KR880003549A - 전자부품 장착장치 - Google Patents

전자부품 장착장치 Download PDF

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Publication number
KR880003549A
KR880003549A KR870009093A KR870009093A KR880003549A KR 880003549 A KR880003549 A KR 880003549A KR 870009093 A KR870009093 A KR 870009093A KR 870009093 A KR870009093 A KR 870009093A KR 880003549 A KR880003549 A KR 880003549A
Authority
KR
South Korea
Prior art keywords
electronic component
component mounting
probe
insulator
mounting apparatus
Prior art date
Application number
KR870009093A
Other languages
English (en)
Other versions
KR910000997B1 (ko
Inventor
고오이찌 모리다
스스무 다까이찌
무네요시 후지와라
마끼도 세노
요시히꼬 미사와
Original Assignee
다니이 아끼오
마쓰시다덴기산교 가부시기가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP61196165A external-priority patent/JPS6350767A/ja
Priority claimed from JP61277264A external-priority patent/JPH0767030B2/ja
Application filed by 다니이 아끼오, 마쓰시다덴기산교 가부시기가이샤 filed Critical 다니이 아끼오
Publication of KR880003549A publication Critical patent/KR880003549A/ko
Application granted granted Critical
Publication of KR910000997B1 publication Critical patent/KR910000997B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/082—Integration of non-optical monitoring devices, i.e. using non-optical inspection means, e.g. electrical means, mechanical means or X-rays
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49004—Electrical device making including measuring or testing of device or component part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53261—Means to align and advance work part

Abstract

내용 없음

Description

전자부품 장착장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 일실시예에 있어서의 전자부품 장착장치의 사시도.
제2도는 동 전자부품 장착장치의 개략구성도.
제3도는 동 전자부품 장착장치의 위치규정장치의 평면도.

Claims (5)

  1. 선단을 절연체로 형성한 복수개 또는 1개의 흡착노즐에 의해 부품공급 위치에서 흡착 유지된 전자부품을, 서로 직교하는 2방향으로 부터 협지하여 위치 결정을 행하는 2쌍의 협지구를 가지고, 상기 2쌍의 협지구중 부품의 전극과 대향하는 1쌍의 협지구를 부품의 전극에 전압인가 하도록 부세하고, 또한 부품의 전기제특성을 측정가능하게 착설한 전자부품 장착장치.
  2. 제1항에 있어서, 전극과 대향하는 1쌍의 협지구를, 다시 2분할해서 대향하는 2쌍의 프로우브로 구성하고, 한쪽의 프로우브를 절연체의 슬라이드 블록위에 고정하고 다른쪽의 프로우브를 슬라이드 블록위에서 슬라이드 블록의 동작방향으로 접동 자재하게 착설한 전자부품 장착장치.
  3. 제2항에 있어서, 한쪽의 프로우브와 다른쪽의 프로우브는 선단위치가 다르게 구성한 전자부품 장착장치.
  4. 제1항에 있어서, 흡착노즐선단을 절연체 세라믹으로 구성한 전자부품 장착장치.
  5. 제1항에 있어서, 흡착노즐선단을 절연체 합성수지로 구성한 전자부품 장착장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019870009093A 1986-08-21 1987-08-20 전자부품 장착장치 KR910000997B1 (ko)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP86-196165 1986-08-21
JP196165 1986-08-21
JP61196165A JPS6350767A (ja) 1986-08-21 1986-08-21 電子部品の位置規正装置
JP277264 1986-11-20
JP86-277264 1986-11-20
JP61277264A JPH0767030B2 (ja) 1986-11-20 1986-11-20 電子部品装着装置

Publications (2)

Publication Number Publication Date
KR880003549A true KR880003549A (ko) 1988-05-17
KR910000997B1 KR910000997B1 (ko) 1991-02-19

Family

ID=26509579

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019870009093A KR910000997B1 (ko) 1986-08-21 1987-08-20 전자부품 장착장치

Country Status (4)

Country Link
US (1) US4763405A (ko)
EP (1) EP0257546B1 (ko)
KR (1) KR910000997B1 (ko)
DE (1) DE3785977T2 (ko)

