JPWO2021131897A1 - - Google Patents

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Publication number
JPWO2021131897A1
JPWO2021131897A1 JP2021567299A JP2021567299A JPWO2021131897A1 JP WO2021131897 A1 JPWO2021131897 A1 JP WO2021131897A1 JP 2021567299 A JP2021567299 A JP 2021567299A JP 2021567299 A JP2021567299 A JP 2021567299A JP WO2021131897 A1 JPWO2021131897 A1 JP WO2021131897A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021567299A
Other languages
Japanese (ja)
Other versions
JP7661891B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021131897A1 publication Critical patent/JPWO2021131897A1/ja
Priority to JP2025060972A priority Critical patent/JP2025092693A/ja
Application granted granted Critical
Publication of JP7661891B2 publication Critical patent/JP7661891B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/011—Apparatus therefor
    • H10W72/0112—Apparatus for manufacturing bump connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01271—Cleaning, e.g. oxide removal or de-smearing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/016—Manufacture or treatment of strap connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07232—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2021567299A 2019-12-27 2020-12-15 はんだバンプ形成用部材、はんだバンプ形成用部材の製造方法、及びはんだバンプ付き電極基板の製造方法 Active JP7661891B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025060972A JP2025092693A (ja) 2019-12-27 2025-04-02 はんだバンプ形成用部材、はんだバンプ形成用部材の製造方法、及びはんだバンプ付き電極基板の製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019238428 2019-12-27
JP2019238428 2019-12-27
PCT/JP2020/046731 WO2021131897A1 (ja) 2019-12-27 2020-12-15 はんだバンプ形成用部材、はんだバンプ形成用部材の製造方法、及びはんだバンプ付き電極基板の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2025060972A Division JP2025092693A (ja) 2019-12-27 2025-04-02 はんだバンプ形成用部材、はんだバンプ形成用部材の製造方法、及びはんだバンプ付き電極基板の製造方法

Publications (2)

Publication Number Publication Date
JPWO2021131897A1 true JPWO2021131897A1 (https=) 2021-07-01
JP7661891B2 JP7661891B2 (ja) 2025-04-15

Family

ID=76576058

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2021567299A Active JP7661891B2 (ja) 2019-12-27 2020-12-15 はんだバンプ形成用部材、はんだバンプ形成用部材の製造方法、及びはんだバンプ付き電極基板の製造方法
JP2025060972A Withdrawn JP2025092693A (ja) 2019-12-27 2025-04-02 はんだバンプ形成用部材、はんだバンプ形成用部材の製造方法、及びはんだバンプ付き電極基板の製造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2025060972A Withdrawn JP2025092693A (ja) 2019-12-27 2025-04-02 はんだバンプ形成用部材、はんだバンプ形成用部材の製造方法、及びはんだバンプ付き電極基板の製造方法

Country Status (4)

Country Link
JP (2) JP7661891B2 (https=)
KR (2) KR20260033631A (https=)
CN (1) CN115152007A (https=)
WO (1) WO2021131897A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20260033631A (ko) * 2019-12-27 2026-03-10 가부시끼가이샤 레조낙 땜납 범프 형성용 부재, 땜납 범프 형성용 부재의 제조 방법, 및 땜납 범프 부착 전극 기판의 제조 방법
US12318870B2 (en) * 2022-12-22 2025-06-03 Samsung Electronics Co., Ltd. Ball attachment apparatus

