JPWO2024034618A1 - - Google Patents
Info
- Publication number
- JPWO2024034618A1 JPWO2024034618A1 JP2024540492A JP2024540492A JPWO2024034618A1 JP WO2024034618 A1 JPWO2024034618 A1 JP WO2024034618A1 JP 2024540492 A JP2024540492 A JP 2024540492A JP 2024540492 A JP2024540492 A JP 2024540492A JP WO2024034618 A1 JPWO2024034618 A1 JP WO2024034618A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
- H10P95/06—Planarisation of inorganic insulating materials
- H10P95/062—Planarisation of inorganic insulating materials involving a dielectric removal step
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022127001 | 2022-08-09 | ||
| PCT/JP2023/028988 WO2024034618A1 (ja) | 2022-08-09 | 2023-08-08 | 研磨液、研磨液セット及び研磨方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2024034618A1 true JPWO2024034618A1 (https=) | 2024-02-15 |
Family
ID=89851830
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024540492A Pending JPWO2024034618A1 (https=) | 2022-08-09 | 2023-08-08 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2024034618A1 (https=) |
| KR (1) | KR20250044647A (https=) |
| CN (1) | CN119095930A (https=) |
| TW (1) | TW202421734A (https=) |
| WO (1) | WO2024034618A1 (https=) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4874022B2 (ja) | 2006-07-19 | 2012-02-08 | ペガサスミシン製造株式会社 | ミシンの針折れ検出装置 |
| JP5351967B2 (ja) * | 2008-08-28 | 2013-11-27 | スリーエム イノベイティブ プロパティズ カンパニー | 構造化研磨物品、その製造方法、及びウエハの平坦化における使用 |
| JP2010073999A (ja) * | 2008-09-19 | 2010-04-02 | Fujifilm Corp | 化学的機械的研磨液 |
| JP2010106994A (ja) | 2008-10-31 | 2010-05-13 | Ntn Corp | 流体軸受装置 |
| JP2017190395A (ja) * | 2016-04-13 | 2017-10-19 | 旭硝子株式会社 | 研磨用コロイダルシリカスラリーおよびこれを用いた磁気ディスク用ガラス基板の製造方法 |
| JP7835591B2 (ja) * | 2022-03-24 | 2026-03-25 | 花王株式会社 | 酸化珪素膜用研磨液組成物 |
-
2023
- 2023-08-08 JP JP2024540492A patent/JPWO2024034618A1/ja active Pending
- 2023-08-08 CN CN202380035940.1A patent/CN119095930A/zh active Pending
- 2023-08-08 WO PCT/JP2023/028988 patent/WO2024034618A1/ja not_active Ceased
- 2023-08-08 TW TW112129800A patent/TW202421734A/zh unknown
- 2023-08-08 KR KR1020257000362A patent/KR20250044647A/ko active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| KR20250044647A (ko) | 2025-04-01 |
| TW202421734A (zh) | 2024-06-01 |
| WO2024034618A1 (ja) | 2024-02-15 |
| CN119095930A (zh) | 2024-12-06 |