JP7505659B1 - 感光性樹脂組成物、樹脂膜、および電子装置 - Google Patents

感光性樹脂組成物、樹脂膜、および電子装置 Download PDF

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JP7505659B1
JP7505659B1 JP2024503915A JP2024503915A JP7505659B1 JP 7505659 B1 JP7505659 B1 JP 7505659B1 JP 2024503915 A JP2024503915 A JP 2024503915A JP 2024503915 A JP2024503915 A JP 2024503915A JP 7505659 B1 JP7505659 B1 JP 7505659B1
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photosensitive resin
resin composition
mass
polyimide
film
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JPWO2024053564A5 (https=
JPWO2024053564A1 (https=
Inventor
裕馬 田中
律也 川崎
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Sumitomo Bakelite Co Ltd
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Sumitomo Bakelite Co Ltd
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0387—Polyamides or polyimides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polymerisation Methods In General (AREA)
JP2024503915A 2022-09-08 2023-08-31 感光性樹脂組成物、樹脂膜、および電子装置 Active JP7505659B1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022142797 2022-09-08
JP2022142797 2022-09-08
PCT/JP2023/031925 WO2024053564A1 (ja) 2022-09-08 2023-08-31 感光性樹脂組成物、樹脂膜、および電子装置

Publications (3)

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JPWO2024053564A1 JPWO2024053564A1 (https=) 2024-03-14
JP7505659B1 true JP7505659B1 (ja) 2024-06-25
JPWO2024053564A5 JPWO2024053564A5 (https=) 2024-08-14

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JP2024503915A Active JP7505659B1 (ja) 2022-09-08 2023-08-31 感光性樹脂組成物、樹脂膜、および電子装置

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Country Link
JP (1) JP7505659B1 (https=)
KR (1) KR20250060263A (https=)
TW (1) TW202419528A (https=)
WO (1) WO2024053564A1 (https=)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011169980A (ja) * 2010-02-16 2011-09-01 Asahi Kasei E-Materials Corp 感光性樹脂組成物、硬化レリーフパターンの製造方法、並びに半導体装置
JP2012058304A (ja) * 2010-09-06 2012-03-22 Asahi Kasei E-Materials Corp 感光性樹脂組成物、硬化レリーフパターン及び半導体装置
JP2019053220A (ja) * 2017-09-15 2019-04-04 住友ベークライト株式会社 感光性樹脂組成物、半導体装置および電子機器
JP2021162834A (ja) * 2020-03-31 2021-10-11 住友ベークライト株式会社 感光性樹脂組成物、電子デバイスの製造方法および電子デバイス
JP2021193411A (ja) * 2020-06-08 2021-12-23 住友ベークライト株式会社 感光性樹脂組成物、電子デバイスの製造方法および電子デバイス
JP2022019609A (ja) * 2020-07-16 2022-01-27 住友ベークライト株式会社 感光性樹脂組成物、電子デバイスの製造方法、電子デバイスおよび感光性樹脂組成物の製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018070829A (ja) 2016-11-02 2018-05-10 東レ株式会社 樹脂組成物
WO2022145136A1 (ja) * 2020-12-28 2022-07-07 富士フイルム株式会社 樹脂組成物、硬化物、積層体、硬化物の製造方法、及び、半導体デバイス、並びに、化合物

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011169980A (ja) * 2010-02-16 2011-09-01 Asahi Kasei E-Materials Corp 感光性樹脂組成物、硬化レリーフパターンの製造方法、並びに半導体装置
JP2012058304A (ja) * 2010-09-06 2012-03-22 Asahi Kasei E-Materials Corp 感光性樹脂組成物、硬化レリーフパターン及び半導体装置
JP2019053220A (ja) * 2017-09-15 2019-04-04 住友ベークライト株式会社 感光性樹脂組成物、半導体装置および電子機器
JP2021162834A (ja) * 2020-03-31 2021-10-11 住友ベークライト株式会社 感光性樹脂組成物、電子デバイスの製造方法および電子デバイス
JP2021193411A (ja) * 2020-06-08 2021-12-23 住友ベークライト株式会社 感光性樹脂組成物、電子デバイスの製造方法および電子デバイス
JP2022019609A (ja) * 2020-07-16 2022-01-27 住友ベークライト株式会社 感光性樹脂組成物、電子デバイスの製造方法、電子デバイスおよび感光性樹脂組成物の製造方法

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WO2024053564A1 (ja) 2024-03-14
JPWO2024053564A1 (https=) 2024-03-14
TW202419528A (zh) 2024-05-16
KR20250060263A (ko) 2025-05-07

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