KR20250038639A - 레지스트 보조막 조성물, 및 해당 조성물을 이용한 패턴의 형성 방법 - Google Patents

레지스트 보조막 조성물, 및 해당 조성물을 이용한 패턴의 형성 방법 Download PDF

Info

Publication number
KR20250038639A
KR20250038639A KR1020247038876A KR20247038876A KR20250038639A KR 20250038639 A KR20250038639 A KR 20250038639A KR 1020247038876 A KR1020247038876 A KR 1020247038876A KR 20247038876 A KR20247038876 A KR 20247038876A KR 20250038639 A KR20250038639 A KR 20250038639A
Authority
KR
South Korea
Prior art keywords
resist
group
auxiliary film
resin
mass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020247038876A
Other languages
English (en)
Korean (ko)
Inventor
다쿠미 오카다
료스케 호시노
히데유키 사토
마사유키 가타기리
슈 스즈키
마사토시 에치고
Original Assignee
미쯔비시 가스 케미칼 컴파니, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 filed Critical 미쯔비시 가스 케미칼 컴파니, 인코포레이티드
Publication of KR20250038639A publication Critical patent/KR20250038639A/ko
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L57/00—Compositions of unspecified polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/091—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers characterised by antireflection means or light filtering or absorbing means, e.g. anti-halation, contrast enhancement
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/094—Multilayer resist systems, e.g. planarising layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • H01L21/0274—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041—Photolithographic processes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Structural Engineering (AREA)
  • Architecture (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020247038876A 2022-07-14 2023-07-03 레지스트 보조막 조성물, 및 해당 조성물을 이용한 패턴의 형성 방법 Pending KR20250038639A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2022-113283 2022-07-14
JP2022113283 2022-07-14
PCT/JP2023/024544 WO2024014330A1 (ja) 2022-07-14 2023-07-03 レジスト補助膜組成物、及び該組成物を用いたパターンの形成方法

Publications (1)

Publication Number Publication Date
KR20250038639A true KR20250038639A (ko) 2025-03-19

Family

ID=89536597

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247038876A Pending KR20250038639A (ko) 2022-07-14 2023-07-03 레지스트 보조막 조성물, 및 해당 조성물을 이용한 패턴의 형성 방법

Country Status (6)

Country Link
US (1) US20250321485A1 (https=)
JP (1) JPWO2024014330A1 (https=)
KR (1) KR20250038639A (https=)
CN (1) CN119452307A (https=)
TW (1) TW202411339A (https=)
WO (1) WO2024014330A1 (https=)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5693691A (en) 1995-08-21 1997-12-02 Brewer Science, Inc. Thermosetting anti-reflective coatings compositions
US5919599A (en) 1997-09-30 1999-07-06 Brewer Science, Inc. Thermosetting anti-reflective coatings at deep ultraviolet
JP2000143937A (ja) 1998-11-16 2000-05-26 Jsr Corp 反射防止膜形成組成物
JP2001040293A (ja) 1999-08-03 2001-02-13 Jsr Corp 反射防止膜形成組成物
JP2005250434A (ja) 2004-02-04 2005-09-15 Shin Etsu Chem Co Ltd レジスト下層膜材料ならびにパターン形成方法
JP2010015112A (ja) 2008-07-07 2010-01-21 Jsr Corp 多層レジストプロセス用下層膜形成組成物

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62123444A (ja) * 1985-08-07 1987-06-04 Japan Synthetic Rubber Co Ltd ポジ型感放射線性樹脂組成物
JP2001188364A (ja) * 1999-10-20 2001-07-10 Toray Ind Inc レジスト剥離用溶剤、カラーフィルターの製造方法および液晶表示装置
JP4548616B2 (ja) * 2006-05-15 2010-09-22 信越化学工業株式会社 熱酸発生剤及びこれを含むレジスト下層膜材料、並びにこのレジスト下層膜材料を用いたパターン形成方法
WO2020004464A1 (ja) * 2018-06-26 2020-01-02 三菱瓦斯化学株式会社 α位にブチリルオキシ基又はピバロイルオキシ基を有するイソ酪酸エステル化合物及び香料組成物

