CN116234701A - 压电膜、触摸面板及压电膜的制造方法 - Google Patents
压电膜、触摸面板及压电膜的制造方法 Download PDFInfo
- Publication number
- CN116234701A CN116234701A CN202180067153.6A CN202180067153A CN116234701A CN 116234701 A CN116234701 A CN 116234701A CN 202180067153 A CN202180067153 A CN 202180067153A CN 116234701 A CN116234701 A CN 116234701A
- Authority
- CN
- China
- Prior art keywords
- transparent
- piezoelectric
- film
- coating layer
- substrate film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 238000000034 method Methods 0.000 title description 16
- 239000011247 coating layer Substances 0.000 claims abstract description 129
- 239000000758 substrate Substances 0.000 claims abstract description 117
- 238000000576 coating method Methods 0.000 claims description 45
- 239000011248 coating agent Substances 0.000 claims description 39
- 239000000463 material Substances 0.000 claims description 33
- 238000002834 transmittance Methods 0.000 claims description 17
- 230000003746 surface roughness Effects 0.000 claims description 9
- 239000010408 film Substances 0.000 description 268
- 239000010410 layer Substances 0.000 description 28
- 229920005989 resin Polymers 0.000 description 24
- 239000011347 resin Substances 0.000 description 24
- 230000000694 effects Effects 0.000 description 19
- 230000000052 comparative effect Effects 0.000 description 17
- 239000000178 monomer Substances 0.000 description 15
- 239000012790 adhesive layer Substances 0.000 description 14
- BQCIDUSAKPWEOX-UHFFFAOYSA-N 1,1-Difluoroethene Chemical compound FC(F)=C BQCIDUSAKPWEOX-UHFFFAOYSA-N 0.000 description 11
- 239000004925 Acrylic resin Substances 0.000 description 11
- 239000003795 chemical substances by application Substances 0.000 description 11
- 239000006059 cover glass Substances 0.000 description 10
- 238000001723 curing Methods 0.000 description 10
- 239000000203 mixture Substances 0.000 description 10
- 229920000178 Acrylic resin Polymers 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 9
- 229920001577 copolymer Polymers 0.000 description 8
- 230000001747 exhibiting effect Effects 0.000 description 8
- 230000010287 polarization Effects 0.000 description 8
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 7
- 239000013078 crystal Substances 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 6
- -1 trifluoroethylene, chlorotrifluoroethylene, tetrafluoroethylene, hexafluoropropylene Chemical group 0.000 description 6
- 239000003973 paint Substances 0.000 description 5
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 150000002222 fluorine compounds Chemical class 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- 239000002033 PVDF binder Substances 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 229920001519 homopolymer Polymers 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 229910044991 metal oxide Inorganic materials 0.000 description 3
- 150000004706 metal oxides Chemical class 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 2
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 229920000180 alkyd Polymers 0.000 description 2
- LJCFOYOSGPHIOO-UHFFFAOYSA-N antimony pentoxide Chemical compound O=[Sb](=O)O[Sb](=O)=O LJCFOYOSGPHIOO-UHFFFAOYSA-N 0.000 description 2
- 239000002216 antistatic agent Substances 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 150000002430 hydrocarbons Chemical class 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000003607 modifier Substances 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 2
- VJGCZWVJDRIHNC-UHFFFAOYSA-N 1-fluoroprop-1-ene Chemical compound CC=CF VJGCZWVJDRIHNC-UHFFFAOYSA-N 0.000 description 1
