KR860009486A - 전자 장치 및 이에 사용되는 리이드 프레임 - Google Patents
전자 장치 및 이에 사용되는 리이드 프레임Info
- Publication number
- KR860009486A KR860009486A KR1019860003945A KR860003945A KR860009486A KR 860009486 A KR860009486 A KR 860009486A KR 1019860003945 A KR1019860003945 A KR 1019860003945A KR 860003945 A KR860003945 A KR 860003945A KR 860009486 A KR860009486 A KR 860009486A
- Authority
- KR
- South Korea
- Prior art keywords
- electronic device
- lead frame
- frame used
- lead
- electronic
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
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- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
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- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
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- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
- H01L23/49551—Cross section geometry characterised by bent parts
- H01L23/49555—Cross section geometry characterised by bent parts the bent parts being the outer leads
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- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49568—Lead-frames or other flat leads specifically adapted to facilitate heat dissipation
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
- H05K3/308—Adaptations of leads
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Geometry (AREA)
- Lead Frames For Integrated Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60110363A JPS61269345A (ja) | 1985-05-24 | 1985-05-24 | 半導体装置 |
JP110363/60 | 1985-05-24 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR860009486A true KR860009486A (ko) | 1986-12-23 |
KR930007370B1 KR930007370B1 (ko) | 1993-08-09 |
Family
ID=14533887
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019860003945A KR930007370B1 (ko) | 1985-05-24 | 1986-05-21 | 전자 장치 및 이에 사용되는 리이드 프레임 |
Country Status (3)
Country | Link |
---|---|
US (1) | US4725692A (ko) |
JP (1) | JPS61269345A (ko) |
KR (1) | KR930007370B1 (ko) |
Families Citing this family (60)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6281738A (ja) * | 1985-10-07 | 1987-04-15 | Hitachi Micro Comput Eng Ltd | リ−ドフレ−ムおよびそれを用いた半導体装置 |
US4875138A (en) * | 1986-10-20 | 1989-10-17 | United Technologies Corporation | Variable pitch IC bond pad arrangement |
JPS63142894A (ja) * | 1986-12-06 | 1988-06-15 | 株式会社東芝 | フラツトパツケ−ジ集積回路の配線基板 |
US5144412A (en) * | 1987-02-19 | 1992-09-01 | Olin Corporation | Process for manufacturing plastic pin grid arrays and the product produced thereby |
JPH0828455B2 (ja) * | 1988-02-24 | 1996-03-21 | 富士通株式会社 | リードフレーム及びそれを用いた電子部品の製造方法 |
US5260601A (en) * | 1988-03-14 | 1993-11-09 | Texas Instruments Incorporated | Edge-mounted, surface-mount package for semiconductor integrated circuit devices |
EP0446410B1 (en) * | 1990-03-13 | 1999-12-22 | Sumitomo Electric Industries, Ltd. | Optical module and process of producing the same |
US5122621A (en) * | 1990-05-07 | 1992-06-16 | Synergy Microwave Corporation | Universal surface mount package |
US5160810A (en) * | 1990-05-07 | 1992-11-03 | Synergy Microwave Corporation | Universal surface mount package |
JPH0494565A (ja) * | 1990-08-10 | 1992-03-26 | Toshiba Corp | 半導体装置 |
US5134094A (en) * | 1991-07-22 | 1992-07-28 | Silicon Power Corporation | Single inline packaged solid state relay with high current density capability |
US5220197A (en) * | 1991-07-22 | 1993-06-15 | Silicon Power Corporation | Single inline packaged solid state relay with high current density capability |
JPH05206314A (ja) * | 1991-11-12 | 1993-08-13 | Nec Corp | 半導体装置 |
JP2745933B2 (ja) * | 1992-02-17 | 1998-04-28 | 日本電気株式会社 | Tab−集積回路 |
