KR20230150341A - 접착제 조성물, 접합체 및 접착제 조성물의 제조 방법 - Google Patents
접착제 조성물, 접합체 및 접착제 조성물의 제조 방법 Download PDFInfo
- Publication number
- KR20230150341A KR20230150341A KR1020237032852A KR20237032852A KR20230150341A KR 20230150341 A KR20230150341 A KR 20230150341A KR 1020237032852 A KR1020237032852 A KR 1020237032852A KR 20237032852 A KR20237032852 A KR 20237032852A KR 20230150341 A KR20230150341 A KR 20230150341A
- Authority
- KR
- South Korea
- Prior art keywords
- adhesive composition
- meth
- polymer particles
- composition according
- particles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F265/00—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00
- C08F265/04—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00 on to polymers of esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F285/00—Macromolecular compounds obtained by polymerising monomers on to preformed graft polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/12—Powdering or granulating
- C08J3/126—Polymer particles coated by polymer, e.g. core shell structures
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
- C08K5/3432—Six-membered rings
- C08K5/3435—Piperidines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L55/00—Compositions of homopolymers or copolymers, obtained by polymerisation reactions only involving carbon-to-carbon unsaturated bonds, not provided for in groups C08L23/00 - C08L53/00
- C08L55/02—ABS [Acrylonitrile-Butadiene-Styrene] polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
- C09J151/003—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to macromolecular compounds obtained by reactions only involving unsaturated carbon-to-carbon bonds
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021059627 | 2021-03-31 | ||
JPJP-P-2021-059627 | 2021-03-31 | ||
PCT/JP2022/013513 WO2022210166A1 (ja) | 2021-03-31 | 2022-03-23 | 接着剤組成物、接合体および接着剤組成物の製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20230150341A true KR20230150341A (ko) | 2023-10-30 |
Family
ID=83456753
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020237032852A Pending KR20230150341A (ko) | 2021-03-31 | 2022-03-23 | 접착제 조성물, 접합체 및 접착제 조성물의 제조 방법 |
Country Status (7)
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL8202281A (nl) * | 1982-06-04 | 1984-01-02 | Dow Chemical Nederland | Met rubber versterkte polymeren van aromatische monovinylideenverbindingen en werkwijze voor de bereiding daarvan. |
CA2044861C (en) * | 1990-07-05 | 2000-11-14 | Donald E. Gosiewski | Adhesive for low temperature applications |
WO2005028546A1 (ja) | 2003-09-18 | 2005-03-31 | Kaneka Corporation | ゴム状重合体粒子の製造方法およびこれを含有する樹脂組成物の製造方法 |
JP4707320B2 (ja) | 2003-12-22 | 2011-06-22 | 電気化学工業株式会社 | 二剤型アクリル系接着剤組成物とそれを用いた接合体 |
JPWO2007046190A1 (ja) * | 2005-10-18 | 2009-04-23 | 日立化成工業株式会社 | 接着剤組成物、回路接続材料、回路部材の接続構造及び半導体装置 |
AU2006326140B2 (en) * | 2005-12-15 | 2012-08-02 | Huntsman Advanced Materials Licensing (Switzerland) Gmbh | Multiphase acrylic adhesives |
EP2624338B1 (en) * | 2012-02-02 | 2014-11-05 | JSR Corporation | Electrode binder composition, electrode slurry, electrode, and electrical storage device |
JP6219058B2 (ja) * | 2013-04-08 | 2017-10-25 | アイカ工業株式会社 | 光硬化樹脂組成物 |
JP2016104834A (ja) | 2014-12-01 | 2016-06-09 | 株式会社カネカ | コアシェルポリマーにより改質された変性熱可塑性ウレタンエラストマー |
JP2016155892A (ja) * | 2015-02-23 | 2016-09-01 | スリーエム イノベイティブ プロパティズ カンパニー | 2液型接着剤 |
JP6684800B2 (ja) * | 2015-07-30 | 2020-04-22 | デンカ株式会社 | 組成物 |
WO2017170957A1 (ja) * | 2016-03-31 | 2017-10-05 | デンカ株式会社 | 組成物 |
WO2018173683A1 (ja) * | 2017-03-22 | 2018-09-27 | 住友ベークライト株式会社 | 離型フィルムおよびフレキシブルプリント回路基板の製造方法 |
FR3068979B1 (fr) * | 2017-07-12 | 2020-07-31 | Arkema France | Composition d'adhesif (meth)acrylique, son procede de preparation et son utilisation |
WO2020054705A1 (ja) * | 2018-09-11 | 2020-03-19 | 三菱エンジニアリングプラスチックス株式会社 | 金属膜付樹脂成形品及びその製造方法 |
US20220025232A1 (en) * | 2018-11-27 | 2022-01-27 | Emulsion Technology Co., Ltd. | Two-component adhesive |
JP7364880B2 (ja) | 2019-10-03 | 2023-10-19 | 横浜ゴム株式会社 | スチールコード接着用ゴム組成物及びコンベヤベルト |
-
2022
- 2022-03-23 CN CN202280007060.9A patent/CN116348511A/zh active Pending
- 2022-03-23 US US18/284,506 patent/US20240174893A1/en active Pending
- 2022-03-23 JP JP2023511059A patent/JPWO2022210166A1/ja active Pending
- 2022-03-23 KR KR1020237032852A patent/KR20230150341A/ko active Pending
- 2022-03-23 WO PCT/JP2022/013513 patent/WO2022210166A1/ja active Application Filing
- 2022-03-23 EP EP22780381.4A patent/EP4310118A4/en active Pending
- 2022-03-28 TW TW111111531A patent/TWI870654B/zh active
- 2022-03-28 TW TW113147805A patent/TW202513738A/zh unknown
-
2024
- 2024-01-10 JP JP2024001671A patent/JP2024032758A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
US20240174893A1 (en) | 2024-05-30 |
JP2024032758A (ja) | 2024-03-12 |
WO2022210166A1 (ja) | 2022-10-06 |
CN116348511A (zh) | 2023-06-27 |
JPWO2022210166A1 (enrdf_load_stackoverflow) | 2022-10-06 |
TW202513738A (zh) | 2025-04-01 |
TWI870654B (zh) | 2025-01-21 |
EP4310118A4 (en) | 2024-07-31 |
TW202246436A (zh) | 2022-12-01 |
EP4310118A1 (en) | 2024-01-24 |
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P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
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P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
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PA0105 | International application |
St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
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PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
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St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
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PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
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E902 | Notification of reason for refusal | ||
PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
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E13-X000 | Pre-grant limitation requested |
St.27 status event code: A-2-3-E10-E13-lim-X000 |
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P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |