KR20260033631A - 땜납 범프 형성용 부재, 땜납 범프 형성용 부재의 제조 방법, 및 땜납 범프 부착 전극 기판의 제조 방법 - Google Patents

땜납 범프 형성용 부재, 땜납 범프 형성용 부재의 제조 방법, 및 땜납 범프 부착 전극 기판의 제조 방법

Info

Publication number
KR20260033631A
KR20260033631A KR1020267006404A KR20267006404A KR20260033631A KR 20260033631 A KR20260033631 A KR 20260033631A KR 1020267006404 A KR1020267006404 A KR 1020267006404A KR 20267006404 A KR20267006404 A KR 20267006404A KR 20260033631 A KR20260033631 A KR 20260033631A
Authority
KR
South Korea
Prior art keywords
solder
solder particles
substrate
particles
solder bump
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020267006404A
Other languages
English (en)
Korean (ko)
Inventor
준이치 가케하타
구니히코 아카이
마사유키 미야지
요시노리 에지리
Original Assignee
가부시끼가이샤 레조낙
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시끼가이샤 레조낙 filed Critical 가부시끼가이샤 레조낙
Publication of KR20260033631A publication Critical patent/KR20260033631A/ko
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/011—Apparatus therefor
    • H10W72/0112—Apparatus for manufacturing bump connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01271—Cleaning, e.g. oxide removal or de-smearing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/016—Manufacture or treatment of strap connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07232—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
KR1020267006404A 2019-12-27 2020-12-15 땜납 범프 형성용 부재, 땜납 범프 형성용 부재의 제조 방법, 및 땜납 범프 부착 전극 기판의 제조 방법 Pending KR20260033631A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2019238428 2019-12-27
JPJP-P-2019-238428 2019-12-27
PCT/JP2020/046731 WO2021131897A1 (ja) 2019-12-27 2020-12-15 はんだバンプ形成用部材、はんだバンプ形成用部材の製造方法、及びはんだバンプ付き電極基板の製造方法
KR1020227023758A KR102934703B1 (ko) 2019-12-27 2020-12-15 땜납 범프 형성용 부재, 땜납 범프 형성용 부재의 제조 방법, 및 땜납 범프 부착 전극 기판의 제조 방법

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020227023758A Division KR102934703B1 (ko) 2019-12-27 2020-12-15 땜납 범프 형성용 부재, 땜납 범프 형성용 부재의 제조 방법, 및 땜납 범프 부착 전극 기판의 제조 방법

Publications (1)

Publication Number Publication Date
KR20260033631A true KR20260033631A (ko) 2026-03-10

Family

ID=76576058

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020267006404A Pending KR20260033631A (ko) 2019-12-27 2020-12-15 땜납 범프 형성용 부재, 땜납 범프 형성용 부재의 제조 방법, 및 땜납 범프 부착 전극 기판의 제조 방법
KR1020227023758A Active KR102934703B1 (ko) 2019-12-27 2020-12-15 땜납 범프 형성용 부재, 땜납 범프 형성용 부재의 제조 방법, 및 땜납 범프 부착 전극 기판의 제조 방법

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020227023758A Active KR102934703B1 (ko) 2019-12-27 2020-12-15 땜납 범프 형성용 부재, 땜납 범프 형성용 부재의 제조 방법, 및 땜납 범프 부착 전극 기판의 제조 방법

Country Status (4)

Country Link
JP (2) JP7661891B2 (https=)
KR (2) KR20260033631A (https=)
CN (1) CN115152007A (https=)
WO (1) WO2021131897A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20260033631A (ko) * 2019-12-27 2026-03-10 가부시끼가이샤 레조낙 땜납 범프 형성용 부재, 땜납 범프 형성용 부재의 제조 방법, 및 땜납 범프 부착 전극 기판의 제조 방법
US12318870B2 (en) * 2022-12-22 2025-06-03 Samsung Electronics Co., Ltd. Ball attachment apparatus

