의 규소 원자에 직접 결합된 수소 원자수는 2이상임)의 1분자중의 규소 원자수가 70-300인 오르가노폴리 실록산과 부가 반응에 의하여 얻어지는 공중합체[Ⅰ]을 알케닐기 함유 에폭시 수지와 상기식(1)의ㅣ 1분자 중의 규소 원자수가 20-30인 오르가노폴리 실록산과 부가 반응에 의해 얻어지는 공중합체[Ⅱ]와 공중합체[Ⅱ]/공중합체[Ⅰ]=0.3-0.6의 중량비로 혼합한 공중합체 혼합물(B)를 배합시킨 것을 특징으로 하는 에폭시 수지 조성물.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019900006985A 1989-05-17 1990-05-16 에폭시 수지 조성물 KR950005311B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP1-121348 1989-05-17
JP121348 1989-05-17
JP1121348A JPH062797B2 (ja) 1989-05-17 1989-05-17 エポキシ樹脂組成物

Publications (2)

Publication Number Publication Date
KR900018259A true KR900018259A (ko) 1990-12-20
KR950005311B1 KR950005311B1 (ko) 1995-05-23

Family

ID=14809053

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019900006985A KR950005311B1 (ko) 1989-05-17 1990-05-16 에폭시 수지 조성물

Country Status (4)

Country Link
US (1) US5173544A (ko)
JP (1) JPH062797B2 (ko)
KR (1) KR950005311B1 (ko)
DE (1) DE4015783C2 (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3147677B2 (ja) * 1994-09-30 2001-03-19 株式会社村田製作所 液状エポキシ樹脂組成物
TW538482B (en) * 1999-04-26 2003-06-21 Shinetsu Chemical Co Semiconductor encapsulating epoxy resin composition and semiconductor device
DE102005060860A1 (de) * 2005-12-20 2007-06-28 Robert Bosch Gmbh Elektronikkomponente mit Vergussmasse
WO2009117345A2 (en) 2008-03-17 2009-09-24 Henkel Corporation Adhesive compositions for use in die attach applications
US8698320B2 (en) * 2009-12-07 2014-04-15 Henkel IP & Holding GmbH Curable resin compositions useful as underfill sealants for use with low-k dielectric-containing semiconductor devices
JP6260475B2 (ja) * 2013-08-20 2018-01-17 信越化学工業株式会社 オルガノシロキサン変性ノボラック樹脂及びその製造方法
US9513550B2 (en) 2013-08-20 2016-12-06 Shin-Etsu Chemical Co., Ltd. Positive resist composition and pattern forming process

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5821417A (ja) * 1981-07-29 1983-02-08 Shin Etsu Chem Co Ltd 硬化性エポキシ樹脂組成物
EP0218228B1 (en) * 1985-10-07 1993-09-15 Shin-Etsu Chemical Co., Ltd. Epoxy resin composition

Also Published As

Publication number Publication date
JPH062797B2 (ja) 1994-01-12
DE4015783A1 (de) 1990-11-22
DE4015783C2 (de) 1997-06-12
JPH02302421A (ja) 1990-12-14
KR950005311B1 (ko) 1995-05-23
US5173544A (en) 1992-12-22

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