TW202342636A - 硬化性樹脂組成物 - Google Patents
硬化性樹脂組成物 Download PDFInfo
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- TW202342636A TW202342636A TW112100076A TW112100076A TW202342636A TW 202342636 A TW202342636 A TW 202342636A TW 112100076 A TW112100076 A TW 112100076A TW 112100076 A TW112100076 A TW 112100076A TW 202342636 A TW202342636 A TW 202342636A
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- epoxy resin
- resin composition
- curable resin
- epoxy resins
- functional group
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Classifications
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022001919 | 2022-01-07 | ||
| JP2022-001919 | 2022-01-07 |
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| TW202342636A true TW202342636A (zh) | 2023-11-01 |
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| TW112100076A TW202342636A (zh) | 2022-01-07 | 2023-01-03 | 硬化性樹脂組成物 |
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| JP (1) | JPWO2023132317A1 (https=) |
| KR (1) | KR20240128105A (https=) |
| CN (1) | CN118715262A (https=) |
| TW (1) | TW202342636A (https=) |
| WO (1) | WO2023132317A1 (https=) |
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| JP4097798B2 (ja) * | 1998-08-25 | 2008-06-11 | 住友ベークライト株式会社 | 一液型液状エポキシ樹脂組成物 |
| JP5238342B2 (ja) | 2008-05-07 | 2013-07-17 | 太陽ホールディングス株式会社 | プリント配線板の穴埋め用熱硬化性樹脂組成物及びそれを用いたプリント配線板 |
| JP5741742B2 (ja) * | 2013-05-27 | 2015-07-01 | Dic株式会社 | 硬化性樹脂組成物、その硬化物および熱伝導性接着剤 |
| JP2017071656A (ja) * | 2014-02-04 | 2017-04-13 | タツタ電線株式会社 | スルーホール充填用ペースト組成物、及びそれらを用いたプリント配線板 |
| US10577472B2 (en) * | 2018-02-01 | 2020-03-03 | Hexcel Corporation | Thermoplastic particle-toughened prepreg for use in making composite parts which tolerate hot and wet conditions |
| JP6787279B2 (ja) * | 2017-08-24 | 2020-11-18 | 味の素株式会社 | 樹脂組成物 |
| JP7069613B2 (ja) * | 2017-09-19 | 2022-05-18 | 三菱ケミカル株式会社 | エポキシ樹脂、エポキシ樹脂組成物、硬化物、及び電気・電子回路用積層板 |
| CN111247207B (zh) * | 2017-10-18 | 2022-11-08 | 三键有限公司 | 导热性树脂组合物、固化物以及散热方法 |
| CN112752816B (zh) * | 2018-07-25 | 2022-10-18 | 汉高股份有限及两合公司 | 快速固化的环氧丙烯酸类液体垫片 |
| US11767397B2 (en) * | 2018-10-17 | 2023-09-26 | Toyobo Co., Ltd. | Thermally conductive resin composition |
| CN115210318B (zh) * | 2020-03-06 | 2024-03-08 | 东丽株式会社 | 环氧树脂组合物、预浸料及纤维增强复合材料 |
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2022
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- 2022-12-28 KR KR1020247026645A patent/KR20240128105A/ko active Pending
- 2022-12-28 WO PCT/JP2022/048510 patent/WO2023132317A1/ja not_active Ceased
- 2022-12-28 JP JP2023572465A patent/JPWO2023132317A1/ja active Pending
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2023
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| Publication number | Publication date |
|---|---|
| KR20240128105A (ko) | 2024-08-23 |
| WO2023132317A1 (ja) | 2023-07-13 |
| CN118715262A (zh) | 2024-09-27 |
| JPWO2023132317A1 (https=) | 2023-07-13 |
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