KR870001757A - 납땜 장치 - Google Patents

납땜 장치

Info

Publication number
KR870001757A
KR870001757A KR1019860004050A KR860004050A KR870001757A KR 870001757 A KR870001757 A KR 870001757A KR 1019860004050 A KR1019860004050 A KR 1019860004050A KR 860004050 A KR860004050 A KR 860004050A KR 870001757 A KR870001757 A KR 870001757A
Authority
KR
South Korea
Prior art keywords
soldering device
soldering
Prior art date
Application number
KR1019860004050A
Other languages
English (en)
Other versions
KR900000924B1 (ko
Inventor
겐시 곤도오
Original Assignee
니혼 덴네쯔 게이시 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 니혼 덴네쯔 게이시 가부시끼가이샤 filed Critical 니혼 덴네쯔 게이시 가부시끼가이샤
Publication of KR870001757A publication Critical patent/KR870001757A/ko
Application granted granted Critical
Publication of KR900000924B1 publication Critical patent/KR900000924B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/012—Soldering with the use of hot gas
    • B23K1/015—Vapour-condensation soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B23K1/085—Wave soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
KR1019860004050A 1985-07-24 1986-05-23 납땜 장치 KR900000924B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP60162021A JPS6224859A (ja) 1985-07-24 1985-07-24 はんだ付け装置
JP85-162021 1985-07-24

Publications (2)

Publication Number Publication Date
KR870001757A true KR870001757A (ko) 1987-03-17
KR900000924B1 KR900000924B1 (ko) 1990-02-19

Family

ID=15746554

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019860004050A KR900000924B1 (ko) 1985-07-24 1986-05-23 납땜 장치

Country Status (6)

Country Link
US (1) US4726506A (ko)
EP (1) EP0211563B1 (ko)
JP (1) JPS6224859A (ko)
KR (1) KR900000924B1 (ko)
CN (1) CN1005443B (ko)
DE (1) DE3674671D1 (ko)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4632291A (en) * 1983-02-28 1986-12-30 Electrovert Ltd. Automatic wave soldering machine
ATE170359T1 (de) * 1988-03-02 1998-09-15 Siemens Nixdorf Inf Syst Umschmelzprozess für leiterplatten
DE8910105U1 (de) * 1989-08-23 1990-12-20 Grote & Hartmann Gmbh & Co Kg, 5600 Wuppertal Kontaktelement für eine Leiterplatte
US5044542A (en) * 1989-11-22 1991-09-03 Electrovert Ltd. Shield gas wave soldering
US5048746A (en) * 1989-12-08 1991-09-17 Electrovert Ltd. Tunnel for fluxless soldering
US5090651A (en) * 1990-01-31 1992-02-25 Electrovert Ltd. Gas curtain additives and zoned tunnel for soldering
FR2670986B1 (fr) * 1990-12-20 1996-08-02 Air Liquide Dispositif d'inertage de bain de soudure d'une machine de soudage a la vague.
US5176307A (en) * 1991-02-22 1993-01-05 Praxair Technology, Inc. Wave soldering in a protective atmosphere enclosure over a solder pot
DE4338225A1 (de) * 1993-11-09 1995-05-11 Linde Ag Verfahren zum Wellenlöten mit bleifreien Lotmaterialien
DE19519188C2 (de) * 1995-05-24 2001-06-28 Fraunhofer Ges Forschung Verfahren und Vorrichtung zum Wellen- und/oder Dampfphasenlöten elektronischer Baugruppen
US6780225B2 (en) * 2002-05-24 2004-08-24 Vitronics Soltec, Inc. Reflow oven gas management system and method
US6923007B1 (en) * 2003-10-16 2005-08-02 Daniel D. Holt System and method of pumping liquified gas
DE102004019635B4 (de) * 2004-04-22 2007-12-27 Rehm Anlagenbau Gmbh Dampfbetriebene Lötanlage und Dampferzeugungssystem für eine Lötanlage
JP4375491B1 (ja) * 2008-06-23 2009-12-02 日本ジョイント株式会社 電子部品のはんだ付け装置およびはんだ付け方法
US20100308103A1 (en) * 2009-06-08 2010-12-09 Tyco Electronics Corporation System and method for vapor phase reflow of a conductive coating
US8104662B2 (en) * 2009-07-24 2012-01-31 Flextronics Ap Llc Inert environment enclosure
ITMI20112084A1 (it) * 2011-11-17 2013-05-18 St Microelectronics Srl Saldatura ad onda su scheda a circuito stampato di dispositivi elettronici a montaggio superficiale
JP6799814B2 (ja) * 2018-04-16 2020-12-16 パナソニックＩｐマネジメント株式会社 気相式加熱方法及び気相式加熱装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3291030A (en) * 1964-12-14 1966-12-13 Dewey Shepard Boiler Co Inc Apparatus for steaming food products
US3754698A (en) * 1970-10-29 1973-08-28 North American Rockwell Hot gas fusion apparatus
US3904102A (en) * 1974-06-05 1975-09-09 Western Electric Co Apparatus and method for soldering, fusing or brazing
US3866307A (en) * 1973-09-07 1975-02-18 Western Electric Co Method for soldering, fusing or brazing
JPS5340934A (en) * 1976-09-21 1978-04-13 Jirou Imazu Doubleeroof structure for vehicle
US4115601A (en) * 1977-07-01 1978-09-19 Bell Telephone Laboratories, Incorporated Flexible circuit reflow soldering process and machine
US4162034A (en) * 1978-05-03 1979-07-24 Western Electric Company, Incorporated Ejector controlled soldering device
US4315042A (en) * 1978-07-14 1982-02-09 Hybrid Technology Corporation Solder removal technique
US4410126A (en) * 1978-10-12 1983-10-18 Cooper Industries, Inc. Mass soldering system
GB2058335B (en) * 1979-05-18 1983-09-01 Atomic Energy Authority Uk Soldering apparatus
JPS6051939B2 (ja) * 1981-06-02 1985-11-16 権士 近藤 噴流式はんだ槽
US4463891A (en) * 1981-11-18 1984-08-07 Rca Corporation Wave soldering apparatus and method
US4538757A (en) * 1983-08-01 1985-09-03 Motorola, Inc. Wave soldering in a reducing atmosphere
US4530458A (en) * 1983-12-16 1985-07-23 Nihon Den-Netsu Keiki Co., Ltd Soldering apparatus

Also Published As

Publication number Publication date
US4726506A (en) 1988-02-23
JPS6224859A (ja) 1987-02-02
EP0211563B1 (en) 1990-10-03
CN86105705A (zh) 1987-05-13
EP0211563A1 (en) 1987-02-25
KR900000924B1 (ko) 1990-02-19
CN1005443B (zh) 1989-10-11
DE3674671D1 (de) 1990-11-08

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Legal Events

Date Code Title Description
A201 Request for examination
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20051012

Year of fee payment: 17

EXPY Expiration of term