CH686325A5 (de) * | 1992-11-27 | 1996-02-29 | Esec Sempac Sa | Elektronikmodul und Chip-Karte. |
AU6032394A (en) * | 1993-01-22 | 1994-08-15 | Motorola, Inc. | Self aligning surface mount electrical component |
US5557144A (en) * | 1993-01-29 | 1996-09-17 | Anadigics, Inc. | Plastic packages for microwave frequency applications |
JP3185480B2 (ja) * | 1993-07-05 | 2001-07-09 | 富士通株式会社 | Icキャリア |
US5489217A (en) * | 1994-10-11 | 1996-02-06 | Methode Electronics, Inc. | Zero insertion force pin grid array socket |
US5541451A (en) * | 1994-10-24 | 1996-07-30 | Kabushiki Kaisha Toshiba | Packaged semiconductor device with external leads having anchor holes provided at polyamide/glass sealed regions |
US5610436A (en) * | 1995-06-07 | 1997-03-11 | Bourns, Inc. | Surface mount device with compensation for thermal expansion effects |
US5781682A (en) * | 1996-02-01 | 1998-07-14 | International Business Machines Corporation | Low-cost packaging for parallel optical computer link |
JP2001267449A (ja) | 2000-03-15 | 2001-09-28 | Nec Corp | Lsiパッケ−ジ及びそれに用いる内部接続工法 |
JP2004511087A (ja) * | 2000-09-21 | 2004-04-08 | データトロニック ディストリビューション インコーポレーテッド | 気密封止した部品組立体パッケージ |
DE10136578B4 (de) * | 2001-07-27 | 2005-05-04 | Micronas Gmbh | Verfahren zum Prüfen eines Chips mit einem Gehäuse und zum Bestücken einer Platine mit dem Gehäuse sowie Chip mit einem Gehäuse |
US6979900B2 (en) * | 2003-10-21 | 2005-12-27 | Delphi Technologies, Inc. | Integrated circuit package with integral leadframe convector and method therefor |
US20070096269A1 (en) | 2005-10-31 | 2007-05-03 | Mediatek Inc. | Leadframe for semiconductor packages |
US9640467B2 (en) * | 2009-08-05 | 2017-05-02 | Continental Teves Ag & Co. Ohg | Sensor arrangement and chip comprising additional fixing pins |
CN102208382B (zh) * | 2010-03-29 | 2013-05-22 | 广达电脑股份有限公司 | 具有侧边接脚的集成电路封装元件 |
US8482111B2 (en) | 2010-07-19 | 2013-07-09 | Tessera, Inc. | Stackable molded microelectronic packages |
KR101128063B1 (ko) | 2011-05-03 | 2012-04-23 | 테세라, 인코포레이티드 | 캡슐화 층의 표면에 와이어 본드를 구비하는 패키지 적층형 어셈블리 |
US8404520B1 (en) | 2011-10-17 | 2013-03-26 | Invensas Corporation | Package-on-package assembly with wire bond vias |
US8946757B2 (en) | 2012-02-17 | 2015-02-03 | Invensas Corporation | Heat spreading substrate with embedded interconnects |
US8835228B2 (en) | 2012-05-22 | 2014-09-16 | Invensas Corporation | Substrate-less stackable package with wire-bond interconnect |
US9502390B2 (en) | 2012-08-03 | 2016-11-22 | Invensas Corporation | BVA interposer |
US9287200B2 (en) * | 2013-06-27 | 2016-03-15 | Freescale Semiconductor, Inc. | Packaged semiconductor device |
US9167710B2 (en) | 2013-08-07 | 2015-10-20 | Invensas Corporation | Embedded packaging with preformed vias |
CN103441114A (zh) * | 2013-08-16 | 2013-12-11 | 无锡万银半导体科技有限公司 | 一种半导体封装结构 |
US20150076714A1 (en) | 2013-09-16 | 2015-03-19 | Invensas Corporation | Microelectronic element with bond elements to encapsulation surface |
US9583456B2 (en) | 2013-11-22 | 2017-02-28 | Invensas Corporation | Multiple bond via arrays of different wire heights on a same substrate |
US9379074B2 (en) | 2013-11-22 | 2016-06-28 | Invensas Corporation | Die stacks with one or more bond via arrays of wire bond wires and with one or more arrays of bump interconnects |
US9263394B2 (en) | 2013-11-22 | 2016-02-16 | Invensas Corporation | Multiple bond via arrays of different wire heights on a same substrate |
US9583411B2 (en) | 2014-01-17 | 2017-02-28 | Invensas Corporation | Fine pitch BVA using reconstituted wafer with area array accessible for testing |
