KR850007574A - Pcb의 금속 적층 기본 물질의 제조방법 - Google Patents

Pcb의 금속 적층 기본 물질의 제조방법 Download PDF

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KR850007574A
KR850007574A KR1019850002342A KR850002342A KR850007574A KR 850007574 A KR850007574 A KR 850007574A KR 1019850002342 A KR1019850002342 A KR 1019850002342A KR 850002342 A KR850002342 A KR 850002342A KR 850007574 A KR850007574 A KR 850007574A
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Prior art keywords
sheet
metal foil
base material
laminated
compressor
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KR1019850002342A
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KR900003809B1 (ko
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로타르 슈바르쯔 (외 3)
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토마스 뤼데
프레지던트 엔지니어링 코포레이션
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/04—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising reinforcements only, e.g. self-reinforcing plastics
    • B29C70/06—Fibrous reinforcements only
    • B29C70/08—Fibrous reinforcements only comprising combinations of different forms of fibrous reinforcements incorporated in matrix material, forming one or more layers, and with or without non-reinforced layers
    • B29C70/088—Fibrous reinforcements only comprising combinations of different forms of fibrous reinforcements incorporated in matrix material, forming one or more layers, and with or without non-reinforced layers and with one or more layers of non-plastics material or non-specified material, e.g. supports
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/04—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising reinforcements only, e.g. self-reinforcing plastics
    • B29C70/28—Shaping operations therefor
    • B29C70/40—Shaping or impregnating by compression not applied
    • B29C70/50—Shaping or impregnating by compression not applied for producing articles of indefinite length, e.g. prepregs, sheet moulding compounds [SMC] or cross moulding compounds [XMC]
    • B29C70/504—Shaping or impregnating by compression not applied for producing articles of indefinite length, e.g. prepregs, sheet moulding compounds [SMC] or cross moulding compounds [XMC] using rollers or pressure bands
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/06—Platens or press rams
    • B30B15/062—Press plates
    • B30B15/064—Press plates with heating or cooling means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B5/00—Presses characterised by the use of pressing means other than those mentioned in the preceding groups
    • B30B5/04—Presses characterised by the use of pressing means other than those mentioned in the preceding groups wherein the pressing means is in the form of an endless band
    • B30B5/06—Presses characterised by the use of pressing means other than those mentioned in the preceding groups wherein the pressing means is in the form of an endless band co-operating with another endless band
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B32B37/1027—Pressing using at least one press band
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3425—Printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/101—Glass fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Moulding By Coating Moulds (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

내용 없음

Description

PCB의 금속 적층 기본 물질의 제조방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
도면은 본 발명에 따른 장치의 개략도이다.
* 도면의 주요 부분에 대한 부호의 설명
1 : 이중벨트 압축기, 2 : 압력효과 영역, 3 : 예일영역, 4 : 가열영역, 5 :냉각영역, 6, 6′- 인입디플렉팅 실린더(deflecting cylinder), 7, 7′: 인출 디플렉팅 실린더, 8, 8′: 압력벨트, 9, 9′: 가열차단판, 11 : 지지롤러(roller), 22, 22′: 유도 롤러, 23 : 가장자리 마무리 장치, 24 : 길이 절단장치.

Claims (19)