- HFNSTEOEZJBXIF-UHFFFAOYSA-N 2,2,4,5-tetrafluoro-1,3-dioxole Chemical class FC1=C(F)OC(F)(F)O1 HFNSTEOEZJBXIF-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 239000002042 Silver nanowire Substances 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000007754 air knife coating Methods 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- GVFOJDIFWSDNOY-UHFFFAOYSA-N antimony tin Chemical compound [Sn].[Sb] GVFOJDIFWSDNOY-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- QHIWVLPBUQWDMQ-UHFFFAOYSA-N butyl prop-2-enoate;methyl 2-methylprop-2-enoate;prop-2-enoic acid Chemical compound OC(=O)C=C.COC(=O)C(C)=C.CCCCOC(=O)C=C QHIWVLPBUQWDMQ-UHFFFAOYSA-N 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 238000007607 die coating method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- XUCNUKMRBVNAPB-UHFFFAOYSA-N fluoroethene Chemical compound FC=C XUCNUKMRBVNAPB-UHFFFAOYSA-N 0.000 description 1
- 238000005755 formation reaction Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 238000007756 gravure coating Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- RHZWSUVWRRXEJF-UHFFFAOYSA-N indium tin Chemical compound [In].[Sn] RHZWSUVWRRXEJF-UHFFFAOYSA-N 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/02—Layer formed of wires, e.g. mesh
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/085—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/09—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
- B32B27/322—Layered products comprising a layer of synthetic resin comprising polyolefins comprising halogenated polyolefins, e.g. PTFE
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
- B32B27/325—Layered products comprising a layer of synthetic resin comprising polyolefins comprising polycycloolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
- B32B27/365—Layered products comprising a layer of synthetic resin comprising polyesters comprising polycarbonates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
- B32B9/007—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile comprising carbon, e.g. graphite, composite carbon
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B9/045—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/0427—Coating with only one layer of a composition containing a polymer binder
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/044—Forming conductive coatings; Forming coatings having anti-static properties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/046—Forming abrasion-resistant coatings; Forming surface-hardening coatings
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
- C09D133/04—Homopolymers or copolymers of esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
- C09D133/04—Homopolymers or copolymers of esters
- C09D133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0414—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using force sensing means to determine a position
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/02—Forming enclosures or casings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/04—Treatments to modify a piezoelectric or electrostrictive property, e.g. polarisation characteristics, vibration characteristics or mode tuning
- H10N30/045—Treatments to modify a piezoelectric or electrostrictive property, e.g. polarisation characteristics, vibration characteristics or mode tuning by polarising
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/09—Forming piezoelectric or electrostrictive materials
