CN119095930A - 研磨液、研磨液套组及研磨方法 - Google Patents

研磨液、研磨液套组及研磨方法 Download PDF

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Publication number
CN119095930A
CN119095930A CN202380035940.1A CN202380035940A CN119095930A CN 119095930 A CN119095930 A CN 119095930A CN 202380035940 A CN202380035940 A CN 202380035940A CN 119095930 A CN119095930 A CN 119095930A
Authority
CN
China
Prior art keywords
polishing
less
mass
liquid
polishing liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380035940.1A
Other languages
English (en)
Chinese (zh)
Inventor
古川晓之
松本贵彬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Resonac Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Resonac Corp filed Critical Resonac Corp
Publication of CN119095930A publication Critical patent/CN119095930A/zh
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/06—Planarisation of inorganic insulating materials
    • H10P95/062—Planarisation of inorganic insulating materials involving a dielectric removal step

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
CN202380035940.1A 2022-08-09 2023-08-08 研磨液、研磨液套组及研磨方法 Pending CN119095930A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022127001 2022-08-09
JP2022-127001 2022-08-09
PCT/JP2023/028988 WO2024034618A1 (ja) 2022-08-09 2023-08-08 研磨液、研磨液セット及び研磨方法

Publications (1)

Publication Number Publication Date
CN119095930A true CN119095930A (zh) 2024-12-06

Family

ID=89851830

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380035940.1A Pending CN119095930A (zh) 2022-08-09 2023-08-08 研磨液、研磨液套组及研磨方法

Country Status (5)

Country Link
JP (1) JPWO2024034618A1 (https=)
KR (1) KR20250044647A (https=)
CN (1) CN119095930A (https=)
TW (1) TW202421734A (https=)
WO (1) WO2024034618A1 (https=)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4874022B2 (ja) 2006-07-19 2012-02-08 ペガサスミシン製造株式会社 ミシンの針折れ検出装置
JP5351967B2 (ja) * 2008-08-28 2013-11-27 スリーエム イノベイティブ プロパティズ カンパニー 構造化研磨物品、その製造方法、及びウエハの平坦化における使用
JP2010073999A (ja) * 2008-09-19 2010-04-02 Fujifilm Corp 化学的機械的研磨液
JP2010106994A (ja) 2008-10-31 2010-05-13 Ntn Corp 流体軸受装置
JP2017190395A (ja) * 2016-04-13 2017-10-19 旭硝子株式会社 研磨用コロイダルシリカスラリーおよびこれを用いた磁気ディスク用ガラス基板の製造方法
JP7835591B2 (ja) * 2022-03-24 2026-03-25 花王株式会社 酸化珪素膜用研磨液組成物

Also Published As

Publication number Publication date
KR20250044647A (ko) 2025-04-01
TW202421734A (zh) 2024-06-01
WO2024034618A1 (ja) 2024-02-15
JPWO2024034618A1 (https=) 2024-02-15

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