DE3785977T2 - Maschine zur positionierung von chips mit prueffunktion. - Google Patents

Maschine zur positionierung von chips mit prueffunktion.

Info

Publication number
DE3785977T2
DE3785977T2 DE8787112041T DE3785977T DE3785977T2 DE 3785977 T2 DE3785977 T2 DE 3785977T2 DE 8787112041 T DE8787112041 T DE 8787112041T DE 3785977 T DE3785977 T DE 3785977T DE 3785977 T2 DE3785977 T2 DE 3785977T2
Authority
DE
Germany
Prior art keywords
machine
test function
positioning chips
chips
positioning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8787112041T
Other languages
English (en)
Other versions
DE3785977D1 (de
Inventor
Koichi Morita
Susumu Takaichi
Muneyoshi Fujiwara
Makito Seno
Yoshihiko Misawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP61196165A external-priority patent/JPS6350767A/ja
Priority claimed from JP61277264A external-priority patent/JPH0767030B2/ja
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of DE3785977D1 publication Critical patent/DE3785977D1/de
Application granted granted Critical
Publication of DE3785977T2 publication Critical patent/DE3785977T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/082—Integration of non-optical monitoring devices, i.e. using non-optical inspection means, e.g. electrical means, mechanical means or X-rays
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49004—Electrical device making including measuring or testing of device or component part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53261—Means to align and advance work part
DE8787112041T 1986-08-21 1987-08-19 Maschine zur positionierung von chips mit prueffunktion. Expired - Fee Related DE3785977T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP61196165A JPS6350767A (ja) 1986-08-21 1986-08-21 電子部品の位置規正装置
JP61277264A JPH0767030B2 (ja) 1986-11-20 1986-11-20 電子部品装着装置

Publications (2)

Publication Number Publication Date
DE3785977D1 DE3785977D1 (de) 1993-07-01
DE3785977T2 true DE3785977T2 (de) 1993-09-02

Family

ID=26509579

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8787112041T Expired - Fee Related DE3785977T2 (de) 1986-08-21 1987-08-19 Maschine zur positionierung von chips mit prueffunktion.

Country Status (4)

Country Link
US (1) US4763405A (de)
EP (1) EP0257546B1 (de)
KR (1) KR910000997B1 (de)
DE (1) DE3785977T2 (de)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6444100A (en) * 1987-08-12 1989-02-16 Hitachi Ltd Device for mounting electronic component
EP0306653A1 (de) * 1987-08-20 1989-03-15 Siemens Aktiengesellschaft Einrichtung zur Positionierung von IC-Bausteinen auf einem Substrat
US4914808A (en) * 1987-10-16 1990-04-10 Sanyo Electric Co., Ltd Automatic electronic parts mounting apparatus for repeatedly mounting in forward and reverse sequences
ATE75900T1 (de) * 1987-11-10 1992-05-15 Siemens Ag Vorrichtung und verfahren zum bestuecken von leiterplatten mit bauelementen.
JPH07109957B2 (ja) * 1988-06-21 1995-11-22 松下電器産業株式会社 電子部品装着方法
US4969256A (en) * 1988-11-25 1990-11-13 Matsushita Electric Industrial Co., Ltd. Method of mounting electronic parts to circuit board
EP0395002A3 (de) * 1989-04-28 1991-07-10 Sanyo Electric Co., Ltd. Vorrichtung zum Montieren von elektronischen Komponenten
JPH02303100A (ja) * 1989-05-17 1990-12-17 Matsushita Electric Ind Co Ltd 部品装着方法
US5339248A (en) * 1992-08-27 1994-08-16 Matsushita Electric Industrial Co., Ltd. Apparatus for mounting electronic component on substrate
JPH0664180U (ja) * 1993-02-17 1994-09-09 株式会社アドバンテスト Ｉｃハンドラにおける搬送装置
GB2291715A (en) * 1995-04-26 1996-01-31 Memory Corp Plc Improved test and assembly apparatus
US20020121018A1 (en) * 1995-07-12 2002-09-05 Kunio Sakurai Component feeding method
EP0883979B1 (de) * 1996-02-29 1999-10-13 Alphasem AG Verfahren und vorrichtung zum aufnehmen, orientieren und montieren von bauelementen
EP0833164B1 (de) * 1996-09-27 2004-12-22 Siemens Aktiengesellschaft Kontakteinrichtung zum Testen von elektrischen Bauelementen in Bestückautomaten
WO1998033368A1 (de) * 1997-01-28 1998-07-30 Siemens Aktiengesellschaft Vakuumpipette zum greifen von elektrischen bauelementen
JP2997231B2 (ja) * 1997-09-12 2000-01-11 富士通株式会社 マルチ半導体ベアチップ実装モジュールの製造方法
US6230067B1 (en) 1999-01-29 2001-05-08 Bp Microsystems In-line programming system and method
CH695871A5 (fr) * 2002-11-07 2006-09-29 Ismeca Semiconductor Holding Dispositif et procédé pour le test de composants électroniques.
WO2005030166A1 (en) * 2003-09-26 2005-04-07 Alza Corporation Oros push-stick for controlled delivery of active agents
EP1708684A2 (de) * 2003-09-26 2006-10-11 Alza Corporation Arzneimittelbeschichtung mit hoher arzneimittelbeladung und verfahren dafür
US20050158382A1 (en) * 2003-09-26 2005-07-21 Evangeline Cruz Controlled release formulations of opioid and nonopioid analgesics
KR101169614B1 (ko) * 2003-09-26 2012-08-03 알자 코포레이션 상승한 방출 속도를 나타내는 제어 방출 제제
WO2005061188A1 (ja) * 2003-12-19 2005-07-07 Matsushita Electric Industrial Co., Ltd. 部品装着ヘッド、吸着ノズル、及び吸着ノズルの製造方法
US8541026B2 (en) 2004-09-24 2013-09-24 Abbvie Inc. Sustained release formulations of opioid and nonopioid analgesics
US7165462B2 (en) * 2004-11-29 2007-01-23 Hitachi Global Storage Technologies Netherlands B.V. Individual slider testing
EP2284862A1 (de) * 2009-08-11 2011-02-16 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO System und Verfahren zum Aufnehmen und Platzieren von Chips
CN106644405B (zh) * 2016-12-01 2023-04-18 深圳市标谱半导体股份有限公司 微小电子元件测试分光设备
CN108715343A (zh) * 2018-06-04 2018-10-30 深圳市汉匠自动化科技有限公司 一种全自动ic烧录机
CN110813773B (zh) * 2019-10-23 2023-06-16 台晶(宁波)电子有限公司 一种用于镀膜后的石英芯片的频率自动测量设备