- H10N30/098—Forming organic materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/30—Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/30—Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
- H10N30/302—Sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
- H10N30/857—Macromolecular compositions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/877—Conductive materials
- H10N30/878—Conductive materials the principal material being non-metallic, e.g. oxide or carbon based
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/88—Mounts; Supports; Enclosures; Casings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/88—Mounts; Supports; Enclosures; Casings
- H10N30/883—Additional insulation means preventing electrical, physical or chemical damage, e.g. protective coatings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/106—Carbon fibres, e.g. graphite fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/40—Properties of the layers or laminate having particular optical properties
- B32B2307/412—Transparent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/732—Dimensional properties
- B32B2307/737—Dimensions, e.g. volume or area
- B32B2307/7375—Linear, e.g. length, distance or width
- B32B2307/7376—Thickness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
- B32B2457/208—Touch screens
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2327/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers
- C08J2327/02—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment
- C08J2327/12—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
- C08J2327/16—Homopolymers or copolymers of vinylidene fluoride
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2433/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers
- C08J2433/04—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers esters
- C08J2433/06—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers esters of esters containing only carbon, hydrogen, and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C08J2433/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2433/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers
- C08J2433/04—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers esters
- C08J2433/06—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers esters of esters containing only carbon, hydrogen, and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C08J2433/10—Homopolymers or copolymers of methacrylic acid esters
- C08J2433/12—Homopolymers or copolymers of methyl methacrylate
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04105—Pressure sensors for measuring the pressure or force exerted on the touch surface without providing the touch position
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Medicinal Chemistry (AREA)
- Theoretical Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Ceramic Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- Laminated Bodies (AREA)
- Position Input By Displaying (AREA)
- Piezo-Electric Transducers For Audible Bands (AREA)
Abstract
提供一种能够充分表现压电性和透明性这两方的压电膜。压电膜(10)是重叠氟树脂制的透明压电基材膜(1)以及具有0.20~2.5μm的厚度的透明涂层(2)而构成的,透明涂层(2)遍及与透明压电基材膜(1)重叠的整个区域与透明压电基材膜(1)形成界面。
Description
技术领域
本发明涉及一种压电膜、触摸面板及压电膜的制造方法。
背景技术
压电膜根据压力来产生电并且能够根据构成确定施加了压力的位置,因此能用于触摸面板的压敏传感器。
对于这样的压电膜,已知含有偏氟乙烯-四氟乙烯共聚物的片状透明压电体层(例如,参照专利文献1)。
此外,已知上述的压电膜通过对以偏氟乙烯树脂为主要成分的树脂膜进行拉伸和极化处理来制造。已知此时在上述树脂膜与拉伸辊相接的面重叠保护膜,由此在拉伸工序中对上述树脂膜进行拉伸时,保护树脂膜不会由于拉伸辊的粗糙面与树脂膜相接而产生破损(例如,参照专利文献2)。
此外,已知通过将上述压电膜设为在基材膜层叠有具有压电性的涂层的构成,与压电体层为单独的膜的以往的压电膜相比,改善了总透光率和雾度(例如,参照专利文献3)。
现有技术文献
专利文献
专利文献1:日本特开2010-108490号公报
专利文献2:日本特开2019-67908号公报
专利文献3:日本特开2017-215960号公报
