JPS5673427A - Manufacture of gallium arsenide epitaxial wafer - Google Patents
Manufacture of gallium arsenide epitaxial waferInfo
- Publication number
- JPS5673427A JPS5673427A JP15025379A JP15025379A JPS5673427A JP S5673427 A JPS5673427 A JP S5673427A JP 15025379 A JP15025379 A JP 15025379A JP 15025379 A JP15025379 A JP 15025379A JP S5673427 A JPS5673427 A JP S5673427A
- Authority
- JP
- Japan
- Prior art keywords
- hcl
- layer
- flow rate
- gaas
- specified
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02387—Group 13/15 materials
- H01L21/02395—Arsenides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02538—Group 13/15 materials
- H01L21/02546—Arsenides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/0257—Doping during depositing
- H01L21/02573—Conductivity type
- H01L21/02576—N-type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
Abstract
PURPOSE:To obtain an N<+>-N<->-N<+> layer with good reproducibility in gaseous phase epitaxial growth of GaAs, by performing etching in the Ga atmosphere in the case of forming an N<+>-N<-> interface, and performing etching in the As atmosphere in the case of forming the N<->-N<+> interface. CONSTITUTION:An N<+> GaAs layer is provided on the surface of a single crystal substrate of N type GaAs by using AsH3-Ga-HCl-H2 series gas, and an N<-> layer is grown to the specified thickness in the gaseous phase. The growing is stopped, As component is flowed at a specified flow rate, and the etching is performed by HCl. The more the flow rate of the As component, the smoother the profile of the change in carrier concentration. Then a specified amount of the N type dopant is supplied, and the N<-> layer is grown. After the specified thickness is obtained, the growing is stopped. HCl for Ga transportation is flowed at a specified flow rate, other HCl is introduced, and the etching is performed. If the flow rate of HCl for Ga transportation is 2X10<-4>mol/min. or more, the steep rising of the carrier concentration with a dip can be obtained. In this constitution, the GaAs epitaxial layer with the N<+>-N<->-N<+> structure can be obtained with good reproducibility.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15025379A JPS5673427A (en) | 1979-11-20 | 1979-11-20 | Manufacture of gallium arsenide epitaxial wafer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15025379A JPS5673427A (en) | 1979-11-20 | 1979-11-20 | Manufacture of gallium arsenide epitaxial wafer |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5673427A true JPS5673427A (en) | 1981-06-18 |
JPS6222444B2 JPS6222444B2 (en) | 1987-05-18 |
Family
ID=15492895
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15025379A Granted JPS5673427A (en) | 1979-11-20 | 1979-11-20 | Manufacture of gallium arsenide epitaxial wafer |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5673427A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100768803B1 (en) * | 2001-06-14 | 2007-10-19 | 익시스 코포레이션 | Semiconductor devices having group ?-? compound layers |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4915991A (en) * | 1972-06-05 | 1974-02-12 |
-
1979
- 1979-11-20 JP JP15025379A patent/JPS5673427A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4915991A (en) * | 1972-06-05 | 1974-02-12 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100768803B1 (en) * | 2001-06-14 | 2007-10-19 | 익시스 코포레이션 | Semiconductor devices having group ?-? compound layers |
Also Published As
Publication number | Publication date |
---|---|
JPS6222444B2 (en) | 1987-05-18 |
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