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0523887A (ja) * 1991-07-19 1993-02-02 Matsushita Electric Ind Co Ltd 金属ボールの形成方法
JPH05235061A (ja) * 1991-08-28 1993-09-10 Hitachi Ltd 電子回路接合装置と方法およびハンダボ−ルと位置合わせマ−ク
JPH07249631A (ja) * 1994-01-20 1995-09-26 Fujitsu Ltd はんだバンプ及びはんだボールの製造方法及び半導体装置の製造方法
JPH1079404A (ja) * 1996-09-03 1998-03-24 Ngk Spark Plug Co Ltd 半田バンプを有する配線基板及びその製造方法
WO2006043377A1 (ja) * 2004-10-19 2006-04-27 Senju Metal Industry Co., Ltd. はんだバンプ形成用シートとその製造方法
JP2010036234A (ja) * 2008-08-07 2010-02-18 Mitsui Mining & Smelting Co Ltd はんだ粉及びはんだペースト
WO2010125753A1 (ja) * 2009-04-30 2010-11-04 昭和電工株式会社 回路基板の製造方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4896817A (en) * 1988-10-17 1990-01-30 International Business Machines Corp. Flux composition and method of decreasing tin content in lead/tin solder joints
AT392231B (de) * 1989-03-22 1991-02-25 Alcatel Austria Ag Flussmittel zum loeten von verzinnten leiterplatten
US6528346B2 (en) * 1994-01-20 2003-03-04 Fujitsu Limited Bump-forming method using two plates and electronic device
JP3124224B2 (ja) * 1996-04-01 2001-01-15 富士通株式会社 はんだバンプ形成方法
JP4087876B2 (ja) * 1998-08-10 2008-05-21 富士通株式会社 ハンダバンプの形成方法
JP2004080024A (ja) 2002-08-02 2004-03-11 Senju Metal Ind Co Ltd はんだボール配置シート、その製造方法およびはんだバンプ形成方法
JP2009283734A (ja) * 2008-05-23 2009-12-03 Alps Electric Co Ltd フラックス転写方法及びフラックス転写装置
TWI462676B (zh) * 2009-02-13 2014-11-21 千住金屬工業股份有限公司 The solder bumps for the circuit substrate are formed using the transfer sheet
KR101376888B1 (ko) * 2012-10-11 2014-03-20 삼성전기주식회사 회로기판의 솔더 볼 범핑을 위한 마스크 및 그를 이용한 솔더 볼 범핑 방법
TWI774640B (zh) * 2015-01-13 2022-08-21 日商迪睿合股份有限公司 凸塊形成用膜、半導體裝置及其製造方法、以及連接構造體
JP2017157626A (ja) 2016-02-29 2017-09-07 三菱マテリアル株式会社 はんだバンプの形成方法
JP2019029135A (ja) * 2017-07-27 2019-02-21 日立化成株式会社 異方性導電フィルム及びその製造方法、並びに接続構造体及びその製造方法
JP2019169371A (ja) * 2018-03-23 2019-10-03 株式会社タムラ製作所 導電性組成物および電子基板の製造方法
KR20260033631A (ko) * 2019-12-27 2026-03-10 가부시끼가이샤 레조낙 땜납 범프 형성용 부재, 땜납 범프 형성용 부재의 제조 방법, 및 땜납 범프 부착 전극 기판의 제조 방법

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0523887A (ja) * 1991-07-19 1993-02-02 Matsushita Electric Ind Co Ltd 金属ボールの形成方法
JPH05235061A (ja) * 1991-08-28 1993-09-10 Hitachi Ltd 電子回路接合装置と方法およびハンダボ−ルと位置合わせマ−ク
JPH07249631A (ja) * 1994-01-20 1995-09-26 Fujitsu Ltd はんだバンプ及びはんだボールの製造方法及び半導体装置の製造方法
JPH1079404A (ja) * 1996-09-03 1998-03-24 Ngk Spark Plug Co Ltd 半田バンプを有する配線基板及びその製造方法
WO2006043377A1 (ja) * 2004-10-19 2006-04-27 Senju Metal Industry Co., Ltd. はんだバンプ形成用シートとその製造方法
JP2010036234A (ja) * 2008-08-07 2010-02-18 Mitsui Mining & Smelting Co Ltd はんだ粉及びはんだペースト
WO2010125753A1 (ja) * 2009-04-30 2010-11-04 昭和電工株式会社 回路基板の製造方法

Also Published As

Publication number Publication date
KR20220122663A (ko) 2022-09-02
WO2021131897A1 (ja) 2021-07-01
KR20260033631A (ko) 2026-03-10
JP2025092693A (ja) 2025-06-19
KR102934703B1 (ko) 2026-03-06
JP7661891B2 (ja) 2025-04-15
CN115152007A (zh) 2022-10-04

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