发明内容
发明要解决的问题
在触摸面板那样的用途中使用的压电膜优选具有高透明性,对于压电膜要求这样的高透明性。此外,为了将压电膜用作压敏传感器,除了高透明性以外还要求能表现充分的压电特性。
本发明的一个方案的目的在于,提供一种能够表现充分的压电性和充分的透明性这两方的压电膜。
技术方案
为了解决上述问题,本发明的一个方案的压电膜是重叠氟树脂制的透明压电基材膜以及具有0.20~2.5μm的厚度的透明涂层而构成的,所述透明涂层遍及与所述透明压电基材膜重叠的整个区域与所述透明压电基材膜形成界面。
为了解决上述问题,本发明的一个方案的触摸面板具有上述的压电膜。
为了解决上述问题,本发明的一个方案的压电膜的制造方法包括下述工序:在氟树脂制的透明压电基材膜的至少一个面上形成具有0.20~2.5μm的厚度的透明涂层,形成所述透明涂层的工序包括下述工序:将所述透明涂层制作用的涂料涂布于所述透明压电基材膜的至少一个面;以及将在所述涂布的工序中形成的涂膜固化。
有益效果
根据本发明的一个方案,能提供一种能够表现充分的压电性和充分的透明性这两方的压电膜。
附图说明
图1是示意性地表示本发明的一个实施方式的压电膜的层构成的图。
图2是示意性地表示本发明的其他实施方式的压电膜的层构成的图。
图3是示意性地表示本发明的一个实施方式的触摸面板的层构成的图。
具体实施方式
〔构成〕
本发明的一个实施方式的透明压电层叠膜(以下,称为“压电膜”)是重叠透明压电膜(以下,称为“透明压电基材膜”)以及具有0.20~2.5μm的厚度的透明涂层而构成的。需要说明的是,在本实施方式中,“~”表示包括两端数值的范围。
[透明压电基材膜]
本实施方式的透明压电基材膜为氟树脂制。在本实施方式中,“氟树脂制”是指在构成透明压电基材膜的组合物中氟树脂为主要成分,“氟树脂为主要成分”是指在该组合物中氟树脂为树脂成分中最多的成分。该组合物中的氟树脂的含量可以为51质量%以上,可以为80质量%以上,可以为100质量%。
此外,“压电基材膜”是指未被提供透明涂层的具有压电性的基材膜。此外,在本实施方式中,“透明”是指,以与压电膜的用途对应的期望的比例以上的程度透过可见光线的光学特性。
本实施方式的氟树脂可以是任何能够用于压电膜的氟树脂,任选地为一种或一种以上。在该氟树脂的例子中包括偏氟乙烯树脂、四氟乙烯树脂以及它们的混合物。
在偏氟乙烯树脂的例子中包括偏氟乙烯的均聚物和偏氟乙烯的共聚物。源自偏氟乙烯的共聚物中的偏氟乙烯以外的单体的结构单元的含量可以在能够表现与压电膜的用途对应的特性的范围内适当地决定。
在偏氟乙烯的共聚物中的偏氟乙烯以外的单体的例子中包括烃系单体和氟化合物。在该烃系单体的例子中包括乙烯和丙烯。该氟化合物是偏氟乙烯以外的氟化合物,是具有聚合性的结构的氟化合物。在该氟化合物的例子中包括:氟乙烯、三氟乙烯、三氟氯乙烯、四氟乙烯、六氟丙烯以及氟烷基乙烯基醚。
在四氟乙烯树脂的例子中包括四氟乙烯的均聚物和四氟乙烯的共聚物。在构成该共聚物的结构单元的四氟乙烯以外的单体的例子中包括:乙烯、氟丙烯、氟烷基乙烯基醚、全氟烷基乙烯基醚以及全氟间二氧杂环戊烯。
在本实施方式的氟树脂为共聚物的情况下,源自该氟树脂中的偏氟乙烯的结构单元的含量可以在能得到本实施方式的效果的范围内适当地决定,从该观点考虑,优选为20质量%以上,更优选为40质量%以上,进一步优选为60质量%以上。
本实施方式的透明压电基材膜也可以在能得到本实施方式的效果的范围内包含各种添加剂。该添加剂任选地为一种或一种以上,在其例子中包括:增塑剂、润滑剂、交联剂、紫外线吸收剂、pH调整剂、稳定剂、抗氧化剂、表面活性剂以及颜料。
本实施方式的透明压电基材膜的厚度可以根据压电膜的用途,从能得到本实施方式的效果的范围内适当地决定。若透明压电基材膜的厚度过薄,则有时机械强度不充分,若透明压电基材膜的厚度过厚,则有时效果达到极限,或者透明性不充分,而难以在光学用途中使用。
从充分表现压电性和机械强度的观点考虑,透明压电基材膜的厚度优选为5μm以上,更优选为20μm以上,进一步优选为30μm以上。此外,从充分表现透明性和压电性的观点考虑,透明压电基材膜的厚度优选为100μm以下,更优选为80μm以下,进一步优选为60μm以下。
本实施方式的透明压电基材膜的压电特性可以根据压电膜的用途,从能得到本实施方式的效果的范围内适当地决定。若压电特性过低,则有时作为压电材料的功能不充分。从表现充分的压电特性的观点考虑,例如在压电膜为触摸面板的情况下,透明压电基材膜的压电特性以压电常数d33计优选为8.0pC/N以上,更优选为10.0pC/N以上,进一步优选为12.0pC/N以上。该压电特性的上限没有限定,但若为上述的情况,从充分得到所期望的效果的观点考虑,透明压电基材膜的压电特性以压电常数d33计为30.0pC/N以下即可。需要说明的是,在本说明书中规定的透明压电基材膜的压电常数d33是指透明压电基材膜的厚度方向的压电常数d33。
透明压电基材膜的压电常数d33能够通过调整该膜的氟树脂的电偶极子的朝向和取向来调整至上述的范围。电偶极子的朝向和取向的调整能够通过调整透明压电基材膜的氟树脂的晶体中的α晶与β晶的比例和极化处理的程度来调整。晶体中的α晶与β晶的比例和极化处理的程度能够分别通过调整氟树脂膜的拉伸和极化(poling)的条件来调整。
本实施方式的透明压电基材膜例如如实施例所述能够通过氟树脂片的拉伸和极化处理来制造。在该制造中,从提高透明压电基材膜的透明性的观点考虑,以成为上述厚度的方式充分地减薄是优选的。此外,在该制造中进行辊拉伸的情况下,从防止透明压电基材膜的表面的破损,提高透明压电基材膜的透明性的观点考虑,使用经镜面加工的辊,或者使用保护膜(例如参照日本特开2019-67908号公报)是优选的。
[透明涂层]
本实施方式的透明涂层只要是透明且在压电膜中能充分表现透明压电基材膜的压电特性的层即可。
透明涂层可以仅配置于透明压电基材膜的一个表面侧,也可以配置于两面侧。其中,从能得到更高的雾度降低效果的方面考虑,透明涂层优选配置于透明压电基材膜的两面。在将透明涂层形成于透明压电基材膜的两面的情况下,两个透明涂层可以具有相同的组成、厚度以及物性,也可以具有不同的组成、厚度以及物性。在将透明涂层形成于透明压电基材膜的两面的情况下,优选至少一方的透明涂层具有后述透明涂层的优选的构成,更优选两方的透明涂层具有后述透明涂层的优选的构成。
透明涂层遍及与透明压电基材膜重叠的整个区域与上述透明压电基材膜形成界面。透明涂层相对于透明压电基材膜在厚度方向上的这样的配置从降低透明压电基材膜的雾度的观点考虑,是优选的。“形成界面”是指,两个物体不在中间隔着其他物体而直接相接。就是说,透明涂层与透明压电基材膜形成界面是指,透明涂层不在中间隔着例如空气等其他物体而与透明压电基材膜直接相接的状态。若为透明压电基材膜在表面具有微细的凹凸的情况,则是指透明涂层以随形于透明压电基材膜的表面形状的方式与透明压电基材膜相接的状态。
在本实施方式的压电膜中,透明涂层遍及与透明压电基材膜重叠的整个区域与透明涂层形成界面。“与透明压电基材膜重叠的区域”可以是根据压电膜的用途而需要透明压电基材膜与透明涂层重合的区域。当然,透明涂层与透明压电基材膜可以在整个平面方向上完全重合。
在压电膜的厚度方向上透明涂层与透明压电基材膜形成界面的方案例如也可以是由透明涂层涂敷透明压电基材膜的表面的方案。
若本实施方式的透明涂层过薄,则有时透明涂层无法充分地覆盖透明压电基材膜的表面的微细的凹凸形状,无法充分得到降低透明压电基材膜的雾度的效果。此外,若透明涂层过厚,则有时压电膜的压电性不充分。因此,从降低透明压电基材膜的雾度的观点考虑,透明涂层的厚度优选为0.20μm以上,更优选为0.35μm以上,进一步优选为0.50μm以上。此外,从充分地反映透明压电基材膜的压电特性,得到能充分地表现透明压电基材膜的压电特性的压电膜的观点考虑,透明涂层的厚度优选为3.5μm以下,更优选为2.5μm以下,进一步优选为1.5μm以下。通过使透明涂层的厚度为上述范围,在压电膜中,能够兼顾与用途对应的充分的压电性和透明性。
需要说明的是,在本实施方式中,透明涂层的厚度是指一个透明涂层的厚度。在透明涂层配置于透明压电基材膜的两面的情况下,透明涂层的厚度只要是能充分地反映透明涂层对该压电膜的影响的值即可。例如,可以是所存在的两个透明涂层中,更厚的一方的透明涂层的厚度,也可以是两方的厚度的平均值。此外,在将透明涂层形成于两面的情况下,各自的透明涂层独立地具有上述范围的厚度即可,可以具有实质上相同的厚度,也可以具有实质上不同的厚度。
