JPWO2024053564A1 - - Google Patents
Info
- Publication number
- JPWO2024053564A1 JPWO2024053564A1 JP2024503915A JP2024503915A JPWO2024053564A1 JP WO2024053564 A1 JPWO2024053564 A1 JP WO2024053564A1 JP 2024503915 A JP2024503915 A JP 2024503915A JP 2024503915 A JP2024503915 A JP 2024503915A JP WO2024053564 A1 JPWO2024053564 A1 JP WO2024053564A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0387—Polyamides or polyimides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Materials For Photolithography (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Polymerisation Methods In General (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022142797 | 2022-09-08 | ||
| JP2022142797 | 2022-09-08 | ||
| PCT/JP2023/031925 WO2024053564A1 (ja) | 2022-09-08 | 2023-08-31 | 感光性樹脂組成物、樹脂膜、および電子装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2024053564A1 true JPWO2024053564A1 (https=) | 2024-03-14 |
| JP7505659B1 JP7505659B1 (ja) | 2024-06-25 |
| JPWO2024053564A5 JPWO2024053564A5 (https=) | 2024-08-14 |
Family
ID=90191064
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024503915A Active JP7505659B1 (ja) | 2022-09-08 | 2023-08-31 | 感光性樹脂組成物、樹脂膜、および電子装置 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP7505659B1 (https=) |
| KR (1) | KR20250060263A (https=) |
| TW (1) | TW202419528A (https=) |
| WO (1) | WO2024053564A1 (https=) |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5620691B2 (ja) * | 2010-02-16 | 2014-11-05 | 旭化成イーマテリアルズ株式会社 | 感光性樹脂組成物、硬化レリーフパターンの製造方法、並びに半導体装置 |
| JP5762706B2 (ja) * | 2010-09-06 | 2015-08-12 | 旭化成イーマテリアルズ株式会社 | 感光性樹脂組成物及び硬化レリーフパターンの製造方法 |
| JP2018070829A (ja) | 2016-11-02 | 2018-05-10 | 東レ株式会社 | 樹脂組成物 |
| JP7062899B2 (ja) * | 2017-09-15 | 2022-05-09 | 住友ベークライト株式会社 | 感光性樹脂組成物、半導体装置および電子機器 |
| JP7173103B2 (ja) * | 2020-03-31 | 2022-11-16 | 住友ベークライト株式会社 | 感光性樹脂組成物、電子デバイスの製造方法および電子デバイス |
| JP7392580B2 (ja) * | 2020-06-08 | 2023-12-06 | 住友ベークライト株式会社 | 感光性樹脂組成物、電子デバイスの製造方法および電子デバイス |
| JP2022019609A (ja) * | 2020-07-16 | 2022-01-27 | 住友ベークライト株式会社 | 感光性樹脂組成物、電子デバイスの製造方法、電子デバイスおよび感光性樹脂組成物の製造方法 |
| WO2022145136A1 (ja) * | 2020-12-28 | 2022-07-07 | 富士フイルム株式会社 | 樹脂組成物、硬化物、積層体、硬化物の製造方法、及び、半導体デバイス、並びに、化合物 |
-
2023
- 2023-08-31 KR KR1020257010728A patent/KR20250060263A/ko active Pending
- 2023-08-31 WO PCT/JP2023/031925 patent/WO2024053564A1/ja not_active Ceased
- 2023-08-31 JP JP2024503915A patent/JP7505659B1/ja active Active
- 2023-09-04 TW TW112133469A patent/TW202419528A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JP7505659B1 (ja) | 2024-06-25 |
| WO2024053564A1 (ja) | 2024-03-14 |
| TW202419528A (zh) | 2024-05-16 |
| KR20250060263A (ko) | 2025-05-07 |
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