KR20230124543A - 금속 부재 - Google Patents

금속 부재 Download PDF

Info

Publication number
KR20230124543A
KR20230124543A KR1020237011727A KR20237011727A KR20230124543A KR 20230124543 A KR20230124543 A KR 20230124543A KR 1020237011727 A KR1020237011727 A KR 1020237011727A KR 20237011727 A KR20237011727 A KR 20237011727A KR 20230124543 A KR20230124543 A KR 20230124543A
Authority
KR
South Korea
Prior art keywords
copper
metal member
layer
less
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020237011727A
Other languages
English (en)
Korean (ko)
Inventor
마키코 사토
Original Assignee
나믹스 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 나믹스 가부시끼가이샤 filed Critical 나믹스 가부시끼가이샤
Publication of KR20230124543A publication Critical patent/KR20230124543A/ko
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacture Of Alloys Or Alloy Compounds (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
KR1020237011727A 2020-12-25 2021-12-21 금속 부재 Pending KR20230124543A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2020-218001 2020-12-25
JP2020218001 2020-12-25
PCT/JP2021/047438 WO2022138681A1 (ja) 2020-12-25 2021-12-21 金属部材

Publications (1)

Publication Number Publication Date
KR20230124543A true KR20230124543A (ko) 2023-08-25

Family

ID=82159783

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020237011727A Pending KR20230124543A (ko) 2020-12-25 2021-12-21 금속 부재

Country Status (4)

Country Link
JP (1) JPWO2022138681A1 (https=)
KR (1) KR20230124543A (https=)
TW (1) TW202316919A (https=)
WO (1) WO2022138681A1 (https=)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54108274A (en) * 1978-02-15 1979-08-24 Shindo Denshi Kougiyou Kk Method of producing printed circuit board
JPS6435985A (en) * 1987-07-30 1989-02-07 Mitsubishi Electric Corp Manufacture of printed board
JP2015060947A (ja) * 2013-09-19 2015-03-30 イビデン株式会社 金属ポストを有するプリント配線板及び金属ポストを有するプリント配線板の製造方法
JP2016066705A (ja) * 2014-09-25 2016-04-28 イビデン株式会社 プリント配線板およびその製造方法
JP6342794B2 (ja) * 2014-12-25 2018-06-13 新光電気工業株式会社 配線基板及び配線基板の製造方法
US20200091050A1 (en) * 2016-12-19 2020-03-19 Tatsuta Electric Wire & Cable Co., Ltd. Package Substrate and Method for Manufacturing Package Substrate

Also Published As

Publication number Publication date
JPWO2022138681A1 (https=) 2022-06-30
WO2022138681A1 (ja) 2022-06-30
TW202316919A (zh) 2023-04-16

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