从提高透明性的观点考虑,本实施方式的透明涂层的表面优选是平滑的。透明涂层的表面是指透明涂层中的与透明压电基材膜不相接一侧的面。此外,在重叠多个透明涂层的情况下,透明涂层的表面是指,最外层的透明涂层中的与其他透明涂层不相接一侧的面。在透明涂层配置于透明压电基材膜的两面的情况下,优选所存在的两个透明涂层的表面这两方是平滑的。
从这样的观点考虑,就透明压电基材膜的表面形状而言,表面粗糙度的最大高度Rz优选为0.15μm以下,更优选为0.10μm以下,进一步优选为0.080μm以下。该表面形状可以通过能够测定树脂膜的表面形状的公知的技术来进行测定,或者可以通过能够根据层叠膜的剖面来测定特定的层的表面形状的公知的技术来进行测定。
透明涂层可以是也称为所谓的硬涂层,用于防止破损的透明的表面保护层。透明涂层的材料可以在透明且能够充分表现透明压电基材膜的压电特性的范围内,选自能够用于压电膜的所有材料中。该材料任选地为无机材料或有机材料,任选地为一种或一种以上。此外,该涂层的材料也可以是硬涂层的材料。在该材料的例子中包括:三聚氰胺树脂、氨基甲酸酯树脂、醇酸树脂、丙烯酸树脂以及硅酮树脂。即透明涂层可以是选自由三聚氰胺树脂、氨基甲酸酯树脂、醇酸树脂、丙烯酸树脂以及硅酮树脂构成的组中的一种以上的树脂制。在将透明涂层形成于透明压电基材膜的两面的情况下,两个透明涂层可以具有相同的组成,也可以具有不同的组成。
从充分的透明性以及材料的种类的丰富性和原料价格低廉的观点考虑,透明涂层的材料为丙烯酸树脂,即透明涂层为丙烯酸树脂制是优选的。此外,丙烯酸树脂是紫外线固化型的树脂,因此从防止形成透明涂层时的透明压电基材膜的热变形的观点考虑,也是优选的。
丙烯酸树脂是指以丙烯酸树脂为主要成分的树脂组合物。丙烯酸树脂可以是(甲基)丙烯酸酯树脂。需要说明的是,“(甲基)丙烯酸”是丙烯酸和甲基丙烯酸的总称,是指它们中的一方或两方。
在(甲基)丙烯酸酯树脂的例子中包括:(甲基)丙烯酸酯单体的均聚物和(甲基)丙烯酸酯单体与其他单体的共聚物。在(甲基)丙烯酸酯单体的例子中包括:单官能型(甲基)丙烯酸酯单体和多官能型(甲基)丙烯酸酯单体。在其他单体的例子中包括:氨基甲酸酯(甲基)丙烯酸酯单体、环氧(甲基)丙烯酸酯单体、以及聚酯(甲基)丙烯酸酯。
需要说明的是,在透明涂层的材料的树脂的说明中“作为主要成分”是指,作为主要成分的树脂是树脂成分中最多的成分。该组合物中的作为主要成分的树脂的含量可以为51质量%以上,可以为80质量%以上,可以为100质量%。
透明涂层可以在表现本实施方式的效果的范围内具有各种功能。透明涂层的材料也可以还包含用于表现任意的功能的材料作为其他成分。这样的材料任选地为一种或一种以上,在其例子中包括:用于控制透明涂层的折射率的光学调整剂、抗静电剂以及抗粘连材料(antiblocking agent)。在光学调整剂的例子中包括:中空二氧化硅系微粒、硅烷偶联剂、氧化硅、氧化铝、氧化钛、氧化锆、氧化锌以及氧化锡。在抗静电剂的例子中包括:表面活性剂、五氧化锑、ITO(Indium tin oxide:氧化铟锡)以及导电性高分子。在透明涂层形成于透明压电基材膜的两面的情况下,可以仅在这些透明涂层的一方中包含所述其他成分,也可以在两方中包含所述其他成分。
在本实施方式中,从防止压电膜的粘连的观点考虑,抗粘连材料是优选的。该抗粘连材料能够从可以充分表现透明涂层的透明性的范围中适当地选择。例如,抗粘连材料的折射率优选与成为透明涂层的材料的树脂的折射率之差小。在抗粘连材料的例子中包括:凝聚二氧化硅、球状二氧化硅、聚甲基丙烯酸甲酯(PMMA)珠、硅酮珠等无机或有机微粒。其中,球状二氧化硅除了抗粘连性和透明性以外价格也低,因此作为透明涂层用的抗粘连材料是特别优选的。从防止压电膜的粘连的观点考虑,在透明涂层形成于透明压电基材膜的两面的情况下,仅在这些透明涂层的一方中包含抗粘连材料即可,但也可以在两方中包含抗粘连材料。
[其他层构成]
本实施方式的压电膜可以在表现本实施方式的效果的范围内,还具有上述以外的其他构成。这样的其他构成任选地为一种或一种以上,在其例子中包括:用于使压电膜贴合于盖板玻璃、透明电极的透明粘合剂层、与透明粘合剂层抵接并且可剥离的脱模层、光学调整层(折射率匹配层)、以及导电层。该光学调整层可以在表现所期望的性能的范围内,使用上述透明涂层的材料来形成。
需要说明的是,构成压电膜的各层的厚度可以通过下述方法测定:将压电膜包埋于环氧树脂,以压电膜的剖面露出的方式剖切环氧树脂块,利用扫描型电子显微镜观察该剖面。该层的厚度为该层的厚度的代表值即可,可以是任意的多个测定值的平均值,可以是该测定值的最大值,可以是该测定值的最小值。
〔物性〕
从实现充分的透光性的观点考虑,本实施方式的压电膜优选充分透明。例如,压电膜的总透光率可以根据该压电膜的用途适当地决定。若为触摸面板的压敏传感器的用途,则压电膜的总透光率优选为80%以上,从应用于在触摸面板中配置在比显示器靠表面侧的压敏传感器的观点考虑,压电膜的总透光率更优选为83%以上。该总透光率的上限没有限定,但若为上述的情况,从充分得到所期望的效果的观点考虑,总透光率为97%以下即可。总透光率是用于透明体的指标的参数,可以说总透光率越接近100%越透明。总透光率例如可以使用雾度计,基于JIS K7361-1所述的公知的方法来进行测定。
此外,压电膜的雾度值也与总透光率同样,可以根据该压电膜的用途适当地决定。若为触摸面板的压敏传感器的用途,则压电膜的雾度值优选为2.0%以下,从应用于在触摸面板中配置在比显示器靠表面侧的压敏传感器的观点考虑,压电膜的雾度值更优选为1.0%以下。该雾度值的下限没有限定,但若为上述的情况,从充分得到所期望的效果的观点考虑,雾度值为0.1%以上即可。雾度是浑浊的程度,压电膜的雾度值表示压电膜本身的透明程度。随着浑浊情况增大,雾度值变大,若雾度值为0,则判断为完全的透明体。雾度值例如可以使用雾度计,基于JIS K7136所述的公知的方法来进行测定。需要说明的是,只要能得到压电膜的期望的总透光率和雾度值,透明压电基材膜的总透光率和雾度值就没有特别限制。
就本实施方式的压电膜而言,从充分表现透明压电基材膜的压电特性的观点考虑,例如,若为触摸面板的压敏传感器的用途,则压电膜的压电常数d33优选为8.0pC/N以上,从应用于在触摸面板中配置在比显示器靠表面侧的压敏传感器的观点考虑,压电膜的压电常数d33更优选为10.0pC/N以上,进一步优选为12.0pC/N以上。该压电常数d33的上限没有限定,但若为上述的情况,则从充分得到所期望的效果的观点考虑,压电膜的压电特性优选以压电常数d33计为30.0pC/N以下即可。需要说明的是,在本说明书中规定的压电膜的压电常数d33是指压电膜的厚度方向的压电常数d33。
压电常数d33可以通过如后文实施例所述的公知的技术来进行测定。压电膜的压电特性可以通过压电膜中的透明涂层的厚度或者具有期望的压电性的透明压电基材膜的使用来进行调整。可以通过将压电膜中的透明涂层的厚度设为上述的范围,来将提供透明涂层而引起的透明压电基材膜的压电常数d33的降低程度抑制得较低。因此,通过使用压电特性以压电常数d33计为8.0pC/N以上且30.0pC/N以下的范围的透明压电基材膜,能将压电膜的压电常数d33设为上述的范围。
〔制法〕
本实施方式的压电膜使用上述膜来形成上述层,除此以外,可以与公知的压电膜同样地制造。
本实施方式的透明涂层可以通过下述工序来制造:将用于形成透明涂层的涂料涂布于透明压电基材膜的至少一个面;以及将在该涂布工序中形成的涂膜固化。涂布该涂料的工序可以通过公知的涂敷方法来实施。在涂敷方法的例子中包括:喷涂、辊涂、模涂、气刀涂布、刮涂、旋涂、反向涂布、凹版涂布以及蒸镀。该涂膜的厚度可以通过涂布次数或涂料的粘度来适当地调整。
固化工序可以通过将上述的涂料的涂膜固化的公知方法来实施。在固化方法的例子中包括:干燥、加热或由光照射实现的聚合时的硬化。其中,从适于在物体的表面的加工的观点和防止各层的热变形的观点考虑,优选紫外线(UV)照射等光照射实现的聚合时的硬化。例如,透明涂层可以通过下述方法来形成:在涂敷上述涂料后,通过加热去除涂料中的溶剂,接着通过UV照射来使涂膜硬化。在通过UV照射来形成透明涂层的情况下,从防止氧引起的固化阻碍的观点考虑,该UV照射优选在惰性气氛下进行。
