JPS56133858A - Lead frame - Google Patents

Lead frame

Info

Publication number
JPS56133858A
JPS56133858A JP3706880A JP3706880A JPS56133858A JP S56133858 A JPS56133858 A JP S56133858A JP 3706880 A JP3706880 A JP 3706880A JP 3706880 A JP3706880 A JP 3706880A JP S56133858 A JPS56133858 A JP S56133858A
Authority
JP
Japan
Prior art keywords
lead frame
bridges
electric circuit
circuit connecting
terminal pieces
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3706880A
Other languages
Japanese (ja)
Inventor
Shunichi Agatahama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Omron Corp
Original Assignee
Omron Tateisi Electronics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Tateisi Electronics Co filed Critical Omron Tateisi Electronics Co
Priority to JP3706880A priority Critical patent/JPS56133858A/en
Publication of JPS56133858A publication Critical patent/JPS56133858A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To readily insert the electric circuit connecting portions of terminal pieces of a lead frame into the holes of a printed board by a method wherein in a lead frame where terminal pieces, and the outer frame and the terminal pieces are connected to each other through bridges, after the electric circuit connecting portions have been formed into tapered free ends, the bridges are cut off. CONSTITUTION:In a lead frame B, a plurality of arranged terminal pieces 10 are connected to each other through bridges 11 as well as to an outer frame 12 through bridges 13. The electric circuit connecting portion 14 of each terminal piece 10 is narrow free end having a reinforcing rib in the center, and the end of the electric circuit connecting portion 14 has a tapered shape composed of a circular arc and an oblique angle. Such a lead frame B is punched out, inserted into a molding die to provide a resin molded frame 15, and the bridges 11 and 13 are cut off as shown by broken lines. Thereby, the ends of the connecting portions 14 can be readily inserted into the holes of a printed board, and the strength of the lead frame can be intensified.
JP3706880A 1980-03-24 1980-03-24 Lead frame Pending JPS56133858A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3706880A JPS56133858A (en) 1980-03-24 1980-03-24 Lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3706880A JPS56133858A (en) 1980-03-24 1980-03-24 Lead frame

Publications (1)

Publication Number Publication Date
JPS56133858A true JPS56133858A (en) 1981-10-20

Family

ID=12487224

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3706880A Pending JPS56133858A (en) 1980-03-24 1980-03-24 Lead frame

Country Status (1)

Country Link
JP (1) JPS56133858A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4725692A (en) * 1985-05-24 1988-02-16 Hitachi, Ltd. Electronic device and lead frame used thereon
JPH0645350U (en) * 1992-11-27 1994-06-14 ローム株式会社 Structure of external lead terminals in packaged electronic components

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4725692A (en) * 1985-05-24 1988-02-16 Hitachi, Ltd. Electronic device and lead frame used thereon
JPH0645350U (en) * 1992-11-27 1994-06-14 ローム株式会社 Structure of external lead terminals in packaged electronic components

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