US10381326B2 (en) | 2014-05-28 | 2019-08-13 | Invensas Corporation | Structure and method for integrated circuits packaging with increased density |
US9735084B2 (en) | 2014-12-11 | 2017-08-15 | Invensas Corporation | Bond via array for thermal conductivity |
US9888579B2 (en) | 2015-03-05 | 2018-02-06 | Invensas Corporation | Pressing of wire bond wire tips to provide bent-over tips |
US9502372B1 (en) | 2015-04-30 | 2016-11-22 | Invensas Corporation | Wafer-level packaging using wire bond wires in place of a redistribution layer |
US9761554B2 (en) | 2015-05-07 | 2017-09-12 | Invensas Corporation | Ball bonding metal wire bond wires to metal pads |
JP6582678B2 (ja) * | 2015-07-27 | 2019-10-02 | 三菱電機株式会社 | 半導体装置 |
US10490528B2 (en) | 2015-10-12 | 2019-11-26 | Invensas Corporation | Embedded wire bond wires |
US9490222B1 (en) | 2015-10-12 | 2016-11-08 | Invensas Corporation | Wire bond wires for interference shielding |
US10332854B2 (en) | 2015-10-23 | 2019-06-25 | Invensas Corporation | Anchoring structure of fine pitch bva |
US10181457B2 (en) | 2015-10-26 | 2019-01-15 | Invensas Corporation | Microelectronic package for wafer-level chip scale packaging with fan-out |
US10043779B2 (en) | 2015-11-17 | 2018-08-07 | Invensas Corporation | Packaged microelectronic device for a package-on-package device |
DE102015224422A1 (de) * | 2015-12-07 | 2017-06-08 | Robert Bosch Gmbh | Elektronische Schaltungseinheit |
US9984992B2 (en) | 2015-12-30 | 2018-05-29 | Invensas Corporation | Embedded wire bond wires for vertical integration with separate surface mount and wire bond mounting surfaces |
US9935075B2 (en) | 2016-07-29 | 2018-04-03 | Invensas Corporation | Wire bonding method and apparatus for electromagnetic interference shielding |
US10299368B2 (en) | 2016-12-21 | 2019-05-21 | Invensas Corporation | Surface integrated waveguides and circuit structures therefor |
WO2019009680A2 (ko) * | 2017-07-07 | 2019-01-10 | 씨제이제일제당(주) | 대두 이외의 원물을 포함하는 가공두부 및 이의 제조방법 |
JP6743802B2 (ja) * | 2017-11-22 | 2020-08-19 | Tdk株式会社 | 半導体装置 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3614546A (en) * | 1970-01-07 | 1971-10-19 | Rca Corp | Shielded semiconductor device |
JPS5245261A (en) * | 1975-10-08 | 1977-04-09 | Hitachi Ltd | Electronic parts |
US4084312A (en) * | 1976-01-07 | 1978-04-18 | Motorola, Inc. | Electrically isolated heat sink lead frame for plastic encapsulated semiconductor assemblies |
US4338621A (en) * | 1980-02-04 | 1982-07-06 | Burroughs Corporation | Hermetic integrated circuit package for high density high power applications |
JPS56133858A (en) * | 1980-03-24 | 1981-10-20 | Omron Tateisi Electronics Co | Lead frame |
DE3106376A1 (de) * | 1981-02-20 | 1982-09-09 | Siemens AG, 1000 Berlin und 8000 München | Halbleiteranordnung mit aus blech ausgeschnittenen anschlussleitern |
US4482781A (en) * | 1982-05-17 | 1984-11-13 | National Semiconductor Corporation | Stabilization of semiconductor device package leads |
JPS5954249A (ja) * | 1982-09-22 | 1984-03-29 | Fujitsu Ltd | 半導体装置 |
US4627678A (en) * | 1983-01-24 | 1986-12-09 | Thomas & Betts Corporation | Electronic package assembly and accessory component therefor |
JPS59181039A (ja) * | 1983-03-30 | 1984-10-15 | Toshiba Corp | 半導体装置 |
-
1985
- 1985-05-24 JP JP60110363A patent/JPS61269345A/ja active Pending
-
1986
- 1986-05-21 KR KR1019860003945A patent/KR930007370B1/ko not_active IP Right Cessation
- 1986-05-22 US US06/865,979 patent/US4725692A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
KR930007370B1 (ko) | 1993-08-09 |
JPS61269345A (ja) | 1986-11-28 |
US4725692A (en) | 1988-02-16 |
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