透明涂层用的上述涂料可以含有聚合物,可以含有单体,也可以含有它们两方。此外,在上述的涂料中,可以是聚合物包含引起固化的交联结构,也可以是,还含有具有多个交联结构的低分子化合物。进而,该涂料也可以根据需要适当地含有用于固化的添加剂,如用于引发该聚合反应的聚合引发剂等。
以下,使用图对本发明的实施方式进行说明。如图1所示,本发明的一个实施方式的压电膜10是直接重叠透明压电基材膜1以及透明涂层2而构成的。
透明压电基材膜1如上所述是氟树脂制,例如可以是通过氟树脂材料的拉伸和极化处理而得到的膜。透明涂层2例如是上述的丙烯酸树脂制,直接重叠于透明压电基材膜1的一个表面上。
此外,如图2所示,本发明的其他实施方式的压电膜20是直接重叠透明压电基材膜1以及透明涂层2而构成的。在压电膜20中,透明涂层2配置于透明压电基材膜1的两面侧。即,在透明压电基材膜1的一个表面上重叠有透明涂层2a,在透明压电基材膜1的另一个表面上重叠有透明涂层2b。
〔触摸面板〕
本发明的一个实施方式的触摸面板具有上述本实施方式的压电膜。该触摸面板中的压电膜的位置和数量可以根据触摸面板的用途或所期望的功能来适当地决定。图3是示意性地表示本发明的实施方式的触摸面板的层构成的一个例子的图。
如图3所示,触摸面板100具有利用透明电极4b和盖板玻璃5夹住图2所示的压电膜20而成的构成。此外,在压电膜20与盖板玻璃5之间,从压电膜20朝向盖板玻璃5依次重叠配置有透明粘合剂层3a、透明基板6a、透明电极4a、透明粘合剂层3c、透明基板6c、透明电极4c、以及透明粘合剂层3d。此外,在压电膜20与透明电极4b之间,从压电膜20朝向透明电极4b配置有透明粘合剂层3b、透明基板6b。如此,触摸面板100是依次重叠透明电极4b、压电膜20、以及盖板玻璃5而构成的。在实用触摸面板100的情况下,可以将触摸面板100的透明电极4b侧的表面重叠配置于显示器30的表面,但不限定于此。
压电膜20与盖板玻璃5隔着透明粘合剂层3c、3d、透明电极4a、4c以及透明基板6a、6c通过透明粘合剂层3a而粘接,压电膜20与透明电极4b隔着透明基板6b通过透明粘合剂层3b而粘接。此外,在透明电极4b的层叠方向上的压电膜20的相反侧可以配置有机EL显示面板或液晶显示面板等显示面板,即显示器30。显示器30可以采用以往公知的显示面板,因此在本说明书中省略其详细的构成的说明。
透明电极4a、4b、4c分别形成于透明基板6a、6b、6c上,可以与透明基板6a、6b、6c一并粘接于触摸面板100中的期望的层,也可以在层叠方向上直接形成于透明电极4a、4b、4c所邻接的其他层的表面,通过透明粘合剂层3a、3b、3c或3d而粘接。
就透明电极4a、4b、4c而言,可以采用能够用于触摸面板的公知的透明电极。更详细而言,透明电极4a、4b、4c为实质上透明的面状的电极即可,可以是具有图案的导电性的薄膜,也可以是由极细的导电性的线材而得到的平面的结构。构成透明电极4a、4b、4c的材料没有限定,优选使用选自由In、Sn、Zn、Ga、Sb、Ti、Si、Zr、Mg、Al、Au、Ag、Cu、Pd、W构成的组中的至少一种金属的金属氧化物。在该金属氧化物中可以根据需要还包含上述组所示的金属原子。在该金属氧化物中,优选使用铟-锡复合氧化物(ITO)、锑-锡复合氧化物(ATO)等,特别优选使用ITO。在透明电极4a、4b、4c的其他代表性材料的例子中包括:银纳米线、银网、铜网、石墨烯以及碳纳米管。就透明基板6a、6b、6c而言,可以采用能够用作支承上述透明电极4a、4b、4c的基底的公知的透明膜。构成透明基板6a、6b、6c的材料没有限定,优选使用聚对苯二甲酸乙二醇酯(PET)、聚碳酸酯(PC)、环烯烃聚合物(COP)。
盖板玻璃5为触摸面板的盖板玻璃。只要是触摸面板用的片状的透光构件即可,可以是如盖板玻璃5那样的玻璃板,也可以是透明树脂片。
本发明的实施方式的触摸面板也可以在能得到本实施方式的效果的范围内,还包含其他构成。
此外,本发明的实施方式的触摸面板只要在层叠结构中包含上述本发明的实施方式的压电膜即可。层叠方向上的该触摸面板中的该压电膜的位置可以在能得到本发明的实施方式的效果的范围内适当地决定。
此外,本发明的实施方式的触摸面板也可以具有在GFF型或GF2型等以往的触摸面板的层叠结构中适当地追加了本实施方式的压电膜而成的构成。在该情况下,在本实施方式的压电膜中,用于检测压力的透明电极层和用于检测位置的位置传感器可以直接层叠,也可以经由粘合剂层而粘接。具有这样的构成的触摸面板除了表现以往的触摸面板的功能以外,还能表现起因于压电膜的功能,例如能够构成在透明的层叠结构中包括位置传感器和压力传感器双方的触摸面板。
需要说明的是,在本实施方式的触摸面板的制造中,透明粘合剂层不仅可以形成于透明涂层上,而且可以形成于隔着透明粘合剂层与透明涂层粘接的其他层之上。在该情况下,透明粘合剂层可以位于透明涂层侧,也可以不位于透明涂层侧。
〔作用效果〕
如上所述,本发明的实施方式的压电膜可以由氟树脂制的透明压电基材膜和透明涂层构成。具有如上所述的构成的压电膜能表现由透明压电基材膜实现的充分的压电特性,除此以外,通过降低透明压电基材膜的雾度,能够表现更高的透明性。
关于透明性,通过在透明压电基材膜设置透明涂层,能得到压电膜的雾度的降低效果,其结果是,压电膜的透明性提高。就降低透明压电基材膜的透明性的原因之一而言,认为是存在透明压电基材膜的表面上的破损等微细的凹凸形状。认为通过使该微细的凹凸形状被透明涂层填充,抑制由该凹凸形状引起的光散射,从而带来压电膜的雾度的降低效果。
该压电膜如上所述表现充分的压电特性和更高的透明性,并且可以仅由树脂等有机层构成,因此能够更进一步减薄具有这样的充分的压电特性和透明性的压敏传感器整体的层厚度。因此,该压电膜能够作为压敏传感器配置在比上述的显示面板靠表面(图像显示面)侧。因此,能够使触摸面板的层构成比以往更简化,或者减薄触摸面板整体的层厚度,此外,能够提高触摸面板中的压电膜的配置数量和配置部位的自由度。
〔总结〕
由以上的说明明显可知,本发明的实施方式的压电膜是重叠氟树脂制的透明压电基材膜以及具有0.20~2.5μm的厚度的透明涂层而构成的,所述透明涂层遍及与所述透明压电基材膜重叠的整个区域与所述透明压电基材膜形成界面。此外,本发明的实施方式的触摸面板具有该压电膜。因此,该压电膜能兼顾充分的压电性和充分的透明性。
在本发明的实施方式中,压电膜的雾度为2.0%以下,可以说该压电膜从触摸面板的压敏传感器的用途来看具有充分的透明性,因此优选。
此外,在本发明的实施方式中,压电常数d33为8.0~30.0pC/N,可以说该压电膜从触摸面板的压敏传感器的用途来看具有充分的压电特性,因此优选。
在本发明的实施方式中,压电膜的总透光率为80%以上,可以说该压电膜从触摸面板的压敏传感器的用途来看具有充分的透明性,因此优选。
在本发明的实施方式中,从降低透明压电基材膜的雾度,实现压电膜的充分的透明性的观点考虑,透明涂层的表面的表面粗糙度的最大高度Rz为0.10μm以下是更进一步有效的。
在本发明的实施方式中,从实现透明压电基材膜的充分的压电性和充分的透明性这两方的表现的观点考虑,透明压电基材膜的厚度为20~100μm是更进一步有效的。
在本发明的实施方式中,从降低透明压电基材膜的雾度,实现压电膜的充分的透明性的观点考虑,在透明压电基材膜的两面层叠有所述透明涂层是更进一步有效的。
本发明的实施方式的压电膜的制造方法包括下述工序:在氟树脂制的透明压电基材膜的至少一个面上形成具有0.20~2.5μm的厚度的透明涂层,形成透明涂层的工序包括下述工序:将透明涂层制作用的涂料涂布于透明压电基材膜的至少一个面;以及将在涂布工序中形成的涂膜固化。因此,能制造能够表现充分的压电性和充分的透明性这两方的压电膜。
本发明不限定于上述的各实施方式,可以在说明书所示的范围内进行各种变更。将不同的实施方式中分别公开的技术手段适当组合而得到的实施方式也包括在本发明的技术的范围内。
实施例
〔实施例1〕
使由比浓对数粘度为1.1dl/g的聚偏氟乙烯(株式会社Kureha制)成型而成的树脂膜(厚度,140μm)穿过加热至表面温度110℃的预热辊。接着,使穿过预热辊的膜穿过加热至表面温度120℃的拉伸辊,以拉伸倍率为4.2倍的方式进行拉伸。拉伸后,使膜穿过极化辊而进行极化处理,得到了具有压电性的膜。使直流电压从0kV增加至11.8kV。通过进一步在130℃下对极化处理后的膜进行1分钟热处理,得到了厚度为40μm的透明压电基材膜。
