KR20240169702A - 적층 압전 필름, 디바이스 및 적층 압전 필름의 제조방법 - Google Patents

적층 압전 필름, 디바이스 및 적층 압전 필름의 제조방법 Download PDF

Info

Publication number
KR20240169702A
KR20240169702A KR1020247036859A KR20247036859A KR20240169702A KR 20240169702 A KR20240169702 A KR 20240169702A KR 1020247036859 A KR1020247036859 A KR 1020247036859A KR 20247036859 A KR20247036859 A KR 20247036859A KR 20240169702 A KR20240169702 A KR 20240169702A
Authority
KR
South Korea
Prior art keywords
piezoelectric film
hard coat
laminated piezoelectric
coat layer
laminated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020247036859A
Other languages
English (en)
Korean (ko)
Inventor
마코토 이마지
모모에 모토무라
Original Assignee
가부시끼가이샤 구레하
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시끼가이샤 구레하 filed Critical 가부시끼가이샤 구레하
Publication of KR20240169702A publication Critical patent/KR20240169702A/ko
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/88—Mounts; Supports; Enclosures; Casings
    • H10N30/883—Additional insulation means preventing electrical, physical or chemical damage, e.g. protective coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/046—Forming abrasion-resistant coatings; Forming surface-hardening coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/02—Forming enclosures or casings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/05—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/30—Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/30—Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
    • H10N30/302—Sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/704—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/857—Macromolecular compositions

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Laminated Bodies (AREA)
KR1020247036859A 2022-05-11 2023-05-10 적층 압전 필름, 디바이스 및 적층 압전 필름의 제조방법 Pending KR20240169702A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2022-078219 2022-05-11
JP2022078219 2022-05-11
PCT/JP2023/017501 WO2023219090A1 (ja) 2022-05-11 2023-05-10 積層圧電フィルム、デバイス、及び積層圧電フィルムの製造方法

Publications (1)

Publication Number Publication Date
KR20240169702A true KR20240169702A (ko) 2024-12-03

Family

ID=88730252

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247036859A Pending KR20240169702A (ko) 2022-05-11 2023-05-10 적층 압전 필름, 디바이스 및 적층 압전 필름의 제조방법

Country Status (6)

Country Link
US (1) US20250301911A1 (https=)
EP (1) EP4506068A4 (https=)
JP (1) JP7742489B2 (https=)
KR (1) KR20240169702A (https=)
CN (1) CN119138127A (https=)
WO (1) WO2023219090A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05324203A (ja) 1992-05-22 1993-12-07 Fujitsu Ltd 静電容量型タッチパネル

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007134293A (ja) * 2005-11-07 2007-05-31 Hs Planning:Kk 透明導電性フィルム及び透明導電性フィルム製造方法
WO2017209080A1 (ja) * 2016-05-30 2017-12-07 日東電工株式会社 圧電フィルム
JP2019066630A (ja) * 2017-09-29 2019-04-25 日立化成株式会社 転写型感光性フィルム、保護膜の形成方法及びフォースセンサ
CN110324985B (zh) * 2019-07-10 2020-05-22 深圳市尚进电子科技有限公司 超声波雾化片生产工艺
JP2021075012A (ja) * 2019-11-13 2021-05-20 コニカミノルタ株式会社 中間転写体、当該中間転写体を用いる画像形成方法および画像形成装置
CN116348285A (zh) * 2020-10-30 2023-06-27 株式会社吴羽 透明导电压电膜及触摸面板

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05324203A (ja) 1992-05-22 1993-12-07 Fujitsu Ltd 静電容量型タッチパネル

Also Published As

Publication number Publication date
JP7742489B2 (ja) 2025-09-19
CN119138127A (zh) 2024-12-13
WO2023219090A1 (ja) 2023-11-16
EP4506068A4 (en) 2025-10-22
US20250301911A1 (en) 2025-09-25
EP4506068A1 (en) 2025-02-12
JPWO2023219090A1 (https=) 2023-11-16

Similar Documents

Publication Publication Date Title
CN109021478B (zh) （甲基）丙烯酸系树脂组合物及使用该组合物的（甲基）丙烯酸系树脂膜
KR101521317B1 (ko) 투명 도전성 적층체 및 터치 패널
JP6342791B2 (ja) 偏光板用保護フィルム及びそれを用いた偏光板
JPWO2003020509A1 (ja) 透明導電性積層体及びこれを用いた透明タッチパネル
JP2009104842A (ja) 透明導電性フィルム、その製造方法及びそれを備えたタッチパネル
JPWO2005052956A1 (ja) 透明導電性積層体及びそれを用いた透明タッチパネル
JP2007042284A (ja) 透明導電性積層体及び透明タッチパネル
KR20150100663A (ko) 광학 적층체, 이것을 사용한 편광판 및 화상 표시 장치
CN116234701A (zh) 压电膜、触摸面板及压电膜的制造方法
JP5884264B2 (ja) 表面プロテクトフィルム付きフィルム並びに偏光板及びその製造方法
KR20240169702A (ko) 적층 압전 필름, 디바이스 및 적층 압전 필름의 제조방법
WO2017094784A1 (ja) タッチパネルペン用筆記シート、タッチパネル、タッチパネルシステム及び表示装置、並びにタッチパネルペン用筆記シートの選別方法
JP2007042283A (ja) 透明導電性積層体及び透明タッチパネル
KR20200044058A (ko) 저마찰 필름 및 그의 제조 방법, 성형체 그리고 손가락 미끄럼성 향상 방법
CN114063205A (zh) 层叠体及图像显示装置
JP2005209431A (ja) 透明導電性積層体及びそれを用いた透明タッチパネル
JP4391358B2 (ja) 透明導電性積層体及びそれを用いた透明タッチパネル
JP2005014572A (ja) 端押し耐久性に優れた透明導電性積層体
JP2006252875A (ja) 透明導電性積層体及び透明タッチパネル
CN118044357A (zh) 透明导电压电膜、触摸面板以及透明导电压电膜的制造方法
JP2006190512A (ja) 透明導電性積層体及びそれを用いた透明タッチパネル
JP2006190508A (ja) 透明導電性積層体及びそれを用いた透明タッチパネル
TWI903935B (zh) 積層壓電體及其製造方法
JP2006190510A (ja) 透明導電性積層体及びそれを用いた透明タッチパネル
JP2006190511A (ja) 透明導電性積層体及びそれを用いた透明タッチパネル

Legal Events

Date Code Title Description
A201 Request for examination
PA0105 International application

Patent event date: 20241105

Patent event code: PA01051R01D

Comment text: International Patent Application

PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20241105

Comment text: Request for Examination of Application

PG1501 Laying open of application