KR860009486A - 전자 장치 및 이에 사용되는 리이드 프레임 - Google Patents

전자 장치 및 이에 사용되는 리이드 프레임

Info

Publication number
KR860009486A
KR860009486A KR1019860003945A KR860003945A KR860009486A KR 860009486 A KR860009486 A KR 860009486A KR 1019860003945 A KR1019860003945 A KR 1019860003945A KR 860003945 A KR860003945 A KR 860003945A KR 860009486 A KR860009486 A KR 860009486A
Authority
KR
South Korea
Prior art keywords
electronic device
lead frame
frame used
lead
electronic
Prior art date
Application number
KR1019860003945A
Other languages
English (en)
Other versions
KR930007370B1 (ko
Inventor
시게루 이시이
이찌오 시미즈
Original Assignee
가부시끼가이샤 히다찌세이사꾸쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시끼가이샤 히다찌세이사꾸쇼 filed Critical 가부시끼가이샤 히다찌세이사꾸쇼
Publication of KR860009486A publication Critical patent/KR860009486A/ko
Application granted granted Critical
Publication of KR930007370B1 publication Critical patent/KR930007370B1/ko

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Classifications

    • H—ELECTRICITY
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
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    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
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    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H05K3/308—Adaptations of leads
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
KR1019860003945A 1985-05-24 1986-05-21 전자 장치 및 이에 사용되는 리이드 프레임 KR930007370B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP60110363A JPS61269345A (ja) 1985-05-24 1985-05-24 半導体装置
JP110363/60 1985-05-24

Publications (2)

Publication Number Publication Date
KR860009486A true KR860009486A (ko) 1986-12-23
KR930007370B1 KR930007370B1 (ko) 1993-08-09

Family

ID=14533887

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019860003945A KR930007370B1 (ko) 1985-05-24 1986-05-21 전자 장치 및 이에 사용되는 리이드 프레임

Country Status (3)

Country Link
US (1) US4725692A (ko)
JP (1) JPS61269345A (ko)
KR (1) KR930007370B1 (ko)

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JPS6281738A (ja) * 1985-10-07 1987-04-15 Hitachi Micro Comput Eng Ltd リ−ドフレ−ムおよびそれを用いた半導体装置
US4875138A (en) * 1986-10-20 1989-10-17 United Technologies Corporation Variable pitch IC bond pad arrangement
JPS63142894A (ja) * 1986-12-06 1988-06-15 株式会社東芝 フラツトパツケ−ジ集積回路の配線基板
US5144412A (en) * 1987-02-19 1992-09-01 Olin Corporation Process for manufacturing plastic pin grid arrays and the product produced thereby
JPH0828455B2 (ja) * 1988-02-24 1996-03-21 富士通株式会社 リードフレーム及びそれを用いた電子部品の製造方法
US5260601A (en) * 1988-03-14 1993-11-09 Texas Instruments Incorporated Edge-mounted, surface-mount package for semiconductor integrated circuit devices
AU627076B2 (en) * 1990-03-13 1992-08-13 Sumitomo Electric Industries, Ltd. Optical module and process of producing the same
US5160810A (en) * 1990-05-07 1992-11-03 Synergy Microwave Corporation Universal surface mount package
US5122621A (en) * 1990-05-07 1992-06-16 Synergy Microwave Corporation Universal surface mount package
JPH0494565A (ja) * 1990-08-10 1992-03-26 Toshiba Corp 半導体装置
US5134094A (en) * 1991-07-22 1992-07-28 Silicon Power Corporation Single inline packaged solid state relay with high current density capability
US5220197A (en) * 1991-07-22 1993-06-15 Silicon Power Corporation Single inline packaged solid state relay with high current density capability
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US4725692A (en) 1988-02-16
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