CN115152007A - 焊料凸块形成用部件、焊料凸块形成用部件的制造方法及带焊料凸块的电极基板的制造方法 - Google Patents

焊料凸块形成用部件、焊料凸块形成用部件的制造方法及带焊料凸块的电极基板的制造方法 Download PDF

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Publication number
CN115152007A
CN115152007A CN202080097284.4A CN202080097284A CN115152007A CN 115152007 A CN115152007 A CN 115152007A CN 202080097284 A CN202080097284 A CN 202080097284A CN 115152007 A CN115152007 A CN 115152007A
Authority
CN
China
Prior art keywords
solder
particles
substrate
solder particles
solder bump
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202080097284.4A
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English (en)
Chinese (zh)
Inventor
欠畑纯一
赤井邦彦
宫地胜将
江尻芳则
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Holdings Corp
Original Assignee
Showa Denko KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko KK filed Critical Showa Denko KK
Publication of CN115152007A publication Critical patent/CN115152007A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/011—Apparatus therefor
    • H10W72/0112—Apparatus for manufacturing bump connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01271—Cleaning, e.g. oxide removal or de-smearing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/016—Manufacture or treatment of strap connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07232—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
CN202080097284.4A 2019-12-27 2020-12-15 焊料凸块形成用部件、焊料凸块形成用部件的制造方法及带焊料凸块的电极基板的制造方法 Pending CN115152007A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019238428 2019-12-27
JP2019-238428 2019-12-27
PCT/JP2020/046731 WO2021131897A1 (ja) 2019-12-27 2020-12-15 はんだバンプ形成用部材、はんだバンプ形成用部材の製造方法、及びはんだバンプ付き電極基板の製造方法

Publications (1)

Publication Number Publication Date
CN115152007A true CN115152007A (zh) 2022-10-04

Family

ID=76576058

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080097284.4A Pending CN115152007A (zh) 2019-12-27 2020-12-15 焊料凸块形成用部件、焊料凸块形成用部件的制造方法及带焊料凸块的电极基板的制造方法

Country Status (4)

Country Link
JP (2) JP7661891B2 (https=)
KR (2) KR20260033631A (https=)
CN (1) CN115152007A (https=)
WO (1) WO2021131897A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20260033631A (ko) * 2019-12-27 2026-03-10 가부시끼가이샤 레조낙 땜납 범프 형성용 부재, 땜납 범프 형성용 부재의 제조 방법, 및 땜납 범프 부착 전극 기판의 제조 방법
US12318870B2 (en) * 2022-12-22 2025-06-03 Samsung Electronics Co., Ltd. Ball attachment apparatus

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4896817A (en) * 1988-10-17 1990-01-30 International Business Machines Corp. Flux composition and method of decreasing tin content in lead/tin solder joints
ATA67089A (de) * 1989-03-22 1990-08-15 Alcatel Austria Ag Flussmittel zum loeten von verzinnten leiterplatten
JPH0523887A (ja) * 1991-07-19 1993-02-02 Matsushita Electric Ind Co Ltd 金属ボールの形成方法
JPH07249631A (ja) * 1994-01-20 1995-09-26 Fujitsu Ltd はんだバンプ及びはんだボールの製造方法及び半導体装置の製造方法
WO2006043377A1 (ja) * 2004-10-19 2006-04-27 Senju Metal Industry Co., Ltd. はんだバンプ形成用シートとその製造方法
JP2006173654A (ja) * 1998-08-10 2006-06-29 Fujitsu Ltd ハンダバンプの形成方法
JP2009283734A (ja) * 2008-05-23 2009-12-03 Alps Electric Co Ltd フラックス転写方法及びフラックス転写装置
JP2010036234A (ja) * 2008-08-07 2010-02-18 Mitsui Mining & Smelting Co Ltd はんだ粉及びはんだペースト
WO2010125753A1 (ja) * 2009-04-30 2010-11-04 昭和電工株式会社 回路基板の製造方法
CN102396297A (zh) * 2009-02-13 2012-03-28 千住金属工业株式会社 使用了转印片的在电路基板上的焊盘形成
US20140103098A1 (en) * 2012-10-11 2014-04-17 Samsung Electro-Mechanics Co., Ltd. Mask for bumping solder balls on circuit board and solder ball bumping method using the same
CN107112253A (zh) * 2015-01-13 2017-08-29 迪睿合株式会社 凸点形成用膜、半导体装置及其制造方法以及连接构造体
JP2019029135A (ja) * 2017-07-27 2019-02-21 日立化成株式会社 異方性導電フィルム及びその製造方法、並びに接続構造体及びその製造方法
JP2019169371A (ja) * 2018-03-23 2019-10-03 株式会社タムラ製作所 導電性組成物および電子基板の製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3207506B2 (ja) * 1991-08-28 2001-09-10 株式会社日立製作所 電子回路装置の製造方法
US6528346B2 (en) * 1994-01-20 2003-03-04 Fujitsu Limited Bump-forming method using two plates and electronic device
JP3124224B2 (ja) * 1996-04-01 2001-01-15 富士通株式会社 はんだバンプ形成方法
JP3315871B2 (ja) * 1996-09-03 2002-08-19 日本特殊陶業株式会社 半田バンプを有する配線基板及びその製造方法
JP2004080024A (ja) 2002-08-02 2004-03-11 Senju Metal Ind Co Ltd はんだボール配置シート、その製造方法およびはんだバンプ形成方法
JP2017157626A (ja) 2016-02-29 2017-09-07 三菱マテリアル株式会社 はんだバンプの形成方法
KR20260033631A (ko) * 2019-12-27 2026-03-10 가부시끼가이샤 레조낙 땜납 범프 형성용 부재, 땜납 범프 형성용 부재의 제조 방법, 및 땜납 범프 부착 전극 기판의 제조 방법

