TW202421734A - 研磨液、研磨液套組及研磨方法 - Google Patents

研磨液、研磨液套組及研磨方法 Download PDF

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Publication number
TW202421734A
TW202421734A TW112129800A TW112129800A TW202421734A TW 202421734 A TW202421734 A TW 202421734A TW 112129800 A TW112129800 A TW 112129800A TW 112129800 A TW112129800 A TW 112129800A TW 202421734 A TW202421734 A TW 202421734A
Authority
TW
Taiwan
Prior art keywords
polishing
liquid
less
mass
polishing liquid
Prior art date
Application number
TW112129800A
Other languages
English (en)
Chinese (zh)
Inventor
古川曉之
松本貴彬
Original Assignee
日商力森諾科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商力森諾科股份有限公司 filed Critical 日商力森諾科股份有限公司
Publication of TW202421734A publication Critical patent/TW202421734A/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/06—Planarisation of inorganic insulating materials
    • H10P95/062—Planarisation of inorganic insulating materials involving a dielectric removal step

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW112129800A 2022-08-09 2023-08-08 研磨液、研磨液套組及研磨方法 TW202421734A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022127001 2022-08-09
JP2022-127001 2022-08-09

Publications (1)

Publication Number Publication Date
TW202421734A true TW202421734A (zh) 2024-06-01

Family

ID=89851830

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112129800A TW202421734A (zh) 2022-08-09 2023-08-08 研磨液、研磨液套組及研磨方法

Country Status (5)

Country Link
JP (1) JPWO2024034618A1 (https=)
KR (1) KR20250044647A (https=)
CN (1) CN119095930A (https=)
TW (1) TW202421734A (https=)
WO (1) WO2024034618A1 (https=)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4874022B2 (ja) 2006-07-19 2012-02-08 ペガサスミシン製造株式会社 ミシンの針折れ検出装置
JP5351967B2 (ja) * 2008-08-28 2013-11-27 スリーエム イノベイティブ プロパティズ カンパニー 構造化研磨物品、その製造方法、及びウエハの平坦化における使用
JP2010073999A (ja) * 2008-09-19 2010-04-02 Fujifilm Corp 化学的機械的研磨液
JP2010106994A (ja) 2008-10-31 2010-05-13 Ntn Corp 流体軸受装置
JP2017190395A (ja) * 2016-04-13 2017-10-19 旭硝子株式会社 研磨用コロイダルシリカスラリーおよびこれを用いた磁気ディスク用ガラス基板の製造方法
JP7835591B2 (ja) * 2022-03-24 2026-03-25 花王株式会社 酸化珪素膜用研磨液組成物

Also Published As

Publication number Publication date
KR20250044647A (ko) 2025-04-01
WO2024034618A1 (ja) 2024-02-15
JPWO2024034618A1 (https=) 2024-02-15
CN119095930A (zh) 2024-12-06

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