  1. 열경화 수지와 그곳에 적층되어 질 금속박으로된 적층된 물질 시트의 압축기 장치에서, 가속화 수지계로 포화되어 선경화된 유리섬유직물 시트가 이중 벨트 압축기의 압축효과 영역으로 들어가기 전에 수지계의 점도를 낮게하여 예열처리되고, 그 다음에 상승된 온도에서 금속박과 함께 압축되어 얻어진 기본 물질 시트가 정격길이로 절단되는 것을 특징으로 하는 PCB의 금속적층 기본 물질 제조방법.
  2. 제1항에 있어서, 150℃에서 210℃로 상승하는 온도와 압력 25바아-80바아 상태하에서 압력이 가해지는 것을 특징으로 하는 방법.
  3. 제1항 및 제2항에 있어서, 기본 물질의 시트가 이중 벨트 압축기안에 바람직하게 정렬된 냉각영역속에서 가압상태에서 냉각되어지는 것을 특징으로 하는 방법.
  4. 제1항에서 제3항중 어느 한 항에 있어서, 기본 물질이 2차 열처리를 하는 것을 특징으로 하는 방법.
  5. 제1항에서 제4항중 어느 한 항에 있어서, 한면에 금속박으로 적층된 기본 물질의 생산에 있어서, 분리박이 금속박이 없는 면으로 들어와 압축된 다음, 이중 벨트 압축기에서 나온 후 기본 물질의 시트에서 제거되는 것을 특징으로 하는 방법.
  6. 제1항에서 제5항중 어느 한항에 있어서, 적층된 물질의 시트와 금속박이 분리되어 예열되는 것을 특징으로 하는 방법.
  7. 제6항에 있어서, 금속박이 적층된 물질읠 시트보다 더 고온에서 예열처리되는 것을 특징으로 하는 방법.
  8. 제1항에서 제7항중 어느 한항에 있어서, 적층물질의 시트가 단지 금속박과 압축기 장치의 압력효과 영역앞에서, 결합되는 것을 특징으로 하는 방법.
  9. 제1항에서 제9항중 어느 한항에 있어서, 가속화 에폭시 수지, 경화제 및 촉매계로 포화되어 선경화된 유리섬유 직물 조직이 사용된 것을 특징으로 하는 방법.
  10. 제1항에서 제9항중 어느 한2항에 있어서, 가속제로써 치환된 피리딘 화합물, 이미다졸, 치환된 이미다졸, 디시아노디아미드와 벤질 디메틸아민 중 하나 또는 그 이상의 화합물을 포함하는 것을 특징으로 하는 방법.
  11. 제10항에 있어서, 고체 에폭시 수지에 관하여 가속제 또는 가속제 혼합물이 0.2%-0.8%의 중량퍼센트를 포함하는 것을 특징으로 하는 방법.
  12. 제1항에서 제9항중 어느 한 항에 있어서, 압력효과 가열영역(4)를 포함하는 가열할 수 있는 이중벨트 압축기(1)의 앞 부분에 압력효과가 없는 예열 영역(3)임 있는 것을 특징으로 하는 방법.
  13. 제12항에 있어서, 이중 벨트압축기(1)에 있는 예열영역(3)이 냉각을 조절 할 수 있는 한쌍의 가열판(9),(9′)을 가지고 있는 것을 특징으로 하는 방법.
  14. 제13항에 있어서, 가열판(9),(9′)가 수평 방향으로 치환가능 하도록 정렬되어 있는 것을 특징으로 하는 방법.
  15. 제12항에서 제14항중 어느 한 항에 있어서, 한쌍의 인입실린더(6),(6′)사이의 거리가 한쌍의 인출실린더(7),(7′)사이보다 긴것을 특징으로 하는 방법.
  16. 제12항에서 제15항중 어느 한항에 있어서, 압력효과 가열영역(4)다음에 이와 유사한 압력효과 냉각영역(5)이 있는 것을 특징으로 하는 방법.
  17. 제12항에서 제16항중 어느 한 항에 있엇, 가열 영역(4)이 독립적으로 조절할 수 있는 온도영역(41),(42),(43)으로 구분되는 것을 특징으로 하는 방법.
  18. 제1항에서 제17항중 어느 한 항에 있어서, 예열 영역(3)속에 적층물질 시트와 금속박의 분리유도장치가 있는 것을 특징으로 하는 방법.
  19. ※ 참고사항 : 최초출원내용에 의하여 공개하는 것임.
KR1019850002342A 1984-04-10 1985-04-08 인쇄회로기판(pcb)용의 금속적층기재 제조방법 및 이를 수행하기 위한 이중벨트 프레스 KR900003809B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DEP3413434.4 1984-04-10
DE19843413434 DE3413434A1 (de) 1984-04-10 1984-04-10 Verfahren zum kontinuierlichen herstellen von kupferkaschiertem basismaterial fuer leiterplatten
EP85101282A EP0158027B2 (de) 1984-04-10 1985-02-07 Verfahren zum Herstellen von kupferkaschiertem Basismaterial für Leiterplatten
EP85101282.3 1985-02-07

Publications (2)

Publication Number Publication Date
KR850007574A true KR850007574A (ko) 1985-12-07
KR900003809B1 KR900003809B1 (ko) 1990-05-31

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ID=6233144

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Application Number Title Priority Date Filing Date
KR1019850002342A KR900003809B1 (ko) 1984-04-10 1985-04-08 인쇄회로기판(pcb)용의 금속적층기재 제조방법 및 이를 수행하기 위한 이중벨트 프레스

Country Status (12)

Country Link
US (1) US4670080A (ko)
EP (1) EP0158027B2 (ko)
JP (1) JPS6110456A (ko)
KR (1) KR900003809B1 (ko)
CA (1) CA1264278A (ko)
DD (1) DD235151A5 (ko)
DE (2) DE3413434A1 (ko)
IE (1) IE56592B1 (ko)
IN (1) IN164171B (ko)
MY (1) MY100774A (ko)
SU (1) SU1579471A3 (ko)
ZA (1) ZA852575B (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230076329A (ko) * 2021-11-24 2023-05-31 동아대학교 산학협력단 고연신율 금속박 제조방법 및 고연신율 금속박

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DE3578149D1 (de) 1990-07-19
US4670080A (en) 1987-06-02
JPH0227143B2 (ko) 1990-06-14
IE56592B1 (en) 1991-10-09
IE850854L (en) 1985-10-10
CA1264278A (en) 1990-01-09
EP0158027A2 (de) 1985-10-16
EP0158027B2 (de) 1997-05-02
ZA852575B (en) 1985-11-27
DD235151A5 (de) 1986-04-23
EP0158027B1 (de) 1990-06-13
IN164171B (ko) 1989-01-28
EP0158027A3 (en) 1986-10-01
MY100774A (en) 1991-02-14
JPS6110456A (ja) 1986-01-17
DE3413434A1 (de) 1985-10-17
DE3413434C2 (ko) 1992-09-17
SU1579471A3 (ru) 1990-07-15
KR900003809B1 (ko) 1990-05-31

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