JP7661891B2 - はんだバンプ形成用部材、はんだバンプ形成用部材の製造方法、及びはんだバンプ付き電極基板の製造方法 - Google Patents

はんだバンプ形成用部材、はんだバンプ形成用部材の製造方法、及びはんだバンプ付き電極基板の製造方法 Download PDF

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Publication number
JP7661891B2
JP7661891B2 JP2021567299A JP2021567299A JP7661891B2 JP 7661891 B2 JP7661891 B2 JP 7661891B2 JP 2021567299 A JP2021567299 A JP 2021567299A JP 2021567299 A JP2021567299 A JP 2021567299A JP 7661891 B2 JP7661891 B2 JP 7661891B2
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JP
Japan
Prior art keywords
solder
solder particles
substrate
particles
bumps
Prior art date
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Active
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JP2021567299A
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English (en)
Japanese (ja)
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JPWO2021131897A1 (https=
Inventor
純一 欠畑
邦彦 赤井
勝将 宮地
芳則 江尻
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd, Resonac Corp filed Critical Hitachi Chemical Co Ltd
Publication of JPWO2021131897A1 publication Critical patent/JPWO2021131897A1/ja
Priority to JP2025060972A priority Critical patent/JP2025092693A/ja
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Publication of JP7661891B2 publication Critical patent/JP7661891B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/011—Apparatus therefor
    • H10W72/0112—Apparatus for manufacturing bump connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01271—Cleaning, e.g. oxide removal or de-smearing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/016—Manufacture or treatment of strap connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07232—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2021567299A 2019-12-27 2020-12-15 はんだバンプ形成用部材、はんだバンプ形成用部材の製造方法、及びはんだバンプ付き電極基板の製造方法 Active JP7661891B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025060972A JP2025092693A (ja) 2019-12-27 2025-04-02 はんだバンプ形成用部材、はんだバンプ形成用部材の製造方法、及びはんだバンプ付き電極基板の製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019238428 2019-12-27
JP2019238428 2019-12-27
PCT/JP2020/046731 WO2021131897A1 (ja) 2019-12-27 2020-12-15 はんだバンプ形成用部材、はんだバンプ形成用部材の製造方法、及びはんだバンプ付き電極基板の製造方法

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JP2025060972A Division JP2025092693A (ja) 2019-12-27 2025-04-02 はんだバンプ形成用部材、はんだバンプ形成用部材の製造方法、及びはんだバンプ付き電極基板の製造方法

Publications (2)

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JPWO2021131897A1 JPWO2021131897A1 (https=) 2021-07-01
JP7661891B2 true JP7661891B2 (ja) 2025-04-15

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JP2021567299A Active JP7661891B2 (ja) 2019-12-27 2020-12-15 はんだバンプ形成用部材、はんだバンプ形成用部材の製造方法、及びはんだバンプ付き電極基板の製造方法
JP2025060972A Withdrawn JP2025092693A (ja) 2019-12-27 2025-04-02 はんだバンプ形成用部材、はんだバンプ形成用部材の製造方法、及びはんだバンプ付き電極基板の製造方法

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Country Status (4)

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JP (2) JP7661891B2 (https=)
KR (2) KR20260033631A (https=)
CN (1) CN115152007A (https=)
WO (1) WO2021131897A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025092693A (ja) * 2019-12-27 2025-06-19 株式会社レゾナック はんだバンプ形成用部材、はんだバンプ形成用部材の製造方法、及びはんだバンプ付き電極基板の製造方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12318870B2 (en) * 2022-12-22 2025-06-03 Samsung Electronics Co., Ltd. Ball attachment apparatus

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006043377A1 (ja) 2004-10-19 2006-04-27 Senju Metal Industry Co., Ltd. はんだバンプ形成用シートとその製造方法
JP2010036234A (ja) 2008-08-07 2010-02-18 Mitsui Mining & Smelting Co Ltd はんだ粉及びはんだペースト
WO2010125753A1 (ja) 2009-04-30 2010-11-04 昭和電工株式会社 回路基板の製造方法