在透明压电基材膜的单面用刮棒涂布机涂布硬涂剂(“BS CH271”,荒川化学工业株式会社制)并在80℃下干燥2分钟。以下将硬涂剂“BS CH271”称为“HC剂(1)”。
接着,对硬涂剂干燥而成的涂膜,使用UV照射装置CSOT-40(株式会社GS YUASA制),以400mJ/cm2的累积光量照射UV。如此,得到了单面具有透明涂层A的压电膜,所述透明涂层A具有后述表所述的厚度。通过在透明压电基材膜的相反侧的面进行同样的操作,形成具有后述表所述的厚度的透明涂层B,得到了透明压电基材膜的两面具有透明涂层的压电膜。
〔实施例2~4〕
以具有后述表所述的厚度的方式形成透明涂层,除此以外,与实施例1同样地分别得到了透明涂层的厚度不同的压电膜。
〔实施例5〕
将聚偏氟乙烯树脂膜的极化处理中的直流电压变更为12.0kV,将硬涂剂变更为“TYAB-M101”(TOYOCHEM株式会社制),并且以具有后述表所述的厚度的方式形成透明涂层,除此以外,与实施例1同样地得到了压电膜。以下,将硬涂剂“TYAB-M101”称为“HC剂(2)”。
〔实施例6〕
以具有后述表所述的厚度的方式仅在单面形成透明涂层,除此以外,与实施例5同样地得到了透明涂层的厚度不同的压电膜。
〔实施例7〕
将透明涂层B用的硬涂剂变更为“BS-575CB”(荒川化学工业株式会社制),并且以具有后述表所述的厚度的方式形成透明涂层,除此以外,与实施例1同样地得到了压电膜。以下,将硬涂剂“BS-575CB”称为“HC剂(3)”。
〔实施例8〕
以具有后述表所述的厚度的方式形成透明涂层,除此以外,与实施例7同样地得到了透明涂层的厚度不同的压电膜。
〔实施例9〕
将聚偏氟乙烯树脂膜的极化处理中的直流电压变更为11.0kV,并且以具有后述表所述的厚度的方式形成透明涂层,除此以外,与实施例1同样地得到了压电膜。
〔比较例1〕
将在实施例1中得到的透明压电基材膜制成作为比较例的压电膜。
〔比较例2〕
以具有后述表所述的厚度的方式形成透明涂层,除此以外,与实施例9同样地得到了作为比较例的压电膜。
〔比较例3〕
以具有后述表所述的厚度的方式形成透明涂层,除此以外,与实施例5同样地得到了作为比较例的压电膜。
〔评价〕
[透明涂层的厚度]
分别将上述实施例以及比较例2和3的压电膜包埋于环氧树脂,以压电膜的剖面露出的方式剖切环氧树脂块。使用扫描型电子显微镜(“SU3800”,株式会社Hitachi HighTech制)在加速电压3.0kV、倍率50000倍的条件下对露出的压电膜的剖面进行观察,对压电膜中的透明涂层的厚度进行了测定。
需要说明的是,在透明涂层的厚度的测定中,对该透明涂层中的两处的厚度进行测定,将其平均值设为了透明涂层的厚度。需要说明的是,在上述的观察条件下,透明涂层的界面视为基本光滑的线,在透明涂层的厚度的测定中,测定出该线间的距离。
[总透光率]
使用雾度计(“NDH7700SP II”,日本电色工业株式会社制),基于JIS K7361-1所述的方法,对实施例和比较例的压电膜的各自的总透光率进行了测定。若总透光率为80%以上,则可以判断为在触摸面板的用途中在实用上无问题。
[雾度值]
使用雾度计(“NDH7700SP II”,日本电色工业株式会社制),基于JIS K7136所述的方法,对实施例和比较例的压电膜的各自的雾度值进行了测定。若雾度值为2.0%以下,则可以判断为在触摸面板的用途中在实用上无问题。
[L*值、a*值、b*值]
使用分光色彩计(“SE7700”,日本电色工业株式会社制),通过依据JIS K8722的方法对实施例和比较例的压电膜的各自的L*a*b*表色系中的L*值、a*值以及b*值进行了测定。若L*值为85以上,则可以判断为在触摸面板的用途中在实用上无问题。若a*值为3以下,则可以判断为在触摸面板的用途中在实用上无问题。若b*值为4以下,则可以判断为在触摸面板的用途中在实用上无问题。
[压电常数d33值]
对于实施例和比较例的压电膜各自的压电常数d33,使用压电常数测定装置(“PiezoMeter System PM300”,PIEZOTEST社制),以0.2N夹持样品,读取施加了0.15N、110Hz的力时的产生电荷。压电常数d33的实测值根据所测定的膜的表背侧而成为正值或负值,但在本说明书中记载了绝对值。若压电常数d33值为8.0pC/N以上,则可以判断为在触摸面板的用途中在实用上无问题。
[表面粗糙度Ra]
使用表面粗糙度测定器(“SURFCOM1500”,株式会社东京精密制),通过依据JIS B0601-2013的方法对实施例和比较例的压电膜的各自的透明涂层的表面的算术平均粗糙度(表面粗糙度)Ra进行了测定。需要说明的是,在一个透明涂层中的任意的十处,在压电膜的宽度方向(TD方向)上测定算术平均粗糙度(表面粗糙度)Ra,求出测定值的平均值,将其设为了该透明涂层的Ra。需要说明的是,在比较例1中,对透明压电基材膜的表面的Ra进行了测定。此外,在实施例7和8中,对由HC剂(3)形成的透明涂层的Ra进行了测定。
[最大高度Rz]
与表面粗糙度Ra同样地,使用表面粗糙度测定器(“SURFCOM1500”,株式会社东京精密制),通过依据JIS B 0601-2013的方法对实施例和比较例的压电膜的各自的透明涂层的表面的最大高度Rz进行了测定。最大高度Rz也与算术平均粗糙度(表面粗糙度)Ra同样地,在一个透明涂层中的任意的十处,在压电膜的宽度方向(TD方向)上测定最大高度Rz,求出测定值的平均值,将其设为了该透明涂层的Rz。需要说明的是,在比较例1中,对透明压电基材膜的表面的Rz进行了测定。此外,在实施例7和8中,对由HC剂(3)形成的透明涂层的Rz进行了测定。
〔考察〕
实施例1~9的压电膜均具有充分的透明性和充分的压电性这两方。关于透明性,认为原因在于,在透明压电基材膜的表面形成的凹凸被透明涂层填充,且形成充分平滑的表面,其结果是,雾度更进一步降低。此外,关于压电性,认为原因在于,透明涂层充分薄,因此充分维持透明压电基材膜的厚度方向上的变形性。
与此相对,比较例1的压电膜与实施例1~9的压电膜相比雾度值高,从透明性的观点考虑是不充分的。认为其原因在于,由透明压电基材膜的表面形状引起的光的散射造成影响。
此外,比较例2和3的压电膜与实施例1~9的压电膜相比,从压电性的观点考虑均是不充分的。认为其原因在于,透明涂层过厚而进一步限制了透明压电基材膜的厚度方向上的变形性。
工业上的可利用性
本发明可以用于触摸面板。
附图标记说明
1:透明压电基材膜;
2、2a、2b:透明涂层;
3a、3b、3c、3d:透明粘合剂层;
4a、4b、4c:透明电极;
5:盖板玻璃;
6a、6b、6c:透明基板;
10、20:压电膜;
30:显示器;
100:触摸面板。
Claims (9)
1.一种压电膜,
其是重叠氟树脂制的透明压电基材膜以及具有0.20~2.5μm的厚度的透明涂层而构成的,
所述透明涂层遍及与所述透明压电基材膜重叠的整个区域与所述透明压电基材膜形成界面。
2.根据权利要求1所述的压电膜,其中,
雾度为2.0%以下。
3.根据权利要求1或2所述的压电膜,其中,
压电常数d33为8.0~30.0pC/N。
4.根据权利要求1~3中任一项所述的压电膜,其中,
总透光率为80%以上。
5.根据权利要求1~4中任一项所述的压电膜,其中,
所述透明涂层的表面的表面粗糙度的最大高度Rz为0.10μm以下。
6.根据权利要求1~5中任一项所述的压电膜,其中,
所述透明压电基材膜的厚度为20~100μm。
7.根据权利要求1~6中任一项所述的压电膜,其中,
在所述透明压电基材膜的两面层叠有所述透明涂层。
8.一种触摸面板,
其具有如权利要求1~7中任一项所述的压电膜。
9.一种压电膜的制造方法,其包括下述工序:
在氟树脂制的透明压电基材膜的至少一个面上形成具有0.20~2.5μm的厚度的透明涂层,
其中,形成所述透明涂层的工序包括下述工序:
将所述透明涂层制作用的涂料涂布于所述透明压电基材膜的至少一个面;以及
将在所述涂布的工序中形成的涂膜固化。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020183103 | 2020-10-30 | ||
JP2020-183103 | 2020-10-30 | ||