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5693691A (en) 1995-08-21 1997-12-02 Brewer Science, Inc. Thermosetting anti-reflective coatings compositions
US5919599A (en) 1997-09-30 1999-07-06 Brewer Science, Inc. Thermosetting anti-reflective coatings at deep ultraviolet
JP2000143937A (ja) 1998-11-16 2000-05-26 Jsr Corp 反射防止膜形成組成物
JP2001040293A (ja) 1999-08-03 2001-02-13 Jsr Corp 反射防止膜形成組成物
JP2005250434A (ja) 2004-02-04 2005-09-15 Shin Etsu Chem Co Ltd レジスト下層膜材料ならびにパターン形成方法
JP2010015112A (ja) 2008-07-07 2010-01-21 Jsr Corp 多層レジストプロセス用下層膜形成組成物

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Proc. SPIE, Vol. 3678, 174-185(1999).

Also Published As

Publication number Publication date
JPWO2024014330A1 (https=) 2024-01-18
TW202411339A (zh) 2024-03-16
CN119452307A (zh) 2025-02-14
WO2024014330A1 (ja) 2024-01-18
US20250321485A1 (en) 2025-10-16

Similar Documents

Publication Publication Date Title
JP7283515B2 (ja) 化合物、樹脂、組成物並びにレジストパターン形成方法及び回路パターン形成方法
JP6877696B2 (ja) 化合物、樹脂、組成物、レジストパターン形成方法、及び、回路パターン形成方法
JP7212449B2 (ja) 化合物及びその製造方法、並びに、組成物、光学部品形成用組成物、リソグラフィー用膜形成組成物、レジスト組成物、レジストパターンの形成方法、感放射線性組成物、アモルファス膜の製造方法、リソグラフィー用下層膜形成材料、リソグラフィー用下層膜形成用組成物、リソグラフィー用下層膜の製造方法、レジストパターン形成方法、回路パターン形成方法、及び、精製方法
JP7194356B2 (ja) 化合物、樹脂及び組成物、並びにレジストパターン形成方法及び回路パターン形成方法
JPWO2018016614A1 (ja) 化合物、樹脂、組成物及びパターン形成方法
WO2018016615A1 (ja) 化合物、樹脂、組成物並びにレジストパターン形成方法及び回路パターン形成方法
US20240369924A1 (en) Resist composition and resist film forming method using same
WO2019098338A1 (ja) リソグラフィー用膜形成用組成物、リソグラフィー用膜、レジストパターン形成方法、及び回路パターン形成方法
JPWO2018016648A1 (ja) 化合物、樹脂、組成物及びパターン形成方法
JPWO2017014284A1 (ja) 新規化合物及びその製造方法
KR20180034427A (ko) 신규 (메트)아크릴로일 화합물 및 그 제조방법
JP7216897B2 (ja) 化合物、樹脂、組成物、パターン形成方法及び精製方法
JP7205715B2 (ja) 化合物、樹脂、組成物並びにレジストパターン形成方法及び回路パターン形成方法
JP7205716B2 (ja) 化合物、樹脂、組成物並びにレジストパターン形成方法及び回路パターン形成方法
CN112513737B (zh) 下层膜形成组合物
WO2018101463A1 (ja) 化合物、樹脂、組成物、パターン形成方法及び精製方法
JPWO2018056277A1 (ja) 化合物、樹脂、組成物、並びにレジストパターン形成方法及び回路パターン形成方法
JP7252516B2 (ja) 膜形成材料、リソグラフィー用膜形成用組成物、光学部品形成用材料、レジスト組成物、レジストパターン形成方法、レジスト用永久膜、感放射線性組成物、アモルファス膜の製造方法、リソグラフィー用下層膜形成材料、リソグラフィー用下層膜形成用組成物、リソグラフィー用下層膜の製造方法及び回路パターン形成方法
JP2005266798A (ja) フォトレジスト組成物およびレジストパターン形成方法
KR20240039091A (ko) 레지스트 보조막 조성물, 및 해당 조성물을 이용한 패턴의 형성 방법
WO2021172132A1 (ja) レジスト組成物、及びレジスト組成物の使用方法
KR20250037703A (ko) 레지스트 조성물, 및 그를 이용한 레지스트막 형성 방법
JP2018154600A (ja) 化合物、樹脂、組成物、パターン形成方法及び精製方法
KR20250038639A (ko) 레지스트 보조막 조성물, 및 해당 조성물을 이용한 패턴의 형성 방법
CN117769684A (zh) 抗蚀剂辅助膜组合物和使用该组合物的图案形成方法

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000