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5599795A (en) * 1979-01-25 1980-07-30 Matsushita Electric Ind Co Ltd Device for mounting electronic part
GB2049616B (en) * 1979-05-22 1982-12-22 Marconi Co Ltd Manipulator mechanisms
US4458412A (en) * 1981-05-06 1984-07-10 Universal Instruments Corporation Leadless chip placement machine for printed circuit boards
US4557043A (en) * 1983-12-05 1985-12-10 Rca Corporation Component lead processing apparatus
US4593820A (en) * 1984-03-28 1986-06-10 International Business Machines Corporation Robotic, in-transit, device tester/sorter
US4627157A (en) * 1984-05-25 1986-12-09 Zenith Electronics Corporation Insertion verification and crimping of leads

Also Published As

Publication number Publication date
KR910000997B1 (ko) 1991-02-19
EP0257546A3 (en) 1990-04-18
US4763405A (en) 1988-08-16
DE3785977D1 (de) 1993-07-01
KR880003549A (ko) 1988-05-17
EP0257546B1 (de) 1993-05-26
EP0257546A2 (de) 1988-03-02

Similar Documents

Publication Publication Date Title
DE3785977D1 (de) Maschine zur positionierung von chips mit prueffunktion.
DE3584925D1 (de) Naehmaschine.
DE199664T1 (de) Maschine zur handhabung von bohrlochgestaengen.
DE3776937D1 (de) Werkzeugmaschine.
DE3650294T2 (de) Automatische Kantenschleifmaschine.
DE3774324D1 (de) Vorrichtung zur zusammenfuehrung von laserstrahlen.
DE3888106D1 (de) Maschine zur Oberflächenbearbeitung mit Vorrichtungen zur Positionierung von Bearbeitungswerkzeugen.
DE3771665D1 (de) Waschmaschine mit vorrichtung zur vermeidung von schaumbildung.
IT8719334A0 (it) Macchina impastatrice.
DE3762818D1 (de) Planschneidemaschine.
NO164610C (no) Symaskin.
DE3767815D1 (de) Sortiermaschine.
DE3683068D1 (de) Naehmaschine.
DE3773483D1 (de) Naehmaschine.
DE3778555D1 (de) Bindemaschine.
DE3770543D1 (de) Vorrichtung zum praezisionsplazieren von wagen.
DE3785980D1 (de) Automatische naehmaschine.
DE3771833D1 (de) Werkzeugmaschine.
DE3766423D1 (de) Werkzeugmaschine.
DE3677963D1 (de) Werkzeugmaschine.
DE3767619D1 (de) Sortiermaschine.
DE68907944T2 (de) Maschine zur Positionierung und Kontrolle von Halbleiterelementen.
DE3787150D1 (de) Automatische Flachstrickmaschine.
ES1006362Y (es) Maquina de coser.
DE3879878D1 (de) Maschine zur selbsttaetigen abgabe von schalen.

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8320 Willingness to grant licences declared (paragraph 23)
8339 Ceased/non-payment of the annual fee