PCT/JP2021/038367 WO2022091828A1 (ja) | 2020-10-30 | 2021-10-18 | 圧電フィルム、タッチパネル、および圧電フィルムの製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN116234701A true CN116234701A (zh) | 2023-06-06 |
Family
ID=81382518
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202180067153.6A Pending CN116234701A (zh) | 2020-10-30 | 2021-10-18 | 压电膜、触摸面板及压电膜的制造方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20230397500A1 (zh) |
EP (1) | EP4238763A4 (zh) |
JP (1) | JP7426502B2 (zh) |
KR (1) | KR20230074765A (zh) |
CN (1) | CN116234701A (zh) |
TW (1) | TWI820504B (zh) |
WO (1) | WO2022091828A1 (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114883476A (zh) * | 2022-05-12 | 2022-08-09 | 业泓科技(成都)有限公司 | 压电元件附着性的改善方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5060058B2 (ja) * | 2006-03-08 | 2012-10-31 | 共同技研化学株式会社 | 情報表示面の保護シート及び保護シートの製造方法 |
JP2010108490A (ja) | 2008-10-03 | 2010-05-13 | Daikin Ind Ltd | タッチパネルおよび透明圧電シート |
JP2010211482A (ja) * | 2009-03-10 | 2010-09-24 | Touch Panel Kenkyusho:Kk | 三次元入力タッチパネル機器 |
WO2015053346A1 (ja) * | 2013-10-08 | 2015-04-16 | ダイキン工業株式会社 | 圧電フィルム |
KR20160088893A (ko) * | 2013-11-21 | 2016-07-26 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 다층 압전 중합체 필름 디바이스 및 방법 |
WO2016027587A1 (ja) * | 2014-08-22 | 2016-02-25 | 三井化学株式会社 | 高分子圧電フィルム |
JP6258249B2 (ja) * | 2015-04-02 | 2018-01-10 | 株式会社ダイセル | 透明積層フィルム |
JP6879826B2 (ja) | 2016-05-30 | 2021-06-02 | 日東電工株式会社 | タッチセンサ |
JP2017216450A (ja) * | 2016-05-30 | 2017-12-07 | 日東電工株式会社 | 圧電フィルム |
JP2019067908A (ja) | 2017-09-29 | 2019-04-25 | 株式会社クレハ | 圧電フィルムおよびフィルムの製造方法 |
CN207516966U (zh) * | 2017-10-10 | 2018-06-19 | 成都安瑞芯科技有限公司 | 显示模组和电子设备 |
-
2021
- 2021-10-18 WO PCT/JP2021/038367 patent/WO2022091828A1/ja unknown
- 2021-10-18 KR KR1020237013770A patent/KR20230074765A/ko active Search and Examination
- 2021-10-18 EP EP21885947.8A patent/EP4238763A4/en active Pending
- 2021-10-18 US US18/250,474 patent/US20230397500A1/en active Pending
- 2021-10-18 CN CN202180067153.6A patent/CN116234701A/zh active Pending
- 2021-10-18 JP JP2022559018A patent/JP7426502B2/ja active Active
- 2021-10-29 TW TW110140255A patent/TWI820504B/zh active
Also Published As
Publication number | Publication date |
---|---|
WO2022091828A1 (ja) | 2022-05-05 |
EP4238763A1 (en) | 2023-09-06 |
TWI820504B (zh) | 2023-11-01 |
TW202218199A (zh) | 2022-05-01 |
JPWO2022091828A1 (zh) | 2022-05-05 |
KR20230074765A (ko) | 2023-05-31 |
EP4238763A4 (en) | 2024-04-10 |
JP7426502B2 (ja) | 2024-02-01 |
US20230397500A1 (en) | 2023-12-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR101137276B1 (ko) | 투명 도전성 적층체 및 터치 패널 | |
KR101629060B1 (ko) | 투명 도전성 필름, 그 제조 방법 및 그것을 구비한 터치 패널 | |
JP5847562B2 (ja) | 透明導電性フィルムおよびタッチパネル | |
WO2014010270A1 (ja) | 導電積層体、パターン化導電積層体、その製造方法、および、それらを用いてなるタッチパネル | |
KR20170086611A (ko) | 투명 도전성 필름 및 그것을 사용한 터치 센서 | |
JP6879826B2 (ja) | タッチセンサ | |
KR20190013777A (ko) | 투명 전극 형성 압전 필름 및 압력 센서 | |
KR20130024965A (ko) | 적층 필름의 제조 방법 | |
KR20200089257A (ko) | 압전 필름 및 압전 센서 | |
JP7434598B2 (ja) | 透明導電圧電フィルムおよびタッチパネル | |
KR20190015188A (ko) | 압전 필름 | |
CN116234701A (zh) | 压电膜、触摸面板及压电膜的制造方法 | |
JP6458445B2 (ja) | 透明導電性積層体、及び該透明導電性積層体を用いたタッチパネル、並びに、透明導電性積層体の製造方法、及び該透明導電性積層体を用いたタッチパネルの製造方法 | |
JP5498537B2 (ja) | 透明導電性フィルム、その製造方法及びそれを備えたタッチパネル | |
JP7434597B2 (ja) | 透明圧電積層フィルムおよびタッチパネル | |
TWI808671B (zh) | 導電性壓電積層膜及製造方法 | |
CN118044357A (zh) | 透明导电压电膜、触摸面板以及透明导电压电膜的制造方法 | |
CN117999869A (zh) | 透明导电压电膜、器件以及透明导电压电膜的制造方法 | |
WO2023219090A1 (ja) | 積層圧電フィルム、デバイス、及び積層圧電フィルムの製造方法 | |
CN110600164B (zh) | 硬涂薄膜及透明导电性薄膜 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination |