KR870001757A - 납땜 장치 - Google Patents
납땜 장치Info
- Publication number
- KR870001757A KR870001757A KR1019860004050A KR860004050A KR870001757A KR 870001757 A KR870001757 A KR 870001757A KR 1019860004050 A KR1019860004050 A KR 1019860004050A KR 860004050 A KR860004050 A KR 860004050A KR 870001757 A KR870001757 A KR 870001757A
- Authority
- KR
- South Korea
- Prior art keywords
- soldering device
- soldering
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/012—Soldering with the use of hot gas
- B23K1/015—Vapour-condensation soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/08—Soldering by means of dipping in molten solder
- B23K1/085—Wave soldering
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60162021A JPS6224859A (ja) | 1985-07-24 | 1985-07-24 | はんだ付け装置 |
JP85-162021 | 1985-07-24 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR870001757A true KR870001757A (ko) | 1987-03-17 |
KR900000924B1 KR900000924B1 (ko) | 1990-02-19 |
Family
ID=15746554
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019860004050A KR900000924B1 (ko) | 1985-07-24 | 1986-05-23 | 납땜 장치 |
Country Status (6)
Country | Link |
---|---|
US (1) | US4726506A (ko) |
EP (1) | EP0211563B1 (ko) |
JP (1) | JPS6224859A (ko) |
KR (1) | KR900000924B1 (ko) |
CN (1) | CN1005443B (ko) |
DE (1) | DE3674671D1 (ko) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4632291A (en) * | 1983-02-28 | 1986-12-30 | Electrovert Ltd. | Automatic wave soldering machine |
ATE170359T1 (de) * | 1988-03-02 | 1998-09-15 | Siemens Nixdorf Inf Syst | Umschmelzprozess für leiterplatten |
DE8910105U1 (de) * | 1989-08-23 | 1990-12-20 | Grote & Hartmann Gmbh & Co Kg, 5600 Wuppertal | Kontaktelement für eine Leiterplatte |
US5044542A (en) * | 1989-11-22 | 1991-09-03 | Electrovert Ltd. | Shield gas wave soldering |
US5048746A (en) * | 1989-12-08 | 1991-09-17 | Electrovert Ltd. | Tunnel for fluxless soldering |
US5090651A (en) * | 1990-01-31 | 1992-02-25 | Electrovert Ltd. | Gas curtain additives and zoned tunnel for soldering |
FR2670986B1 (fr) * | 1990-12-20 | 1996-08-02 | Air Liquide | Dispositif d'inertage de bain de soudure d'une machine de soudage a la vague. |
US5176307A (en) * | 1991-02-22 | 1993-01-05 | Praxair Technology, Inc. | Wave soldering in a protective atmosphere enclosure over a solder pot |
DE4338225A1 (de) * | 1993-11-09 | 1995-05-11 | Linde Ag | Verfahren zum Wellenlöten mit bleifreien Lotmaterialien |
DE19519188C2 (de) * | 1995-05-24 | 2001-06-28 | Fraunhofer Ges Forschung | Verfahren und Vorrichtung zum Wellen- und/oder Dampfphasenlöten elektronischer Baugruppen |
US6780225B2 (en) * | 2002-05-24 | 2004-08-24 | Vitronics Soltec, Inc. | Reflow oven gas management system and method |
US6923007B1 (en) * | 2003-10-16 | 2005-08-02 | Daniel D. Holt | System and method of pumping liquified gas |
DE102004019635B4 (de) * | 2004-04-22 | 2007-12-27 | Rehm Anlagenbau Gmbh | Dampfbetriebene Lötanlage und Dampferzeugungssystem für eine Lötanlage |
JP4375491B1 (ja) * | 2008-06-23 | 2009-12-02 | 日本ジョイント株式会社 | 電子部品のはんだ付け装置およびはんだ付け方法 |
US20100308103A1 (en) * | 2009-06-08 | 2010-12-09 | Tyco Electronics Corporation | System and method for vapor phase reflow of a conductive coating |
US8104662B2 (en) * | 2009-07-24 | 2012-01-31 | Flextronics Ap Llc | Inert environment enclosure |
ITMI20112084A1 (it) * | 2011-11-17 | 2013-05-18 | St Microelectronics Srl | Saldatura ad onda su scheda a circuito stampato di dispositivi elettronici a montaggio superficiale |
JP6799814B2 (ja) * | 2018-04-16 | 2020-12-16 | パナソニックIpマネジメント株式会社 | 気相式加熱方法及び気相式加熱装置 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3291030A (en) * | 1964-12-14 | 1966-12-13 | Dewey Shepard Boiler Co Inc | Apparatus for steaming food products |
US3754698A (en) * | 1970-10-29 | 1973-08-28 | North American Rockwell | Hot gas fusion apparatus |
US3904102A (en) * | 1974-06-05 | 1975-09-09 | Western Electric Co | Apparatus and method for soldering, fusing or brazing |
US3866307A (en) * | 1973-09-07 | 1975-02-18 | Western Electric Co | Method for soldering, fusing or brazing |
JPS5340934A (en) * | 1976-09-21 | 1978-04-13 | Jirou Imazu | Doubleeroof structure for vehicle |
US4115601A (en) * | 1977-07-01 | 1978-09-19 | Bell Telephone Laboratories, Incorporated | Flexible circuit reflow soldering process and machine |
US4162034A (en) * | 1978-05-03 | 1979-07-24 | Western Electric Company, Incorporated | Ejector controlled soldering device |
US4315042A (en) * | 1978-07-14 | 1982-02-09 | Hybrid Technology Corporation | Solder removal technique |
US4410126A (en) * | 1978-10-12 | 1983-10-18 | Cooper Industries, Inc. | Mass soldering system |
GB2058335B (en) * | 1979-05-18 | 1983-09-01 | Atomic Energy Authority Uk | Soldering apparatus |
JPS6051939B2 (ja) * | 1981-06-02 | 1985-11-16 | 権士 近藤 | 噴流式はんだ槽 |
US4463891A (en) * | 1981-11-18 | 1984-08-07 | Rca Corporation | Wave soldering apparatus and method |
US4538757A (en) * | 1983-08-01 | 1985-09-03 | Motorola, Inc. | Wave soldering in a reducing atmosphere |
US4530458A (en) * | 1983-12-16 | 1985-07-23 | Nihon Den-Netsu Keiki Co., Ltd | Soldering apparatus |
-
1985
- 1985-07-24 JP JP60162021A patent/JPS6224859A/ja active Pending
-
1986
- 1986-05-23 KR KR1019860004050A patent/KR900000924B1/ko not_active IP Right Cessation
- 1986-07-17 US US06/886,378 patent/US4726506A/en not_active Expired - Lifetime
- 1986-07-23 DE DE8686305646T patent/DE3674671D1/de not_active Expired - Fee Related
- 1986-07-23 EP EP86305646A patent/EP0211563B1/en not_active Expired - Lifetime
- 1986-07-24 CN CN86105705A patent/CN1005443B/zh not_active Expired
Also Published As
Publication number | Publication date |
---|---|
US4726506A (en) | 1988-02-23 |
JPS6224859A (ja) | 1987-02-02 |
EP0211563B1 (en) | 1990-10-03 |
CN86105705A (zh) | 1987-05-13 |
EP0211563A1 (en) | 1987-02-25 |
KR900000924B1 (ko) | 1990-02-19 |
CN1005443B (zh) | 1989-10-11 |
DE3674671D1 (de) | 1990-11-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
G160 | Decision to publish patent application | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20051012 Year of fee payment: 17 |
|
EXPY | Expiration of term |