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US4896817A (en) * 1988-10-17 1990-01-30 International Business Machines Corp. Flux composition and method of decreasing tin content in lead/tin solder joints
AT392231B (de) * 1989-03-22 1991-02-25 Alcatel Austria Ag Flussmittel zum loeten von verzinnten leiterplatten
JP3207506B2 (ja) * 1991-08-28 2001-09-10 株式会社日立製作所 電子回路装置の製造方法
JP2917595B2 (ja) * 1991-07-19 1999-07-12 松下電器産業株式会社 金属ボールの形成方法
US6528346B2 (en) * 1994-01-20 2003-03-04 Fujitsu Limited Bump-forming method using two plates and electronic device
JPH07249631A (ja) * 1994-01-20 1995-09-26 Fujitsu Ltd はんだバンプ及びはんだボールの製造方法及び半導体装置の製造方法
JP3124224B2 (ja) * 1996-04-01 2001-01-15 富士通株式会社 はんだバンプ形成方法
JP3315871B2 (ja) * 1996-09-03 2002-08-19 日本特殊陶業株式会社 半田バンプを有する配線基板及びその製造方法
JP4087876B2 (ja) * 1998-08-10 2008-05-21 富士通株式会社 ハンダバンプの形成方法
JP2004080024A (ja) 2002-08-02 2004-03-11 Senju Metal Ind Co Ltd はんだボール配置シート、その製造方法およびはんだバンプ形成方法
JP2009283734A (ja) * 2008-05-23 2009-12-03 Alps Electric Co Ltd フラックス転写方法及びフラックス転写装置
TWI462676B (zh) * 2009-02-13 2014-11-21 千住金屬工業股份有限公司 The solder bumps for the circuit substrate are formed using the transfer sheet
KR101376888B1 (ko) * 2012-10-11 2014-03-20 삼성전기주식회사 회로기판의 솔더 볼 범핑을 위한 마스크 및 그를 이용한 솔더 볼 범핑 방법
TWI774640B (zh) * 2015-01-13 2022-08-21 日商迪睿合股份有限公司 凸塊形成用膜、半導體裝置及其製造方法、以及連接構造體
JP2017157626A (ja) 2016-02-29 2017-09-07 三菱マテリアル株式会社 はんだバンプの形成方法
JP2019029135A (ja) * 2017-07-27 2019-02-21 日立化成株式会社 異方性導電フィルム及びその製造方法、並びに接続構造体及びその製造方法
JP2019169371A (ja) * 2018-03-23 2019-10-03 株式会社タムラ製作所 導電性組成物および電子基板の製造方法
KR20260033631A (ko) * 2019-12-27 2026-03-10 가부시끼가이샤 레조낙 땜납 범프 형성용 부재, 땜납 범프 형성용 부재의 제조 방법, 및 땜납 범프 부착 전극 기판의 제조 방법

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006043377A1 (ja) 2004-10-19 2006-04-27 Senju Metal Industry Co., Ltd. はんだバンプ形成用シートとその製造方法
JP2010036234A (ja) 2008-08-07 2010-02-18 Mitsui Mining & Smelting Co Ltd はんだ粉及びはんだペースト
WO2010125753A1 (ja) 2009-04-30 2010-11-04 昭和電工株式会社 回路基板の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025092693A (ja) * 2019-12-27 2025-06-19 株式会社レゾナック はんだバンプ形成用部材、はんだバンプ形成用部材の製造方法、及びはんだバンプ付き電極基板の製造方法

Also Published As

Publication number Publication date
JPWO2021131897A1 (https=) 2021-07-01
KR20220122663A (ko) 2022-09-02
WO2021131897A1 (ja) 2021-07-01
KR20260033631A (ko) 2026-03-10
JP2025092693A (ja) 2025-06-19
KR102934703B1 (ko) 2026-03-06
CN115152007A (zh) 2022-10-04

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