KR20250060263A - 감광성 수지 조성물, 수지막, 및 전자 장치 - Google Patents

감광성 수지 조성물, 수지막, 및 전자 장치 Download PDF

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Publication number
KR20250060263A
KR20250060263A KR1020257010728A KR20257010728A KR20250060263A KR 20250060263 A KR20250060263 A KR 20250060263A KR 1020257010728 A KR1020257010728 A KR 1020257010728A KR 20257010728 A KR20257010728 A KR 20257010728A KR 20250060263 A KR20250060263 A KR 20250060263A
Authority
KR
South Korea
Prior art keywords
photosensitive resin
resin composition
mass
polyimide
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020257010728A
Other languages
English (en)
Korean (ko)
Inventor
유마 다나카
리츠야 가와사키
Original Assignee
스미또모 베이크라이트 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 스미또모 베이크라이트 가부시키가이샤 filed Critical 스미또모 베이크라이트 가부시키가이샤
Publication of KR20250060263A publication Critical patent/KR20250060263A/ko
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0387—Polyamides or polyimides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polymerisation Methods In General (AREA)
KR1020257010728A 2022-09-08 2023-08-31 감광성 수지 조성물, 수지막, 및 전자 장치 Pending KR20250060263A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022142797 2022-09-08
JPJP-P-2022-142797 2022-09-08
PCT/JP2023/031925 WO2024053564A1 (ja) 2022-09-08 2023-08-31 感光性樹脂組成物、樹脂膜、および電子装置

Publications (1)

Publication Number Publication Date
KR20250060263A true KR20250060263A (ko) 2025-05-07

Family

ID=90191064

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020257010728A Pending KR20250060263A (ko) 2022-09-08 2023-08-31 감광성 수지 조성물, 수지막, 및 전자 장치

Country Status (4)

Country Link
JP (1) JP7505659B1 (https=)
KR (1) KR20250060263A (https=)
TW (1) TW202419528A (https=)
WO (1) WO2024053564A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018070829A (ja) 2016-11-02 2018-05-10 東レ株式会社 樹脂組成物

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5620691B2 (ja) * 2010-02-16 2014-11-05 旭化成イーマテリアルズ株式会社 感光性樹脂組成物、硬化レリーフパターンの製造方法、並びに半導体装置
JP5762706B2 (ja) * 2010-09-06 2015-08-12 旭化成イーマテリアルズ株式会社 感光性樹脂組成物及び硬化レリーフパターンの製造方法
JP7062899B2 (ja) * 2017-09-15 2022-05-09 住友ベークライト株式会社 感光性樹脂組成物、半導体装置および電子機器
JP7173103B2 (ja) * 2020-03-31 2022-11-16 住友ベークライト株式会社 感光性樹脂組成物、電子デバイスの製造方法および電子デバイス
JP7392580B2 (ja) * 2020-06-08 2023-12-06 住友ベークライト株式会社 感光性樹脂組成物、電子デバイスの製造方法および電子デバイス
JP2022019609A (ja) * 2020-07-16 2022-01-27 住友ベークライト株式会社 感光性樹脂組成物、電子デバイスの製造方法、電子デバイスおよび感光性樹脂組成物の製造方法
WO2022145136A1 (ja) * 2020-12-28 2022-07-07 富士フイルム株式会社 樹脂組成物、硬化物、積層体、硬化物の製造方法、及び、半導体デバイス、並びに、化合物

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018070829A (ja) 2016-11-02 2018-05-10 東レ株式会社 樹脂組成物

Also Published As

Publication number Publication date
JP7505659B1 (ja) 2024-06-25
WO2024053564A1 (ja) 2024-03-14
JPWO2024053564A1 (https=) 2024-03-14
TW202419528A (zh) 2024-05-16

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