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4896817A (en) * 1988-10-17 1990-01-30 International Business Machines Corp. Flux composition and method of decreasing tin content in lead/tin solder joints
AT392231B (de) * 1989-03-22 1991-02-25 Alcatel Austria Ag Flussmittel zum loeten von verzinnten leiterplatten
JP3207506B2 (ja) * 1991-08-28 2001-09-10 株式会社日立製作所 電子回路装置の製造方法
JP2917595B2 (ja) * 1991-07-19 1999-07-12 松下電器産業株式会社 金属ボールの形成方法
US6528346B2 (en) * 1994-01-20 2003-03-04 Fujitsu Limited Bump-forming method using two plates and electronic device
JPH07249631A (ja) * 1994-01-20 1995-09-26 Fujitsu Ltd はんだバンプ及びはんだボールの製造方法及び半導体装置の製造方法
JP3124224B2 (ja) * 1996-04-01 2001-01-15 富士通株式会社 はんだバンプ形成方法
JP3315871B2 (ja) * 1996-09-03 2002-08-19 日本特殊陶業株式会社 半田バンプを有する配線基板及びその製造方法
JP4087876B2 (ja) * 1998-08-10 2008-05-21 富士通株式会社 ハンダバンプの形成方法
JP2004080024A (ja) 2002-08-02 2004-03-11 Senju Metal Ind Co Ltd はんだボール配置シート、その製造方法およびはんだバンプ形成方法
JPWO2006043377A1 (ja) * 2004-10-19 2008-05-22 千住金属工業株式会社 はんだバンプ形成用シートとその製造方法
JP2009283734A (ja) * 2008-05-23 2009-12-03 Alps Electric Co Ltd フラックス転写方法及びフラックス転写装置
JP5118574B2 (ja) * 2008-08-07 2013-01-16 三井金属鉱業株式会社 はんだ粉及びはんだペースト
TWI462676B (zh) * 2009-02-13 2014-11-21 千住金屬工業股份有限公司 The solder bumps for the circuit substrate are formed using the transfer sheet
JP5238598B2 (ja) * 2009-04-30 2013-07-17 昭和電工株式会社 回路基板の製造方法
KR101376888B1 (ko) * 2012-10-11 2014-03-20 삼성전기주식회사 회로기판의 솔더 볼 범핑을 위한 마스크 및 그를 이용한 솔더 볼 범핑 방법
TWI774640B (zh) * 2015-01-13 2022-08-21 日商迪睿合股份有限公司 凸塊形成用膜、半導體裝置及其製造方法、以及連接構造體
JP2017157626A (ja) 2016-02-29 2017-09-07 三菱マテリアル株式会社 はんだバンプの形成方法
JP2019029135A (ja) * 2017-07-27 2019-02-21 日立化成株式会社 異方性導電フィルム及びその製造方法、並びに接続構造体及びその製造方法
JP2019169371A (ja) * 2018-03-23 2019-10-03 株式会社タムラ製作所 導電性組成物および電子基板の製造方法
KR20260033631A (ko) * 2019-12-27 2026-03-10 가부시끼가이샤 레조낙 땜납 범프 형성용 부재, 땜납 범프 형성용 부재의 제조 방법, 및 땜납 범프 부착 전극 기판의 제조 방법

Also Published As

Publication number Publication date
JPWO2021131897A1 (https=) 2021-07-01
KR20220122663A (ko) 2022-09-02
WO2021131897A1 (ja) 2021-07-01
JP2025092693A (ja) 2025-06-19
KR102934703B1 (ko) 2026-03-06
JP7661891B2 (ja) 2025-04-15
CN115152007A (zh) 2022-10-04

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Free format text: ST27 STATUS EVENT CODE: A-0-1-A10-A16-DIV-PA0104 (AS PROVIDED BY THE NATIONAL OFFICE)

PA0104 Divisional application for international application

St.27 status event code: A-0-1-A10-A16-div-PA0104

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

Q12 Application published

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