KR20240128105A - 경화성 수지 조성물 - Google Patents

경화성 수지 조성물 Download PDF

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Publication number
KR20240128105A
KR20240128105A KR1020247026645A KR20247026645A KR20240128105A KR 20240128105 A KR20240128105 A KR 20240128105A KR 1020247026645 A KR1020247026645 A KR 1020247026645A KR 20247026645 A KR20247026645 A KR 20247026645A KR 20240128105 A KR20240128105 A KR 20240128105A
Authority
KR
South Korea
Prior art keywords
epoxy resin
resin composition
curable resin
functional group
epoxy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020247026645A
Other languages
English (en)
Korean (ko)
Inventor
토모타카 노구치
야스요 카나자와
치카 타카하시
Original Assignee
다이요 홀딩스 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 다이요 홀딩스 가부시키가이샤 filed Critical 다이요 홀딩스 가부시키가이샤
Publication of KR20240128105A publication Critical patent/KR20240128105A/ko
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020247026645A 2022-01-07 2022-12-28 경화성 수지 조성물 Pending KR20240128105A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022001919 2022-01-07
JPJP-P-2022-001919 2022-01-07
PCT/JP2022/048510 WO2023132317A1 (ja) 2022-01-07 2022-12-28 硬化性樹脂組成物

Publications (1)

Publication Number Publication Date
KR20240128105A true KR20240128105A (ko) 2024-08-23

Family

ID=87073691

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247026645A Pending KR20240128105A (ko) 2022-01-07 2022-12-28 경화성 수지 조성물

Country Status (5)

Country Link
JP (1) JPWO2023132317A1 (https=)
KR (1) KR20240128105A (https=)
CN (1) CN118715262A (https=)
TW (1) TW202342636A (https=)
WO (1) WO2023132317A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009269994A (ja) 2008-05-07 2009-11-19 Taiyo Ink Mfg Ltd プリント配線板の穴埋め用熱硬化性樹脂組成物及びそれを用いたプリント配線板

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4097798B2 (ja) * 1998-08-25 2008-06-11 住友ベークライト株式会社 一液型液状エポキシ樹脂組成物
JP5741742B2 (ja) * 2013-05-27 2015-07-01 Dic株式会社 硬化性樹脂組成物、その硬化物および熱伝導性接着剤
JP2017071656A (ja) * 2014-02-04 2017-04-13 タツタ電線株式会社 スルーホール充填用ペースト組成物、及びそれらを用いたプリント配線板
US10577472B2 (en) * 2018-02-01 2020-03-03 Hexcel Corporation Thermoplastic particle-toughened prepreg for use in making composite parts which tolerate hot and wet conditions
JP6787279B2 (ja) * 2017-08-24 2020-11-18 味の素株式会社 樹脂組成物
JP7069613B2 (ja) * 2017-09-19 2022-05-18 三菱ケミカル株式会社 エポキシ樹脂、エポキシ樹脂組成物、硬化物、及び電気・電子回路用積層板
CN111247207B (zh) * 2017-10-18 2022-11-08 三键有限公司 导热性树脂组合物、固化物以及散热方法
CN112752816B (zh) * 2018-07-25 2022-10-18 汉高股份有限及两合公司 快速固化的环氧丙烯酸类液体垫片
US11767397B2 (en) * 2018-10-17 2023-09-26 Toyobo Co., Ltd. Thermally conductive resin composition
CN115210318B (zh) * 2020-03-06 2024-03-08 东丽株式会社 环氧树脂组合物、预浸料及纤维增强复合材料

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009269994A (ja) 2008-05-07 2009-11-19 Taiyo Ink Mfg Ltd プリント配線板の穴埋め用熱硬化性樹脂組成物及びそれを用いたプリント配線板

Also Published As

Publication number Publication date
TW202342636A (zh) 2023-11-01
WO2023132317A1 (ja) 2023-07-13
CN118715262A (zh) 2024-09-27
JPWO2023132317A1 (https=) 2023-07-13

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