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JPS6444100A (en) * 1987-08-12 1989-02-16 Hitachi Ltd Device for mounting electronic component
EP0306653A1 (de) * 1987-08-20 1989-03-15 Siemens Aktiengesellschaft Einrichtung zur Positionierung von IC-Bausteinen auf einem Substrat
US4914808A (en) * 1987-10-16 1990-04-10 Sanyo Electric Co., Ltd Automatic electronic parts mounting apparatus for repeatedly mounting in forward and reverse sequences
EP0315799B1 (de) * 1987-11-10 1992-05-06 Siemens Aktiengesellschaft Vorrichtung und Verfahren zum Bestücken von Leiterplatten mit Bauelementen
JPH07109957B2 (ja) * 1988-06-21 1995-11-22 松下電器産業株式会社 電子部品装着方法
US4969256A (en) * 1988-11-25 1990-11-13 Matsushita Electric Industrial Co., Ltd. Method of mounting electronic parts to circuit board
EP0395002A3 (en) * 1989-04-28 1991-07-10 Sanyo Electric Co., Ltd. Electronic parts mounting apparatus
JPH02303100A (ja) * 1989-05-17 1990-12-17 Matsushita Electric Ind Co Ltd 部品装着方法
US5339248A (en) * 1992-08-27 1994-08-16 Matsushita Electric Industrial Co., Ltd. Apparatus for mounting electronic component on substrate
JPH0664180U (ja) * 1993-02-17 1994-09-09 株式会社アドバンテスト Ｉｃハンドラにおける搬送装置
GB2291715A (en) * 1995-04-26 1996-01-31 Memory Corp Plc Improved test and assembly apparatus
US20020121018A1 (en) * 1995-07-12 2002-09-05 Kunio Sakurai Component feeding method
US6171049B1 (en) * 1996-02-29 2001-01-09 Alphasem Ag Method and device for receiving, orientating and assembling of components
DE59712127D1 (de) * 1996-09-27 2005-01-27 Siemens Ag Kontakteinrichtung zum Testen von elektrischen Bauelementen in Bestückautomaten
WO1998033368A1 (de) * 1997-01-28 1998-07-30 Siemens Aktiengesellschaft Vakuumpipette zum greifen von elektrischen bauelementen
JP2997231B2 (ja) * 1997-09-12 2000-01-11 富士通株式会社 マルチ半導体ベアチップ実装モジュールの製造方法
AU3352700A (en) * 1999-01-29 2000-08-18 Bp Microsystems, Inc. In-line programming system and method
CH695871A5 (fr) * 2002-11-07 2006-09-29 Ismeca Semiconductor Holding Dispositif et procédé pour le test de composants électroniques.
EP1708684A2 (en) 2003-09-26 2006-10-11 Alza Corporation Drug coating providing high drug loading and methods for providing the same
WO2005030182A1 (en) * 2003-09-26 2005-04-07 Alza Corporation Controlled release formulations exhibiting an ascending rate of release
JP5670609B2 (ja) * 2003-09-26 2015-02-18 アルザ・コーポレーシヨン 有効成分の制御送達のためのｏｒｏｓプッシュ−スティック
NZ546182A (en) * 2003-09-26 2009-08-28 Alza Corp Controlled release formulations of opioid and nonopioid analgesics such as hydrocodone and acetaminophen
WO2005061188A1 (ja) 2003-12-19 2005-07-07 Matsushita Electric Industrial Co., Ltd. 部品装着ヘッド、吸着ノズル、及び吸着ノズルの製造方法
US8541026B2 (en) 2004-09-24 2013-09-24 Abbvie Inc. Sustained release formulations of opioid and nonopioid analgesics
US7165462B2 (en) * 2004-11-29 2007-01-23 Hitachi Global Storage Technologies Netherlands B.V. Individual slider testing
EP2284862A1 (en) * 2009-08-11 2011-02-16 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO System and method for picking and placement of chip dies
CN106644405B (zh) * 2016-12-01 2023-04-18 深圳市标谱半导体股份有限公司 微小电子元件测试分光设备
CN108715343A (zh) * 2018-06-04 2018-10-30 深圳市汉匠自动化科技有限公司 一种全自动ic烧录机
CN110813773B (zh) * 2019-10-23 2023-06-16 台晶(宁波)电子有限公司 一种用于镀膜后的石英芯片的频率自动测量设备

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US4593820A (en) * 1984-03-28 1986-06-10 International Business Machines Corporation Robotic, in-transit, device tester/sorter
US4627157A (en) * 1984-05-25 1986-12-09 Zenith Electronics Corporation Insertion verification and crimping of leads

Also Published As

Publication number Publication date
US4763405A (en) 1988-08-16
EP0257546B1 (en) 1993-05-26
DE3785977D1 (de) 1993-07-01
KR910000997B1 (ko) 1991-02-19
EP0257546A3 (en) 1990-04-18
DE3785977T2 (de) 1993-09-02
EP0257546A2 (en) 1988-03-02

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