JPWO2023132317A1 - - Google Patents

Info

Publication number
JPWO2023132317A1
JPWO2023132317A1 JP2023572465A JP2023572465A JPWO2023132317A1 JP WO2023132317 A1 JPWO2023132317 A1 JP WO2023132317A1 JP 2023572465 A JP2023572465 A JP 2023572465A JP 2023572465 A JP2023572465 A JP 2023572465A JP WO2023132317 A1 JPWO2023132317 A1 JP WO2023132317A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023572465A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023132317A1 publication Critical patent/JPWO2023132317A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2023572465A 2022-01-07 2022-12-28 Pending JPWO2023132317A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022001919 2022-01-07
PCT/JP2022/048510 WO2023132317A1 (ja) 2022-01-07 2022-12-28 硬化性樹脂組成物

Publications (1)

Publication Number Publication Date
JPWO2023132317A1 true JPWO2023132317A1 (https=) 2023-07-13

Family

ID=87073691

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023572465A Pending JPWO2023132317A1 (https=) 2022-01-07 2022-12-28

Country Status (5)

Country Link
JP (1) JPWO2023132317A1 (https=)
KR (1) KR20240128105A (https=)
CN (1) CN118715262A (https=)
TW (1) TW202342636A (https=)
WO (1) WO2023132317A1 (https=)

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000063634A (ja) * 1998-08-25 2000-02-29 Sumitomo Bakelite Co Ltd 一液型液状エポキシ樹脂組成物
JP2015007214A (ja) * 2013-05-27 2015-01-15 Dic株式会社 硬化性樹脂組成物、その硬化物および熱伝導性接着剤
JP2017071656A (ja) * 2014-02-04 2017-04-13 タツタ電線株式会社 スルーホール充填用ペースト組成物、及びそれらを用いたプリント配線板
JP2019038930A (ja) * 2017-08-24 2019-03-14 味の素株式会社 樹脂組成物
JP2019052278A (ja) * 2017-09-19 2019-04-04 三菱ケミカル株式会社 エポキシ樹脂、エポキシ樹脂組成物、硬化物、及び電気・電子回路用積層板
WO2019078044A1 (ja) * 2017-10-18 2019-04-25 株式会社スリーボンド 熱伝導性樹脂組成物、硬化物および放熱方法
WO2020080158A1 (ja) * 2018-10-17 2020-04-23 東洋紡株式会社 熱伝導性樹脂組成物
JP2021512199A (ja) * 2018-02-01 2021-05-13 ヘクセル コーポレイション 高温及び湿潤条件に耐える複合部品の製造に使用するプリプレグ
WO2021177089A1 (ja) * 2020-03-06 2021-09-10 東レ株式会社 エポキシ樹脂組成物、プリプレグおよび繊維強化複合材料
JP2021531389A (ja) * 2018-07-25 2021-11-18 ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング 高速硬化エポキシアクリル液体シム

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5238342B2 (ja) 2008-05-07 2013-07-17 太陽ホールディングス株式会社 プリント配線板の穴埋め用熱硬化性樹脂組成物及びそれを用いたプリント配線板

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000063634A (ja) * 1998-08-25 2000-02-29 Sumitomo Bakelite Co Ltd 一液型液状エポキシ樹脂組成物
JP2015007214A (ja) * 2013-05-27 2015-01-15 Dic株式会社 硬化性樹脂組成物、その硬化物および熱伝導性接着剤
JP2017071656A (ja) * 2014-02-04 2017-04-13 タツタ電線株式会社 スルーホール充填用ペースト組成物、及びそれらを用いたプリント配線板
JP2019038930A (ja) * 2017-08-24 2019-03-14 味の素株式会社 樹脂組成物
JP2019052278A (ja) * 2017-09-19 2019-04-04 三菱ケミカル株式会社 エポキシ樹脂、エポキシ樹脂組成物、硬化物、及び電気・電子回路用積層板
WO2019078044A1 (ja) * 2017-10-18 2019-04-25 株式会社スリーボンド 熱伝導性樹脂組成物、硬化物および放熱方法
JP2021512199A (ja) * 2018-02-01 2021-05-13 ヘクセル コーポレイション 高温及び湿潤条件に耐える複合部品の製造に使用するプリプレグ
JP2021531389A (ja) * 2018-07-25 2021-11-18 ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング 高速硬化エポキシアクリル液体シム
WO2020080158A1 (ja) * 2018-10-17 2020-04-23 東洋紡株式会社 熱伝導性樹脂組成物
WO2021177089A1 (ja) * 2020-03-06 2021-09-10 東レ株式会社 エポキシ樹脂組成物、プリプレグおよび繊維強化複合材料

Also Published As

Publication number Publication date
KR20240128105A (ko) 2024-08-23
TW202342636A (zh) 2023-11-01
WO2023132317A1 (ja) 2023-07-13
CN118715262A (zh) 2024-09-27

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