KR870003554A - 비소화칼륨 단결정 박막의 기상 에피택셜 성장방법 - Google Patents
비소화칼륨 단결정 박막의 기상 에피택셜 성장방법 Download PDFInfo
- Publication number
- KR870003554A KR870003554A KR1019860007460A KR860007460A KR870003554A KR 870003554 A KR870003554 A KR 870003554A KR 1019860007460 A KR1019860007460 A KR 1019860007460A KR 860007460 A KR860007460 A KR 860007460A KR 870003554 A KR870003554 A KR 870003554A
- Authority
- KR
- South Korea
- Prior art keywords
- single crystal
- growing
- carrier concentration
- concentration layer
- range
- Prior art date
Links
- 239000013078 crystal Substances 0.000 title claims 7
- 239000010409 thin film Substances 0.000 title claims 2
- KWLSQQRRSAWBOQ-UHFFFAOYSA-N dipotassioarsanylpotassium Chemical compound [K][As]([K])[K] KWLSQQRRSAWBOQ-UHFFFAOYSA-N 0.000 title 1
- 239000012808 vapor phase Substances 0.000 title 1
- 239000000758 substrate Substances 0.000 claims 5
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 claims 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims 1
- 229910052785 arsenic Inorganic materials 0.000 claims 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 claims 1
- 229910052733 gallium Inorganic materials 0.000 claims 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02538—Group 13/15 materials
- H01L21/02546—Arsenides
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
- C30B29/42—Gallium arsenide
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02387—Group 13/15 materials
- H01L21/02395—Arsenides
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/02433—Crystal orientation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/0257—Doping during depositing
- H01L21/02573—Conductivity type
- H01L21/02576—N-type
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02658—Pretreatments
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Recrystallisation Techniques (AREA)
- Junction Field-Effect Transistors (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
Claims (6)
- 비소화갈륨 단결정 기판상에 캐리어 농도가 다른 복수의 층으로 이루어지는 n형 비소화갈륨 단결정 박막을, 기상 에피택셜 성장시킬때에 기상 에피택셜 성장용 가스중에 포함되는 갈륨과 비소의 원자수비, [Ga]/[As]를 1보다도 크게 하여 저캐리어 농도층을 성장시키고 또, [Ga]/[As]를 1보다도 작게 하여 고캐리어 농도층을 성장시키는 방법에 있어서, 저캐리어 농도층을 성장시킬때에 단결정 기판의 농도를 690 내지 730℃의 범위로 유지하는 것을 특징으로 하는 방법.
- 제 1 항에 있어서, 고캐리어의 농도층을 성장시킬때는, 단결정 기판의 온도를 735 내지 830℃의 범위로 유지하는 것을 특징으로 하는 방법.
- 제 1 항 또는 제2항에 있어서, 저 캐리어 농도층을 성장시킬때에 단결정 기판의 온도를 700 내지 730℃의 범위로 유지하는 것을 특징으로 하는 방법.
- 제 1 항 또는 제 3 항에 있어서, 고캐리어 농도층을 성장시킬때에 단결정 기판의 온도를 735 내지 760℃의 범위로 유지하는 것을 특징으로 하는 방법.
- 제 1 항, 제2항, 제3항 또는 제4항에 있어서, 저캐리어 농도층을 성장시킬때에 [Ga]/[As]를 2 내지 10의 범위로 유지하는 것을 특징으로 하는 방법.
- 제 1 항, 제2항, 제3항, 제4항 또는 제5항에 있어서, 고캐리어 농도층을 성장시킬때에 [Ga]/[As]를 0.1 내지 0.8의 범위로 유지하는 것을 특징으로 하는 방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60-198904 | 1985-09-09 | ||
JP60198904A JPS6259595A (ja) | 1985-09-09 | 1985-09-09 | ひ化ガリウム単結晶薄膜の気相エピタキシヤル成長方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR870003554A true KR870003554A (ko) | 1987-04-18 |
KR900002080B1 KR900002080B1 (ko) | 1990-03-31 |
Family
ID=16398877
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019860007460A KR900002080B1 (ko) | 1985-09-09 | 1986-09-06 | 비소화칼륨 단결정 박막의 기상 에피택셜 성장방법 |
Country Status (3)
Country | Link |
---|---|
US (1) | US4756792A (ko) |
JP (1) | JPS6259595A (ko) |
KR (1) | KR900002080B1 (ko) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61275191A (ja) * | 1985-05-29 | 1986-12-05 | Furukawa Electric Co Ltd:The | GaAs薄膜の気相成長法 |
US4910167A (en) * | 1987-11-13 | 1990-03-20 | Kopin Corporation | III-V Semiconductor growth initiation on silicon using TMG and TEG |
US5145807A (en) * | 1988-05-11 | 1992-09-08 | Mitsubishi Kasei Corporation | Method of making semiconductor laser devices |
JP2701339B2 (ja) * | 1988-07-22 | 1998-01-21 | 日本電気株式会社 | 気相成長装置 |
US6010937A (en) * | 1995-09-05 | 2000-01-04 | Spire Corporation | Reduction of dislocations in a heteroepitaxial semiconductor structure |
US5834379A (en) * | 1996-07-16 | 1998-11-10 | Cornell Research Foundation, Inc. | Process for synthesis of cubic GaN on GaAs using NH3 in an RF plasma process |
US5979614A (en) * | 1996-09-25 | 1999-11-09 | Nippon Steel Corporation | Brake disc produced from martensitic stainless steel and process for producing same |
US7214269B2 (en) * | 2004-10-15 | 2007-05-08 | Hitachi Cable, Ltd. | Si-doped GaAs single crystal substrate |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3836408A (en) * | 1970-12-21 | 1974-09-17 | Hitachi Ltd | Production of epitaxial films of semiconductor compound material |
US3762945A (en) * | 1972-05-01 | 1973-10-02 | Bell Telephone Labor Inc | Technique for the fabrication of a millimeter wave beam lead schottkybarrier device |
US3925119A (en) * | 1973-05-07 | 1975-12-09 | Ibm | Method for vapor deposition of gallium arsenide phosphide upon gallium arsenide substrates |
US3904449A (en) * | 1974-05-09 | 1975-09-09 | Bell Telephone Labor Inc | Growth technique for high efficiency gallium arsenide impatt diodes |
JPS5577131A (en) * | 1978-12-06 | 1980-06-10 | Mitsubishi Monsanto Chem Co | Vapor phase growth of compound semiconductor epitaxial film |
JPS56138917A (en) * | 1980-03-31 | 1981-10-29 | Fujitsu Ltd | Vapor phase epitaxial growth |
JPS57111016A (en) * | 1980-12-26 | 1982-07-10 | Mitsubishi Monsanto Chem Co | Manufacture of gallium phosphide arsenide mixed crystal epitaxial wafer |
US4407694A (en) * | 1981-06-22 | 1983-10-04 | Hughes Aircraft Company | Multi-range doping of epitaxial III-V layers from a single source |
-
1985
- 1985-09-09 JP JP60198904A patent/JPS6259595A/ja active Granted
-
1986
- 1986-09-05 US US06/904,178 patent/US4756792A/en not_active Expired - Fee Related
- 1986-09-06 KR KR1019860007460A patent/KR900002080B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR900002080B1 (ko) | 1990-03-31 |
JPH0510317B2 (ko) | 1993-02-09 |
US4756792A (en) | 1988-07-12 |
JPS6259595A (ja) | 1987-03-16 |
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