KR20250044647A - 연마액, 연마액 세트 및 연마 방법 - Google Patents

연마액, 연마액 세트 및 연마 방법 Download PDF

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Publication number
KR20250044647A
KR20250044647A KR1020257000362A KR20257000362A KR20250044647A KR 20250044647 A KR20250044647 A KR 20250044647A KR 1020257000362 A KR1020257000362 A KR 1020257000362A KR 20257000362 A KR20257000362 A KR 20257000362A KR 20250044647 A KR20250044647 A KR 20250044647A
Authority
KR
South Korea
Prior art keywords
polishing
less
mass
liquid
acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020257000362A
Other languages
English (en)
Korean (ko)
Inventor
사토시 후루카와
다카아키 마쓰모토
Original Assignee
가부시끼가이샤 레조낙
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시끼가이샤 레조낙 filed Critical 가부시끼가이샤 레조낙
Publication of KR20250044647A publication Critical patent/KR20250044647A/ko
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • H01L21/31053—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/06—Planarisation of inorganic insulating materials
    • H10P95/062—Planarisation of inorganic insulating materials involving a dielectric removal step

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
KR1020257000362A 2022-08-09 2023-08-08 연마액, 연마액 세트 및 연마 방법 Pending KR20250044647A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2022-127001 2022-08-09
JP2022127001 2022-08-09
PCT/JP2023/028988 WO2024034618A1 (ja) 2022-08-09 2023-08-08 研磨液、研磨液セット及び研磨方法

Publications (1)

Publication Number Publication Date
KR20250044647A true KR20250044647A (ko) 2025-04-01

Family

ID=89851830

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020257000362A Pending KR20250044647A (ko) 2022-08-09 2023-08-08 연마액, 연마액 세트 및 연마 방법

Country Status (5)

Country Link
JP (1) JPWO2024034618A1 (https=)
KR (1) KR20250044647A (https=)
CN (1) CN119095930A (https=)
TW (1) TW202421734A (https=)
WO (1) WO2024034618A1 (https=)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008022970A (ja) 2006-07-19 2008-02-07 Pegasus Sewing Mach Mfg Co Ltd ミシンの針折れ検出装置
JP2010106994A (ja) 2008-10-31 2010-05-13 Ntn Corp 流体軸受装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5351967B2 (ja) * 2008-08-28 2013-11-27 スリーエム イノベイティブ プロパティズ カンパニー 構造化研磨物品、その製造方法、及びウエハの平坦化における使用
JP2010073999A (ja) * 2008-09-19 2010-04-02 Fujifilm Corp 化学的機械的研磨液
JP2017190395A (ja) * 2016-04-13 2017-10-19 旭硝子株式会社 研磨用コロイダルシリカスラリーおよびこれを用いた磁気ディスク用ガラス基板の製造方法
JP7835591B2 (ja) * 2022-03-24 2026-03-25 花王株式会社 酸化珪素膜用研磨液組成物

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008022970A (ja) 2006-07-19 2008-02-07 Pegasus Sewing Mach Mfg Co Ltd ミシンの針折れ検出装置
JP2010106994A (ja) 2008-10-31 2010-05-13 Ntn Corp 流体軸受装置

Also Published As

Publication number Publication date
TW202421734A (zh) 2024-06-01
WO2024034618A1 (ja) 2024-02-15
JPWO2024034618A1 (https=) 2024-02-15
CN119095930A (zh) 2024-12-06

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Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000