KR20230165790A - 적층 경화성 수지 구조체, 드라이 필름, 경화물 및 전자 부품 - Google Patents

적층 경화성 수지 구조체, 드라이 필름, 경화물 및 전자 부품 Download PDF

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Publication number
KR20230165790A
KR20230165790A KR1020237035452A KR20237035452A KR20230165790A KR 20230165790 A KR20230165790 A KR 20230165790A KR 1020237035452 A KR1020237035452 A KR 1020237035452A KR 20237035452 A KR20237035452 A KR 20237035452A KR 20230165790 A KR20230165790 A KR 20230165790A
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KR
South Korea
Prior art keywords
layer
alkali
resin
soluble resin
curable resin
Prior art date
Application number
KR1020237035452A
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English (en)
Korean (ko)
Inventor
치호 우에타
다이스케 시바타
쇼타로 다네
사와코 시마다
후미타카 가토
Original Assignee
다이요 잉키 세이조 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 다이요 잉키 세이조 가부시키가이샤 filed Critical 다이요 잉키 세이조 가부시키가이샤
Publication of KR20230165790A publication Critical patent/KR20230165790A/ko

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
KR1020237035452A 2021-03-31 2022-03-31 적층 경화성 수지 구조체, 드라이 필름, 경화물 및 전자 부품 KR20230165790A (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2021062229 2021-03-31
JPJP-P-2021-062229 2021-03-31
JPJP-P-2021-062228 2021-03-31
JP2021062228 2021-03-31
PCT/JP2022/016967 WO2022211120A1 (ja) 2021-03-31 2022-03-31 積層硬化性樹脂構造体、ドライフィルム、硬化物および電子部品

Publications (1)

Publication Number Publication Date
KR20230165790A true KR20230165790A (ko) 2023-12-05

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KR1020237035452A KR20230165790A (ko) 2021-03-31 2022-03-31 적층 경화성 수지 구조체, 드라이 필름, 경화물 및 전자 부품

Country Status (2)

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KR (1) KR20230165790A (ja)
WO (1) WO2022211120A1 (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6210060B2 (ja) 2012-04-23 2017-10-11 日立化成株式会社 感光性樹脂組成物、感光性フィルム、永久マスクレジスト及び永久マスクレジストの製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008026397A1 (fr) * 2006-08-31 2008-03-06 Jsr Corporation Composition de résine isolante sensible aux radiations, article durci et dispositif électronique
CN105051094B (zh) * 2012-09-20 2017-01-18 积水化学工业株式会社 绝缘树脂膜、预固化物、叠层体及多层基板
JP6799462B2 (ja) * 2014-06-12 2020-12-16 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
JP2020166214A (ja) * 2019-03-29 2020-10-08 太陽インキ製造株式会社 感光性樹脂組成物、ドライフィルム、硬化物、および、電子部品

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6210060B2 (ja) 2012-04-23 2017-10-11 日立化成株式会社 感光性樹脂組成物、感光性フィルム、永久マスクレジスト及び永久マスクレジストの製造方法

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