Patent Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4896817A (en) * 1988-10-17 1990-01-30 International Business Machines Corp. Flux composition and method of decreasing tin content in lead/tin solder joints
ATA67089A (de) * 1989-03-22 1990-08-15 Alcatel Austria Ag Flussmittel zum loeten von verzinnten leiterplatten
JPH0523887A (ja) * 1991-07-19 1993-02-02 Matsushita Electric Ind Co Ltd 金属ボールの形成方法
JPH07249631A (ja) * 1994-01-20 1995-09-26 Fujitsu Ltd はんだバンプ及びはんだボールの製造方法及び半導体装置の製造方法
JP2006173654A (ja) * 1998-08-10 2006-06-29 Fujitsu Ltd ハンダバンプの形成方法
WO2006043377A1 (ja) * 2004-10-19 2006-04-27 Senju Metal Industry Co., Ltd. はんだバンプ形成用シートとその製造方法
JP2009283734A (ja) * 2008-05-23 2009-12-03 Alps Electric Co Ltd フラックス転写方法及びフラックス転写装置
JP2010036234A (ja) * 2008-08-07 2010-02-18 Mitsui Mining & Smelting Co Ltd はんだ粉及びはんだペースト
CN102396297A (zh) * 2009-02-13 2012-03-28 千住金属工业株式会社 使用了转印片的在电路基板上的焊盘形成
WO2010125753A1 (ja) * 2009-04-30 2010-11-04 昭和電工株式会社 回路基板の製造方法
US20120042511A1 (en) * 2009-04-30 2012-02-23 Showa Denko K.K. Method of producing circuit board
US20140103098A1 (en) * 2012-10-11 2014-04-17 Samsung Electro-Mechanics Co., Ltd. Mask for bumping solder balls on circuit board and solder ball bumping method using the same
CN107112253A (zh) * 2015-01-13 2017-08-29 迪睿合株式会社 凸点形成用膜、半导体装置及其制造方法以及连接构造体
JP2019029135A (ja) * 2017-07-27 2019-02-21 日立化成株式会社 異方性導電フィルム及びその製造方法、並びに接続構造体及びその製造方法
JP2019169371A (ja) * 2018-03-23 2019-10-03 株式会社タムラ製作所 導電性組成物および電子基板の製造方法

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Publication number Publication date
JPWO2021131897A1 (https=) 2021-07-01
KR20220122663A (ko) 2022-09-02
WO2021131897A1 (ja) 2021-07-01
KR20260033631A (ko) 2026-03-10
JP2025092693A (ja) 2025-06-19
KR102934703B1 (ko) 2026-03-06
JP7661891B2 (ja) 2025-04-15

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Address after: Tokyo, Japan

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Applicant before: Showa electrical materials Co.,Ltd.

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