CN118715262A - 固化性树脂组合物 - Google Patents

固化性树脂组合物 Download PDF

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Publication number
CN118715262A
CN118715262A CN202280092161.0A CN202280092161A CN118715262A CN 118715262 A CN118715262 A CN 118715262A CN 202280092161 A CN202280092161 A CN 202280092161A CN 118715262 A CN118715262 A CN 118715262A
Authority
CN
China
Prior art keywords
resin composition
curable resin
epoxy resin
epoxy resins
epoxy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280092161.0A
Other languages
English (en)
Chinese (zh)
Inventor
野口智崇
金沢康代
高桥千夏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Holdings Co Ltd
Original Assignee
Taiyo Holdings Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Holdings Co Ltd filed Critical Taiyo Holdings Co Ltd
Publication of CN118715262A publication Critical patent/CN118715262A/zh
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN202280092161.0A 2022-01-07 2022-12-28 固化性树脂组合物 Pending CN118715262A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022001919 2022-01-07
JP2022-001919 2022-01-07
PCT/JP2022/048510 WO2023132317A1 (ja) 2022-01-07 2022-12-28 硬化性樹脂組成物

Publications (1)

Publication Number Publication Date
CN118715262A true CN118715262A (zh) 2024-09-27

Family

ID=87073691

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280092161.0A Pending CN118715262A (zh) 2022-01-07 2022-12-28 固化性树脂组合物

Country Status (5)

Country Link
JP (1) JPWO2023132317A1 (https=)
KR (1) KR20240128105A (https=)
CN (1) CN118715262A (https=)
TW (1) TW202342636A (https=)
WO (1) WO2023132317A1 (https=)

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4097798B2 (ja) * 1998-08-25 2008-06-11 住友ベークライト株式会社 一液型液状エポキシ樹脂組成物
JP5238342B2 (ja) 2008-05-07 2013-07-17 太陽ホールディングス株式会社 プリント配線板の穴埋め用熱硬化性樹脂組成物及びそれを用いたプリント配線板
JP5741742B2 (ja) * 2013-05-27 2015-07-01 Dic株式会社 硬化性樹脂組成物、その硬化物および熱伝導性接着剤
JP2017071656A (ja) * 2014-02-04 2017-04-13 タツタ電線株式会社 スルーホール充填用ペースト組成物、及びそれらを用いたプリント配線板
US10577472B2 (en) * 2018-02-01 2020-03-03 Hexcel Corporation Thermoplastic particle-toughened prepreg for use in making composite parts which tolerate hot and wet conditions
JP6787279B2 (ja) * 2017-08-24 2020-11-18 味の素株式会社 樹脂組成物
JP7069613B2 (ja) * 2017-09-19 2022-05-18 三菱ケミカル株式会社 エポキシ樹脂、エポキシ樹脂組成物、硬化物、及び電気・電子回路用積層板
CN111247207B (zh) * 2017-10-18 2022-11-08 三键有限公司 导热性树脂组合物、固化物以及散热方法
CN112752816B (zh) * 2018-07-25 2022-10-18 汉高股份有限及两合公司 快速固化的环氧丙烯酸类液体垫片
US11767397B2 (en) * 2018-10-17 2023-09-26 Toyobo Co., Ltd. Thermally conductive resin composition
CN115210318B (zh) * 2020-03-06 2024-03-08 东丽株式会社 环氧树脂组合物、预浸料及纤维增强复合材料

Also Published As

Publication number Publication date
KR20240128105A (ko) 2024-08-23
TW202342636A (zh) 2023-11-01
WO2023132317A1 (ja) 2023-07-13
JPWO2023132317A1 (https=) 2023-07-13

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